Cypress Semiconductor Corp CY7C2270XV18-600BZXC

Overview

CY7C2270XV18 from Infineon Technologies (formerly Cypress) is a 36-Mbit synchronous pipelined DDR II+ Xtreme SRAM configured as 1M × 36, operating at up to 600 MHz clock frequency with 2.5-cycle read latency when DOFF is HIGH, featuring on-die termination (ODT), echo clocks (CQ/CQ), and QVLD data-valid indicator - deployed in high-bandwidth networking line cards and packet buffering subsystems.

For engineers reviewing the CY7C2270XV18 datasheet, CY7C2270XV18 pinout, CY7C2270XV18 application, or CY7C2270XV18 equivalent, key selection criteria include its 1M × 36 organization, 1.8 V core / 1.4–1.6 V I/O supply compatibility, HSTL I/O interface, 165-ball FBGA package, and dual-clock DDR timing architecture supporting precise data capture in burst-oriented memory systems.

Technical Context

This SRAM implements a two-word burst architecture with synchronous pipelined addressing: addresses are latched on alternate rising edges of K/K, while write data is registered on both K and K rising edges. Read data is driven on both K and K rising edges, delivering 36-bit words per burst cycle.

The device integrates a PLL for accurate data placement, supports programmable ODT for DQ/BWS/K/K inputs, and uses ZQ calibration to tune output impedance to system bus requirements. Echo clocks CQ/CQ are free-running and edge-aligned with K/K, enabling deterministic data capture without external strobes.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with CY7C2270XV18, CY7C2268XV18 offers identical timing and features but narrower 18-bit interface and higher depth - ideal for bus-constrained designs; AS7C33600B-15JIN lacks DDR, ODT, and echo clocks entirely, making it incompatible for high-speed burst applications despite matching density.

Availability

CY7C2270XV18 is available at Aetrix Electronics and suitable for high-bandwidth packet buffering, telecom line card memory subsystems, and industrial real-time controller cache applications requiring stable component supply and long-term lifecycle support.

Supply support for CY7C2270XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the full portfolio of high-performance memory and interface products originally developed by Cypress.

CY7C2270XV18 belongs to the DDR II+ Xtreme SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory interfacing in networking, test equipment, and real-time embedded systems.

FAQ

What is the function of the DOFF pin on CY7C2270XV18?

The DOFF (Double-Off) pin configures read latency mode: when asserted HIGH, the device operates in DDR II+ mode with 2.5-cycle read latency; when LOW, it reverts to DDR I mode with 1-cycle latency. This pin is sampled at power-up and remains static during operation - it is not dynamically switchable mid-operation.

Can CY7C2270XV18 be used without external termination resistors?

Yes - its on-die termination (ODT) supports DQ[35:0], BWS[3:0], and K/K inputs. When enabled via ODT pin and calibrated via ZQ, it replaces up to 44 external 50 Ω resistors. ODT is automatically disabled during read cycles and active only during writes, minimizing power consumption.

How does the QVLD signal improve system timing margin?

QVLD is edge-aligned with CQ and CQ echo clocks and asserts precisely during the valid window of Q[35:0] output data. This eliminates setup/hold uncertainty in FPGA or ASIC capture logic, allowing designers to use simple register-based sampling instead of complex dynamic phase alignment circuits.

Is CY7C2270XV18 pin-compatible with CY7C2268XV18?

No - although both use the same 165-ball FBGA package and share most signal names, CY7C2270XV18 has BWS[3:0] and DQ[35:0], while CY7C2268XV18 uses BWS[1:0] and DQ[17:0]. Pin assignments differ in rows C, D, E, F, G, J, K, L, M, N, and P; direct replacement requires PCB redesign.