Cypress Semiconductor Corp CY7C25632KV18-500BZXI
- Part No.:
- CY7C25632KV18-500BZXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C25632KV18-500BZXI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:545
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Product details
Overview
CY7C25632KV18 from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 4M × 18 organization, 550 MHz clock frequency, 2.5-cycle read latency, and on-die termination (ODT) for D[17:0], BWS[1:0], and K/K inputs. It features separate read/write ports, DDR interfaces on both ports (1100 MT/s effective data rate), and operates at core VDD = 1.8 V ± 0.1 V with I/O VDDQ = 1.4–1.8 V. Used in high-speed networking line cards for packet buffering and header lookup.
For engineers reviewing the CY7C25632KV18 datasheet, CY7C25632KV18 pinout, CY7C25632KV18 application, or CY7C25632KV18 equivalent, key selection criteria include burst depth (four-word), echo clock support (CQ/CQ), QVLD timing alignment, HSTL-compatible I/O drive, and FBGA-165 package compatibility with high-density PCB routing constraints.
Technical Context
The CY7C25632KV18 implements a synchronous pipelined QDR II+ architecture with independent read and write ports sharing a multiplexed 20-bit address bus. Address latching occurs on alternate rising edges of K and K clocks, enabling concurrent access without bus turnaround.
It integrates a PLL for precise data placement, supports DOFF-driven latency selection (2.5-cycle when HIGH, 1-cycle when LOW), and uses echo clocks CQ/CQ to simplify high-speed data capture. ODT is configurable via ZQ resistor and ODT pin for input termination matching across D[17:0], BWS[1:0], and K/K.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18) |
| Max Clock Frequency | 550 MHz - enables 1100 MT/s DDR bandwidth per port |
| Read Latency | 2.5 cycles (DOFF = HIGH) - deterministic timing for pipeline scheduling |
| VDD / VDDQ | Core: 1.8 V ± 0.1 V; I/O: 1.4–1.8 V - supports dual-voltage system integration |
| Burst Length | Four-word - reduces address bus toggling and simplifies controller logic |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory |
| Termination | On-die termination for D[17:0], BWS[1:0], K/K - eliminates external resistors and saves board area |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data inputs | Latched on rising edges of K/K; support byte-write via BWS0/BWS1 |
| Q[17:0] | Synchronous read data outputs | DDR-aligned to K/K; tri-stated when RPS deasserted |
| RPS / WPS | Active-low port select controls | Enable independent read/write port activation; critical for concurrent transaction arbitration |
| K / K | Differential clock inputs | Rising edges sample all synchronous inputs; define DDR timing reference |
| CQ / CQ | Free-running echo clocks | Edge-aligned with Q[17:0] outputs; simplify high-speed data capture in FPGA/ASIC receivers |
| QVLD | Valid data indicator output | Asserted synchronously with CQ/CQ; signals valid Q[17:0] data for receiver sampling |
| ODT | On-die termination control | Selects termination resistance range (RQ/3.33 or RQ/1.66) for impedance-matched signal integrity |
| ZQ | Impedance calibration reference | Connects to external resistor to ground; sets output driver and ODT impedance to 0.2 × RQ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables true concurrent read and write operations without bus contention or turnaround delay |
| Four-word burst architecture | Reduces address bus frequency by 4× versus single-word access, easing controller timing closure |
| 2.5-cycle read latency (DOFF = HIGH) | Provides predictable, low-latency response for real-time packet processing pipelines |
| HSTL-compatible I/O buffers | Ensures signal integrity at 550 MHz clock with variable drive strength and 1.4–1.8 V VDDQ support |
| JTAG 1149.1 test access port | Enables boundary-scan testing and in-system programming without additional debug hardware |
Applications
| High-Speed Network Switching | Telecom Line Card Buffering |
|---|---|
Use Scenario: Storing and forwarding Ethernet frames in 10G/40G switch fabric ASICs with strict latency budgets. IC Role / Device Role / Timing Role: Dedicated packet buffer SRAM providing concurrent ingress/egress access with sub-5 ns read latency. Use Value: Eliminates bus turnaround overhead, enabling full-duplex 1100 MT/s throughput per port for non-blocking switching. | Use Scenario: Temporary storage of voice-over-IP (VoIP) payload packets during jitter compensation in carrier-grade DSLAMs. IC Role / Device Role / Timing Role: Low-latency, burst-mode SRAM acting as elastic buffer between PHY and DSP subsystems. Use Value: Four-word burst and echo clocks (CQ/CQ) align precisely with DSP DMA timing, reducing FIFO depth requirements by 4×. |
| PCIe-Based Accelerator Caching | Test Equipment Pattern Memory |
Use Scenario: Serving as local cache for FPGA-based PCIe accelerators performing real-time protocol analysis. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory interfaced directly to FPGA transceivers using source-synchronous DDR timing. Use Value: On-die termination (ODT) and ZQ calibration eliminate external termination, improving signal integrity at 550 MHz with minimal layout effort. | Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for semiconductor wafer probing. IC Role / Device Role / Timing Role: Deterministic-access SRAM used in pattern generator subsystem with precise 2.5-cycle latency control. Use Value: DOFF pin allows runtime latency switching (1-cycle or 2.5-cycle) to match varying test vector timing requirements without firmware change. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | QDR II, 512K × 36, 500 MHz max, no ODT, 1-cycle fixed latency | Lacks ODT and echo clocks; requires external termination and tighter timing margin | Choose only if legacy design compatibility or cost sensitivity outweighs signal integrity benefits |
| ISSI IS61WV102418BLL-10BLI | Async SRAM, 1M × 18, 10 ns access, single-port, no DDR or burst | No concurrent access, no DDR interface, no echo clocks - fundamentally different architecture | Only suitable for low-bandwidth control-plane buffering where QDR II+ features are unnecessary |
Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, the CY7C25632KV18 delivers higher bandwidth (1100 vs. 1000 MT/s), built-in ODT for cleaner signal integrity, and programmable latency-making it optimal for new high-speed data-path designs requiring deterministic timing and minimal board-level components.
Availability
CY7C25632KV18 is available at Aetrix Electronics and suitable for high-speed networking switches, telecom line cards, FPGA accelerator caching, and automated test equipment requiring stable component supply and long-term lifecycle support.
Supply support for CY7C25632KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems.
The QDR® II+ SRAM product line targets applications requiring ultra-low latency, concurrent read/write access, and DDR bandwidth - specifically optimized for network infrastructure, test equipment, and high-end digital signal processing.
FAQ
What is the function of the DOFF pin on CY7C25632KV18?
The DOFF (Delay OFF) pin selects read latency mode: when asserted HIGH, it enables 2.5-cycle read latency; when LOW, it reverts to 1-cycle latency like QDR I. This allows runtime optimization between bandwidth and latency depending on system timing margins and application requirements.
How does the ZQ pin calibrate output impedance?
The ZQ pin connects to an external precision resistor (typically 240 Ω) to ground. During power-up initialization, the device measures this resistance and configures its output drivers and ODT circuits to 0.2 × RQ (e.g., ~48 Ω), ensuring matched impedance to the PCB trace for minimal signal reflection at 550 MHz.
Can CY7C25632KV18 operate with only one clock input?
No - the device requires both K and K differential clock inputs. All synchronous operations (address/data capture, output timing) depend on rising edges of both clocks. Using only one clock violates timing specifications and prevents correct DDR operation and echo clock generation.
What is the role of QVLD relative to CQ and CQ?
QVLD is edge-aligned with CQ and CQ echo clocks and asserts exactly when Q[17:0] data is valid and stable. It provides a dedicated, low-skew timing reference for receivers (e.g., FPGA input registers) to sample output data reliably, eliminating need for complex deskew logic in high-speed interfaces.
CY7C25632KV18-500BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 500 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C25632KV18-500BZXI FAQ
1.How can I place an order for CY7C25632KV18-500BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C25632KV18-500BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C25632KV18-500BZXI reliable?
The price and inventory of CY7C25632KV18-500BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C25632KV18-500BZXI is usually 5 days.
3.What payment methods are accepted for CY7C25632KV18-500BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C25632KV18-500BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C25632KV18-500BZXI?
CY7C25632KV18-500BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C25632KV18-500BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C25632KV18-500BZXI?
For technical support, including CY7C25632KV18-500BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C25632KV18-500BZXI requirements.
6.How does Aetrix verify that CY7C25632KV18-500BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C25632KV18-500BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C25632KV18-500BZXI meets industry standards.
7.What is the process for return or replacement of CY7C25632KV18-500BZXI?
All CY7C25632KV18-500BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C25632KV18-500BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C25632KV18-500BZXI part is unused and in its original packaging.
Return procedure for CY7C25632KV18-500BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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