Cypress Semiconductor Corp CY7C25442KV18-300BZI

Overview

CY7C25442KV18-300BZI from Infineon Technologies (formerly Cypress) is a 72-Mbit QDR® II+ SRAM with separate read/write ports, 333 MHz operation, 2.0-cycle read latency, on-die termination (ODT), and 165-ball FBGA (13 × 15 × 1.4 mm) packaging. It delivers 666 MT/s DDR data transfer on both ports and supports 1.8 V core / 1.4–1.8 V I/O supply for high-bandwidth networking buffer applications.

For engineers reviewing the CY7C25442KV18-300BZI datasheet, CY7C25442KV18-300BZI pinout, CY7C25442KV18-300BZI application, or CY7C25442KV18-300BZI equivalent, key selection criteria include dual-port concurrency, ODT configuration via ODT/ZQ pins, DOFF-controlled latency mode (1-cycle vs. 2-cycle), and HSTL-compatible 36-bit × 2-word burst interface timing.

Technical Context

The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 20-bit address bus. Each port uses rising-edge-triggered K/K clocks and echo clocks (CQ/CQ) for precise DDR capture, with all inputs and outputs registered to K or K edges.

It features a PLL for accurate data placement, JTAG 1149.1 test access, and programmable ODT ranges (175–350 Ω low range; 175–250 Ω high range) selected by the ODT pin at power-up. The DOFF pin configures read latency: HIGH enables QDR II+ 2.0-cycle mode; LOW reverts to QDR I 1-cycle mode.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II+ SRAM applications.

Compared with AS7C362000B-333BIN and MT47H64M16HR-37E:H, CY7C25442KV18-300BZI uniquely combines deterministic 2-cycle latency, integrated ODT, and echo-clock–assisted timing closure - making it optimal for FPGA-ASIC co-designs demanding zero-bus-turnaround concurrency and sub-nanosecond timing margin.

Availability

CY7C25442KV18-300BZI is available at Aetrix Electronics and suitable for high-speed network buffering, packet processing engine cache, FPGA-based protocol acceleration, and telecom baseband processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C25442KV18-300BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the full QDR® II+ SRAM portfolio, including legacy Cypress designs like the CY7C25442KV18 series.

This device belongs to Infineon's high-performance synchronous SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking, telecom, and FPGA-accelerated computing.

FAQ

What is the function of the DOFF pin on CY7C25442KV18-300BZI?

The DOFF (Disable Off) pin configures the device's read latency mode. When asserted HIGH, it enables QDR II+ operation with 2.0-cycle read latency. When pulled LOW or tied to VSS, it reverts to QDR I mode with 1.0-cycle latency. This pin is sampled at power-up and remains latched until reset, allowing system-level latency tuning without firmware changes.

How does on-die termination (ODT) work on this SRAM, and what external components are needed?

ODT is enabled via the ODT pin and calibrated using an external precision resistor (175–350 Ω) connected to the ZQ pin. It applies matched termination to D[35:0], BWS[3:0], and K/K inputs, eliminating the need for 44 discrete 50 Ω resistors. No pull-ups/downs or series resistors are required on those lines - only the ZQ resistor and proper VDDQ decoupling.

Can CY7C25442KV18-300BZI operate with VDDQ = 1.5 V while VDD = 1.8 V?

Yes. The datasheet explicitly states VDDQ supports 1.4 V to VDD, and the device is qualified for 1.5 V VDDQ with 1.8 V VDD. This allows interoperability with 1.5 V FPGA I/O banks while maintaining 1.8 V core logic stability, reducing I/O power and easing voltage rail design in mixed-supply systems.

What is the purpose of the CQ and CQ echo clocks, and how are they used in system design?

CQ and CQ are free-running, K-synchronized output clocks that mirror the phase and duty cycle of K and K. They are used by the receiving controller (e.g., FPGA) to sample Q[35:0] data with minimal skew - eliminating the need for complex delay-chain calibration. In practice, CQ clocks the even-numbered data words and CQ clocks the odd-numbered words within each two-word burst.