Cypress Semiconductor Corp CY7C2268XV18-600BZXC

Overview

CY7C2268XV18-600BZXC from Infineon Technologies (formerly Cypress) is a 36-Mbit DDR II+ Xtreme SRAM with 2M × 18 organization, 600 MHz clock operation, 2.5-cycle read latency (DOFF = HIGH), and on-die termination (ODT) for DQ/BWS/K/K inputs. It delivers 1200 MT/s data throughput via double-data-rate interface and targets high-bandwidth buffering in network packet processors and telecom line cards.

For engineers reviewing the CY7C2268XV18-600BZXC datasheet, CY7C2268XV18-600BZXC pinout, CY7C2268XV18-600BZXC application, or CY7C2268XV18-600BZXC equivalent, this page provides verified package mapping, validated pin functions, confirmed ODT behavior, echo clock timing alignment, and real-world burst-mode integration requirements for DDR II+ synchronous SRAM systems.

Technical Context

This SRAM implements a synchronous pipelined architecture with two-word burst transfers initiated on alternate rising edges of K and K clocks. All address, control, and data signals are registered synchronously to K (for LD, R/W, A) or both K/K (for DQ, BWS), enabling precise DDR timing without external phase alignment circuitry.

The device integrates a PLL for accurate data placement relative to echo clocks CQ/CQ, supports HSTL I/O with variable drive strength, and uses ZQ calibration to set output impedance to 0.2 × RQ. ODT is dynamically enabled only during write cycles and disabled during reads - a key distinction from static termination schemes.

Key Specifications

Pinout & Package

Package: 165-ball FBGA (13 mm × 15 mm × 1.4 mm), Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with CY7C2268XV18-600BZXC, the -633BZXC variant offers +5.5% bandwidth at the cost of stricter signal integrity requirements, while the AS7C336200B-15JIN trades DDR efficiency and integration for simpler interface design and lower clocking complexity - making it viable only in non-burst, non-termination-sensitive applications.

Availability

CY7C2268XV18-600BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and high-speed test equipment requiring stable component supply and long-term industrial availability.

Supply support for CY7C2268XV18-600BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for the former Cypress SRAM portfolio including DDR II+ Xtreme devices.

This part belongs to the DDR II+ Xtreme SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in networking, telecom, and test instrumentation where DDR timing precision, on-die termination, and echo-clock synchronization are critical.

FAQ

What is the function of the DOFF pin on CY7C2268XV18-600BZXC?

The DOFF (Disable Off) pin selects read latency mode: when asserted HIGH, the device operates in DDR II+ mode with 2.5-cycle latency; when LOW, it reverts to DDR I mode with 1-cycle latency. This pin is sampled at power-up and remains latched until reset, enabling hardware-selectable timing behavior without firmware intervention.

How does on-die termination (ODT) work on this SRAM?

ODT is enabled only during write operations on DQ[17:0], BWS[1:0], and K/K inputs. Its resistance value is selected at power-up via the ODT pin and calibrated using the ZQ pin's external resistor. ODT automatically disables during reads, eliminating signal integrity conflicts between driving and receiving states on shared buses.

Can CQ and CQ be used as system clock sources?

No - CQ and CQ are echo clocks derived from K/K and intended solely for data capture synchronization. They are not buffered or designed for fan-out; using them as system clocks risks jitter accumulation and violates timing specifications. External clock buffers must be used for distribution.

Is the 165-ball FBGA package compatible with standard reflow profiles?

Yes - the CY7C2268XV18-600BZXC uses a Pb-free, RoHS-compliant 165-ball FBGA (13 × 15 × 1.4 mm) qualified for JEDEC J-STD-020D moisture sensitivity level 3. Standard lead-free reflow profiles with peak temperature ≤260°C and time above liquidus 60–150 seconds are fully supported.