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Cypress Semiconductor Corp CY7C25632KV18-550BZXI

Part No.:
CY7C25632KV18-550BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,270

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Product details

Overview

CY7C25632KV18 from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 4M × 18 organization, 550 MHz clock frequency, 2.5-cycle read latency, and on-die termination (ODT) supporting D[17:0], BWS[1:0], and K/K inputs. It features separate read/write ports, DDR interfaces on both ports (1100 MHz data rate), and operates at 1.8 V core / 1.4–1.8 V I/O for high-bandwidth networking buffer applications.

For engineers reviewing the CY7C25632KV18 datasheet, CY7C25632KV18 pinout, CY7C25632KV18 application, or CY7C25632KV18 equivalent, key selection criteria include burst depth (four-word), echo clock timing (CQ/CQ), QVLD validity signaling, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

The CY7C25632KV18 implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 20-bit address bus. Address latching occurs on alternate rising edges of K and K clocks, enabling concurrent access without bus turnaround.

It uses a phase-locked loop (PLL) for precise data placement and supports dual-mode latency: 2.5 cycles when DOFF = HIGH (QDR II+ mode) or 1 cycle when DOFF = LOW (QDR I compatibility). Echo clocks CQ/CQ are free-running and edge-aligned with output data to simplify high-speed capture.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (4M × 18 configuration)
Max Clock Frequency550 MHz - enables 1100 MT/s DDR data rate per port
Read Latency2.5 clock cycles - fixed pipeline delay for deterministic timing in packet buffering
Core Supply1.8 V ± 0.1 V - requires tight regulation for stable high-speed operation
I/O Supply Range1.4 V to 1.8 V - supports HSTL-compatible signaling across multiple voltage domains
On-Die TerminationConfigurable ODT on D[17:0], BWS[1:0], K/K - eliminates external resistors for DQ and control lines
Burst LengthFour-word burst - reduces address bus toggling frequency by 4× versus single-word access

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[17:0]Synchronous write data input18-bit parallel data sampled on rising edges of K/K; supports byte-write via BWS0/BWS1
Q[17:0]Synchronous read data output18-bit parallel output aligned with CQ/CQ; tri-stated when RPS is deasserted
RPS, WPSPort select controlsActive-low signals enabling independent read/write port activation and depth expansion
K, KDifferential clock inputsRising-edge-triggered clocks for all synchronous operations; K used for address/data capture, K for echo/data alignment
CQ, CQOutput echo clocksFree-running, edge-aligned copies of K/K used for source-synchronous data capture at receiver
QVLDValid data indicatorAsserted synchronously with first valid Q[17:0] word in burst; critical for latch timing margining
ODTOn-die termination controlSelects ODT resistance range (RQ/3.33 or RQ/1.66) based on ZQ resistor value
ZQImpedance calibration referenceConnects to precision resistor to ground; sets output driver impedance to 0.2 × RQ

Key Features

FeatureDesign Value
Separate read/write portsEnables true concurrent read/write transactions without arbitration or bus contention
Four-word burst architectureReduces effective address bus frequency by 75%, easing routing and timing closure
Echo clocks (CQ/CQ)Eliminates skew-sensitive strobe routing; enables reliable >1 Gbps data capture
Programmable ODTRemoves need for 36 external termination resistors on D[17:0]/BWS[1:0]/K/K, saving board area and cost
DOFF-selectable latencySwitches between QDR II+ (2.5-cycle) and QDR I (1-cycle) modes for legacy compatibility

Applications

High-Speed Network Packet BufferTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/L3 switches with line-rate throughput.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO buffer with zero-latency write and deterministic 2.5-cycle read response.

Use Value: Concurrent read/write avoids head-of-line blocking; four-word burst matches typical packet header sizes, reducing address overhead.

Use Scenario: Buffering OC-192/STM-64 SONET/SDH payload data in optical transport equipment.

IC Role / Device Role / Timing Role: High-bandwidth memory for time-division multiplexing (TDM) and packet reassembly engines.

Use Value: 1100 MT/s DDR interface sustains >17 GB/s aggregate bandwidth; ODT simplifies impedance-matched backplane routing.

Baseband Processing MemoryTest Equipment Pattern Memory

Use Scenario: Temporary storage of IQ samples in LTE/5G baseband processing units before FFT or channel coding.

IC Role / Device Role / Timing Role: Low-latency, burst-access memory interfacing directly with FPGA-based DSP pipelines.

Use Value: Separate ports allow simultaneous sample ingestion and processed-data egress; echo clocks align with FPGA I/O timing budgets.

Use Scenario: Storing stimulus/response vectors in high-speed automated test equipment (ATE) for ASIC validation.

IC Role / Device Role / Timing Role: Deterministic-access memory for pattern generation and capture at >500 MHz clock rates.

Use Value: 2.5-cycle latency ensures predictable timing margins; QVLD signal enables precise data capture windowing in tester logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615L10BG36-Mbit (2M × 18), 1000 MHz DDR interface, no ODT, 1.5 V coreLacks on-die termination and echo clocks; requires external termination and tighter board-level timing controlPreferred where lower density suffices and system-level termination is already implemented
ISSI IS61WV102418BLL-10BLI18-Mbit (512K × 36), asynchronous interface, 10 ns access, no burst or DDRNo DDR, no burst, no separate ports - fundamentally different architecture for low-latency random access onlyOnly suitable for non-concurrent, non-packetized applications with relaxed bandwidth requirements

Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, the CY7C25632KV18 uniquely delivers 72-Mbit density with concurrent DDR ports, ODT, and echo clocks - making it irreplaceable in high-throughput packet buffering where deterministic timing and board-area savings are critical.

Availability

CY7C25632KV18 is available at Aetrix Electronics and suitable for high-speed network packet buffers, telecom line card memory, and baseband processing systems requiring stable component supply and long-term obsolescence management.

Supply support for CY7C25632KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

The QDR® II+ SRAM product line targets high-bandwidth, low-latency buffering in infrastructure equipment where deterministic timing, concurrent access, and signal integrity at multi-GHz rates are essential.

FAQ

What is the function of the DOFF pin on CY7C25632KV18?

The DOFF (Data-Off) pin selects the read latency mode: when asserted HIGH, the device operates in QDR II+ mode with 2.5-cycle read latency; when asserted LOW, it operates in QDR I mode with 1-cycle latency. This allows backward compatibility with legacy QDR I controllers while enabling higher bandwidth in new designs.

How does the ZQ pin affect output driver impedance?

The ZQ pin connects to an external precision resistor to ground, calibrating internal output drivers to 0.2 × RQ. For example, a 100 Ω ZQ resistor sets output impedance to 20 Ω. Direct connection to VDDQ enables minimum impedance mode; grounding or leaving ZQ floating is prohibited and may cause undefined behavior.

Can CY7C25632KV18 be used without external termination resistors?

Yes - its on-die termination (ODT) supports D[17:0], BWS[1:0], and K/K inputs. When enabled via the ODT pin and calibrated via ZQ, ODT replaces up to 22 external resistors, reducing PCB area, BOM cost, and routing complexity while maintaining signal integrity at 550 MHz.

What is the role of CQ and CQ echo clocks in system timing?

CQ and CQ are free-running, edge-aligned copies of K and K clocks, respectively. They provide source-synchronous timing references for capturing Q[17:0] output data, eliminating setup/hold uncertainty caused by clock-to-out skew. This enables reliable data sampling at 1100 MT/s without complex deskew circuitry.

CY7C25632KV18-550BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
550 MHz
Write Cycle Time - Word, Page:
-
Access Time:
450 ps
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C25632KV18-550BZXI FAQ

1.How can I place an order for CY7C25632KV18-550BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C25632KV18-550BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C25632KV18-550BZXI reliable?

The price and inventory of CY7C25632KV18-550BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C25632KV18-550BZXI is usually 5 days.

3.What payment methods are accepted for CY7C25632KV18-550BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C25632KV18-550BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C25632KV18-550BZXI?

CY7C25632KV18-550BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C25632KV18-550BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C25632KV18-550BZXI?

For technical support, including CY7C25632KV18-550BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C25632KV18-550BZXI requirements.

6.How does Aetrix verify that CY7C25632KV18-550BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C25632KV18-550BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C25632KV18-550BZXI meets industry standards.

7.What is the process for return or replacement of CY7C25632KV18-550BZXI?

All CY7C25632KV18-550BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C25632KV18-550BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C25632KV18-550BZXI part is unused and in its original packaging.

Return procedure for CY7C25632KV18-550BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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