Cypress Semiconductor Corp CY7C25422KV18-333BZXC

Overview

CY7C25422KV18-333BZXC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with separate read/write ports, 333 MHz clock frequency, 2.0-cycle read latency (DOFF = HIGH), on-die termination (ODT) for D[17:0]/BWS[1:0]/K/K inputs, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers 666 MT/s DDR data rates on both ports and supports depth expansion via RPS/WPS in high-bandwidth networking line cards.

For engineers reviewing the CY7C25422KV18-333BZXC datasheet, CY7C25422KV18-333BZXC pinout, CY7C25422KV18-333BZXC application, or CY7C25422KV18-333BZXC equivalent, key selection criteria include burst-2 QDR II+ timing compliance, HSTL I/O compatibility, ODT impedance configuration via ZQ/ODT pins, and PLL-enabled 2-cycle vs. DOFF-disabled 1-cycle latency modes.

Technical Context

The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 21-bit address bus. Read and write operations are initiated on rising edges of complementary K/K clocks, with echo clocks CQ/CQ aligned to simplify high-speed data capture.

It uses a Phase-Locked Loop (PLL) for precise data placement and supports two latency modes: 2.0-cycle read latency with DOFF = HIGH (QDR II+ mode) and 1-cycle read latency with DOFF = LOW (QDR I mode). Core VDD = 1.8 V ± 0.1 V and VDDQ = 1.4 V to 1.8 V enable dual-voltage operation with HSTL I/O buffers.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102418BLL-15BLI, CY7C25422KV18-333BZXC uniquely delivers 72-Mbit density, 333 MHz DDR throughput, integrated ODT, and echo-clock–assisted timing - making it the only viable option for new designs requiring QDR II+–compliant, high-concurrency packet buffering.

Availability

CY7C25422KV18-333BZXC is available at Aetrix Electronics and suitable for high-speed network line cards, telecom baseband units, packet-switching ASICs, and ultra-low-latency trading hardware requiring stable component supply and long-term obsolescence management.

Supply support for CY7C25422KV18-333BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with emphasis on signal integrity and system-level integration.

This device belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, high-throughput data buffering in packet-processing and DSP-intensive systems where concurrent read/write and precise timing are mandatory.

FAQ

What is the function of the DOFF pin?

The DOFF pin controls the internal PLL: when pulled HIGH, the device operates in QDR II+ mode with 2.0-cycle read latency and up to 333 MHz clock frequency; when pulled LOW, the PLL is disabled and the device reverts to QDR I mode with 1-cycle latency and maximum 167 MHz operation. This provides backward compatibility and flexibility in timing-critical designs.

How does On-Die Termination (ODT) work on this SRAM?

ODT applies programmable termination resistance to D[17:0], BWS[1:0], and K/K inputs using an external ZQ resistor. ODT pin state selects the range: LOW sets RQ/3.33 (175–350 Ω), HIGH sets RQ/1.66 (175–250 Ω). This eliminates discrete termination resistors, reduces board area, and improves signal integrity at 666 MT/s without altering layout routing.

Can CY7C25422KV18-333BZXC be used with 1.5 V VDDQ?

Yes - the device supports VDDQ from 1.4 V to VDD (1.8 V), explicitly including 1.5 V operation. HSTL I/O buffers are designed for this range, and DC/AC electrical characteristics in the datasheet (Rev. *D, p.19–20) are validated across 1.4–1.8 V, ensuring reliable signaling with 1.5 V FPGA I/O banks.

What is the role of CQ and CQ echo clocks?

CQ and CQ are free-running, source-synchronous output clocks aligned to K and K, respectively. They provide timing references for external receivers (e.g., FPGA input registers) to capture Q[17:0] data without requiring complex deskew circuitry. Their phase relationship to K/K is guaranteed per AC switching specs (p.22), enabling robust >500 MHz data capture.