Cypress Semiconductor Corp CY7C25632KV18-400BZC
- Part No.:
- CY7C25632KV18-400BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C25632KV18 from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 4M × 18 organization, 2.5-cycle read latency, 400 MHz maximum operating frequency, and on-die termination (ODT) for D[17:0], BWS[1:0], and K/K inputs. It features separate read/write ports, DDR interfaces on both ports (2.2 Gbps effective data rate), and operates at 1.8 V core / 1.4–1.8 V I/O supply - deployed in high-speed packet buffering for network switches and routers.
For engineers reviewing the CY7C25632KV18 datasheet, CY7C25632KV18 pinout, CY7C25632KV18 application, or CY7C25632KV18 equivalent, key selection criteria include burst depth (four-word), echo clock support (CQ/CQ), QVLD timing alignment, ODT configuration via ZQ/ODT pins, and FBGA-165 package compatibility with high-density PCB routing constraints.
Technical Context
The CY7C25632KV18 implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 20-bit address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling concurrent access without bus turnaround.
It uses HSTL Class I inputs and variable-drive HSTL outputs, supports JTAG 1149.1 boundary scan, and integrates a PLL to align output data with echo clocks (CQ/CQ). The DOFF pin selects between 2.5-cycle (HIGH) and 1-cycle (LOW) read latency modes, preserving backward compatibility with QDR I systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18) |
| Max Clock Frequency | 400 MHz - sets 800 MT/s DDR interface bandwidth per port |
| Read Latency | 2.5 cycles (DOFF = HIGH) - enables precise timing closure in high-speed SerDes subsystems |
| Core Supply | 1.8 V ± 0.1 V - requires low-noise LDO regulation for stable SRAM operation |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with 1.5 V and 1.8 V logic families |
| On-Die Termination | Configurable for D[17:0], BWS[1:0], K/K - eliminates 36 external 50 Ω resistors |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - 0.8 mm ball pitch, RoHS-compliant |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data inputs | Latched on rising edges of K/K; drive 18-bit parallel writes into memory array |
| Q[17:0] | Synchronous read data outputs | Drive bursted 4×18-bit words aligned to CQ/CQ edges; tri-stated when RPS deasserted |
| RPS / WPS | Read/Write port select (active LOW) | Enables independent port activation; allows concurrent read+write on same clock cycle |
| BWS[1:0] | Byte write select (active LOW) | BWS0 controls D[8:0]; BWS1 controls D[17:9] - enables partial-word writes without read-modify-write |
| K / K | Differential input clocks | Rising edges sample all synchronous inputs; K drives write-side timing, K drives read-side timing |
| CQ / CQ | Free-running echo clocks | Phase-aligned copies of K/K; simplify capture of Q[17:0] in FPGA/ASIC receivers |
| QVLD | Valid data indicator | Asserted edge-aligned with CQ/CQ; signals first valid word of 4-word burst |
| ODT / ZQ | On-die termination control | ODT selects termination range; ZQ connects to external resistor (175–350 Ω) to calibrate output impedance |
Key Features
| Feature | Design Value |
|---|---|
| Four-word burst architecture | Reduces address bus toggling by 75% vs. single-word access - lowers EMI and routing congestion |
| Separate read/write data paths | Eliminates bidirectional bus turnaround delay - enables true concurrent read+write at full bandwidth |
| Programmable 2.5-cycle latency | DOFF pin configures latency mode - maintains compatibility with legacy QDR I designs while enabling higher throughput |
| HSTL Class I I/O with variable drive | Ensures signal integrity at 1100 MT/s; drive strength adjustable via register to match trace impedance |
| JTAG 1149.1 boundary scan | Supports IEEE-compliant test access for production ICT and board-level diagnostics |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in 10/25/100 GbE switch fabric ASICs. IC Role / Device Role / Timing Role: Dedicated QDR II+ SRAM acting as line-rate buffer with deterministic 2.5-cycle read latency and concurrent write capability. Use Value: Enables zero-drop forwarding at 400 MHz clock - sustains 1.44 GB/s aggregate bandwidth (720 MB/s read + 720 MB/s write). | Use Scenario: Capturing real-time waveform samples in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: High-bandwidth memory staging buffer synchronized to system clock and echo clocks (CQ/CQ) for precise sampling alignment. Use Value: Eliminates setup/hold violations at 1100 MT/s DDR rates - reduces jitter-induced bit errors in sampled data streams. |
| Telecom Baseband Processing | FPGA-Based Protocol Acceleration |
Use Scenario: Temporary storage of OFDM symbol buffers and channel estimation data in LTE/5G baseband processors. IC Role / Device Role / Timing Role: Low-latency, dual-port SRAM interfacing directly with FPGA fabric for real-time FFT/IFFT pipeline staging. Use Value: Supports 4-word burst reads aligned to CQ edge - matches symbol processing timing windows without stall cycles. | Use Scenario: Offloading TCP/IP or encryption engine state tables in FPGA-accelerated server NICs. IC Role / Device Role / Timing Role: Deterministic-access memory mapped to AXI4 or similar interconnect, leveraging RPS/WPS for independent port arbitration. Use Value: Enables simultaneous packet header lookup (read port) and payload update (write port) - improves throughput by >35% vs. single-port SRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-Mbit (2M × 18), 10 ns async access; no DDR, no ODT, no echo clocks | Used in legacy telecom control planes where latency tolerance >10 ns permits simpler timing | Select only if system lacks DDR clock infrastructure and requires asynchronous interface simplicity |
| ISSI IS61WV102418BLL-10BLI | 18-Mbit (512K × 36), 10 ns async access; single-port, no burst, no ODT | Deployed in cost-sensitive industrial controllers needing basic FIFO buffering | Choose only for non-concurrent, low-bandwidth applications where QDR II+ features are unnecessary |
Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, the CY7C25632KV18 delivers 4× memory density, deterministic 2.5-cycle latency, and integrated ODT - making it uniquely suited for new designs requiring sustained 1.44 GB/s bidirectional bandwidth with minimal PCB routing overhead.
Availability
CY7C25632KV18 is available at Aetrix Electronics and suitable for network switching, high-speed test instrumentation, telecom baseband processing, and FPGA-based protocol acceleration requiring stable component supply across multi-year production cycles.
Supply support for CY7C25632KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The QDR® II+ SRAM product line was designed specifically for bandwidth-constrained, low-latency applications in networking infrastructure - delivering deterministic timing, concurrent access, and signal integrity features essential for 10G+ packet processing.
FAQ
What is the function of the DOFF pin on CY7C25632KV18?
The DOFF (Delay OFF) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle read latency for QDR II+ operation; when LOW, it reverts to 1-cycle latency compatible with QDR I timing. This pin is sampled at power-up and remains static during operation - no dynamic switching is supported.
How does on-die termination (ODT) work on CY7C25632KV18?
ODT provides programmable input termination for D[17:0], BWS[1:0], and K/K pins using an external ZQ resistor (175–350 Ω to ground). The ODT pin selects termination range: LOW selects RQ/3.33 (~53–105 Ω); HIGH selects RQ/1.66 (~105–210 Ω). Default is HIGH if left floating.
Can CY7C25632KV18 operate with only one clock input?
No. The device requires both K and K differential clock inputs for proper DDR timing - K controls write-side sampling and K controls read-side sampling. Both clocks must be present and phase-aligned; omitting either disables functional operation per the AC timing specifications.
What is the purpose of the QVLD signal?
QVLD (Queue Valid) is an output that asserts synchronously with the first valid word of the four-word burst on Q[17:0]. It is edge-aligned with CQ and CQ, providing unambiguous timing reference for capturing burst data in receiving logic - eliminating need for fixed delay calibration in high-speed receivers.
CY7C25632KV18-400BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 450 ps
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C25632KV18-400BZC FAQ
1.How can I place an order for CY7C25632KV18-400BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C25632KV18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C25632KV18-400BZC reliable?
The price and inventory of CY7C25632KV18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C25632KV18-400BZC is usually 5 days.
3.What payment methods are accepted for CY7C25632KV18-400BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C25632KV18-400BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C25632KV18-400BZC?
CY7C25632KV18-400BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C25632KV18-400BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C25632KV18-400BZC?
For technical support, including CY7C25632KV18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C25632KV18-400BZC requirements.
6.How does Aetrix verify that CY7C25632KV18-400BZC is sourced from the original manufacturer or authorized distributors?
All CY7C25632KV18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C25632KV18-400BZC meets industry standards.
7.What is the process for return or replacement of CY7C25632KV18-400BZC?
All CY7C25632KV18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C25632KV18-400BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C25632KV18-400BZC part is unused and in its original packaging.
Return procedure for CY7C25632KV18-400BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C25632KV18-400BZC Tags

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