Cypress Semiconductor Corp CY7C2268XV18-633BZXC

Overview

CY7C2268XV18-633BZXC from Infineon Technologies (formerly Cypress) is a 36-Mbit DDR II+ Xtreme SRAM with 2M × 18 organization, 633 MHz clock frequency, 2.5-cycle read latency (DOFF = HIGH), on-die termination (ODT), and HSTL I/O interface. It delivers 1266 MT/s data throughput via double-data-rate operation and targets high-bandwidth buffering in networking line cards and packet-switching ASIC interfaces.

For engineers reviewing the CY7C2268XV18-633BZXC datasheet, CY7C2268XV18-633BZXC pinout, CY7C2268XV18-633BZXC application, or CY7C2268XV18-633BZXC equivalent, key selection criteria include DDR II+ burst timing compliance, ODT configuration for DQ/BWS/K/K inputs, echo clock (CQ/CQ) synchronization, QVLD validity signaling, and 165-ball FBGA mechanical compatibility with high-speed PCB layout constraints.

Technical Context

This SRAM implements a synchronous pipelined architecture with dual-edge-aligned DDR interface: address and control signals (A, R/W, LD, BWS) are latched on rising edges of K only, while write data is registered on both K and K rising edges, and read data is driven on both K and K rising edges. The device uses internal PLL for precise data placement relative to echo clocks.

It supports two operational modes via DOFF pin: 2.5-cycle latency DDR II+ mode (DOFF = HIGH) for optimized bandwidth in burst-intensive systems, and 1-cycle latency DDR I-compatible mode (DOFF = LOW). ODT is enabled only during write cycles and configurable via ODT pin and external ZQ resistor for DQ, BWS, and K/K inputs.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Compared with CY7C2270XV18-633BZXC, this part offers narrower 18-bit bus and lower pin count for space-constrained layouts; versus IS61WV102418BLL-10BLI, it delivers 126× higher effective bandwidth but requires strict DDR timing design and echo-clock capture infrastructure.

Availability

CY7C2268XV18-633BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, high-speed test equipment memory, and radar signal processing buffer applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C2268XV18-633BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for the former Cypress SRAM portfolio including DDR II+ Xtreme devices.

This part belongs to the DDR II+ Xtreme SRAM product line, engineered specifically for deterministic, high-bandwidth burst buffering in networking, telecom, and test instrumentation systems operating above 600 MHz.

FAQ

What is the function of the DOFF pin on CY7C2268XV18-633BZXC?

The DOFF (Disable Off) pin selects between two operational modes: when asserted HIGH, the device operates in DDR II+ mode with 2.5-cycle read latency and full burst optimization; when LOW, it reverts to DDR I-compatible mode with 1-cycle latency. This pin is sampled at power-up and remains latched until reset - it does not support dynamic mode switching during operation.

How is on-die termination (ODT) configured and enabled?

ODT is enabled only during write operations and disabled during reads. Configuration requires connecting ZQ to a precision resistor (175–350 Ω) to ground and setting the ODT pin to HIGH (for RQ/1.66 range) or LOW (for RQ/3.33 range). The selected range determines termination resistance for DQ[17:0], BWS[1:0], K, and K inputs - no external resistors are needed.

Can CQ and CQ be used as system clock sources?

No - CQ and CQ are echo clocks derived from K/K and intended solely for data capture timing. They are free-running, phase-locked to K/K, and lack jitter specifications or drive capability for distribution as system clocks. Their sole purpose is to provide edge-aligned timing references for sampling DQ[17:0] outputs without board-level skew compensation.

What is the role of the LD (Load) signal in burst operation?

LD is a synchronous strobe sampled on the rising edge of K that initiates each two-word burst transaction. When LD goes LOW, the current address and R/W state are latched, triggering internal address decode and pipeline sequencing. It must meet specified setup/hold times relative to K - unlike asynchronous CE, LD defines the precise start point of every burst, enabling deterministic timing in pipelined controllers.