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Cypress Semiconductor Corp CY7C2563KV18-450BZC

Part No.:
CY7C2563KV18-450BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C2563KV18-450BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,879

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Product details

Overview

CY7C2563KV18-450BZC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR®II+ SRAM with 4-word burst architecture, 2.5-cycle read latency, and on-die termination (ODT). It operates at 450 MHz with DDR interfaces on both read and write ports (900 Mbps effective data rate), supports concurrent read/write transactions via independent ports, and targets high-bandwidth packet buffering in network switches and routers.

For engineers reviewing the CY7C2563KV18-450BZC datasheet, CY7C2563KV18-450BZC pinout, CY7C2563KV18-450BZC application, or CY7C2563KV18-450BZC equivalent, key selection criteria include its 450 MHz clock frequency, 1.8V core / 1.4–1.8V I/O supply range, 165-ball FBGA package, ODT support on D[17:0]/BWS[1:0]/K/K inputs, and DOFF-controlled latency mode switching between 1-cycle and 2.5-cycle read timing.

Technical Context

This device implements a synchronous pipelined QDR II+ architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its dual DDR interfaces operate on rising edges of complementary K/K clocks, while echo clocks CQ/CQ align output data capture timing for reliable high-speed interfacing.

The internal PLL ensures precise data placement relative to clock edges, and the self-timed write circuitry guarantees deterministic write completion. Depth expansion is enabled via independent RPS/WPS controls, and full data coherency ensures reads return the most recently written data regardless of port contention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4M × 18-bit (72 Mbit) - provides 72 million bits of fast, low-latency storage for packet buffers or frame caches.
Max Clock Frequency 450 MHz - enables 900 MT/s effective throughput per port with DDR signaling.
Read Latency Configurable: 2.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - allows trade-off between timing margin and pipeline depth.
Supply Voltages VDD = 1.8 V ± 0.1 V; VDDQ = 1.4 V to 1.8 V - supports interoperability with 1.5V or 1.8V I/O systems without level shifters.
On-Die Termination ODT supported on D[17:0], BWS[1:0], K/K - eliminates external 50Ω resistors, reducing PCB area and signal integrity complexity.
Package 165-ball FBGA (13 mm × 15 mm × 1.4 mm) - industry-standard footprint compatible with automated assembly and thermal management.
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - meets JEDEC HSTL-I electrical specs for robust noise immunity at 450 MHz.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input 18-bit parallel data sampled on rising edge of K clock; ODT-enabled for impedance matching.
Q[17:0] Synchronous read data output 18-bit parallel output registered to CQ/CQ echo clocks; QVLD indicates valid window.
A[19:0] Multiplexed address input 20-bit address latched on rising edge of K clock for both read and write access to 4M-depth array.
WPS Write port select Active-low control enabling write operations; deassertion blocks D[17:0] sampling and write execution.
RPS Read port select Active-low control enabling read operations; deassertion disables Q[17:0] output drivers and QVLD assertion.
BWS[1:0] Byte write select Two active-low signals controlling 9-bit byte writes: BWS0 → D[8:0], BWS1 → D[17:9]; enables partial-word updates.
K / K Differential input clocks Complementary clocks driving all synchronous inputs; only rising edges used for register sampling.
CQ / CQ Echo clocks Output-synchronized copies of K/K used by receiving logic to latch Q[17:0] with zero skew.
QVLD Data validity indicator Active-high pulse aligned with valid Q[17:0] window; eliminates need for fixed delay-based capture windows.
DOFF Latency mode control High = 2.5-cycle read latency; Low = 1-cycle read latency - selects internal pipeline configuration.
ODT On-die termination enable Active-high signal enabling ODT on D[17:0], BWS[1:0], and K/K inputs - reduces external component count.
TMS/TCK/TDI/TDO JTAG boundary scan interface IEEE 1149.1-compliant test access port supporting device-level diagnostics and production testing.

Key Features

Feature Design Value
Independent read/write ports Enables true concurrent access - e.g., simultaneous packet ingress (write) and egress (read) without arbitration delay.
4-word burst transfer Reduces address bus toggling frequency by 75% versus single-word access - lowers EMI and simplifies address routing.
Configurable read latency DOFF pin selects between 1-cycle (low latency) and 2.5-cycle (higher timing margin) modes - adapts to system timing constraints.
HSTL I/O with variable drive Ensures signal integrity at 450 MHz while allowing drive strength tuning to match trace impedance and loading.
Integrated PLL Aligns internal data launch timing to echo clocks - eliminates external phase alignment circuitry and improves setup/hold margins.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing incoming Ethernet frames in a 10G switch ASIC before classification and forwarding.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer accessed concurrently by ingress and egress pipelines.

Use Value: 450 MHz DDR operation delivers 16.2 GB/s aggregate bandwidth (900 MT/s × 18 bits), meeting line-rate buffering requirements without multi-chip stacking.

Use Scenario: Frame buffering in a 40G OTN framer card handling multiple OC-192 streams.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as elastic store for clock domain crossing between client and line interfaces.

Use Value: Independent RPS/WPS controls allow asynchronous read/write scheduling, eliminating FIFO synchronization logic and reducing latency jitter.

Baseband Processing Cache Test Equipment Pattern Memory

Use Scenario: Temporary storage of FFT coefficients and channel estimates in LTE/LTE-A baseband processors.

IC Role / Device Role / Timing Role: Burst-access memory supporting rapid coefficient reload during handover or beamforming recalibration.

Use Value: 4-word burst mode reduces address bus activity by 75%, lowering power consumption and easing PCB layout for dense RF subsystems.

Use Scenario: Storing high-speed digital stimulus and expected response patterns in ATE systems running at 450 MHz.

IC Role / Device Role / Timing Role: Deterministic-latency memory enabling precise pattern generation and comparison timing.

Use Value: DOFF-configurable latency (1-cycle or 2.5-cycle) allows matching to tester timing engines - critical for sub-nanosecond timing compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-bit × 2M, 10 ns access time, LVDS interface, no ODT, 256-ball BGA Higher density but slower effective bandwidth (≈10 Gbps vs. 16.2 Gbps); requires external termination and differential receivers. Select when LVDS compatibility or larger word width is required, and board space permits larger package and termination components.
ISSI IS61WV102418BLL-15BLI 1M × 18-bit, 15 ns async SRAM, 3.3V/2.5V supply, no burst or DDR, 119-ball BGA Asynchronous operation limits max throughput to ~1.2 GB/s; lacks concurrency, ODT, and echo clocks. Select only for cost-sensitive, non-real-time buffering where timing predictability and bandwidth are secondary to unit price.

Compared with IDT72T3615L10BG and IS61WV102418BLL-15BLI, the CY7C2563KV18-450BZC uniquely delivers 16.2 GB/s bandwidth with built-in ODT and echo-clock timing - eliminating external components and simplifying high-speed layout while maintaining strict latency control.

Availability

CY7C2563KV18-450BZC is available at Aetrix Electronics and suitable for network infrastructure, telecom line cards, and high-speed test equipment requiring stable component supply, long-lifecycle support, and guaranteed Pb-free manufacturing compliance.

Supply support for CY7C2563KV18-450BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

The QDR®II+ SRAM product line targets applications demanding deterministic latency, concurrent access, and high bandwidth - specifically engineered for packet processing, baseband acceleration, and high-speed instrumentation.

FAQ

What is the function of the DOFF pin on CY7C2563KV18-450BZC?

The DOFF (Delay OFF) pin configures the device's read latency mode: when asserted HIGH, it enables 2.5-cycle read latency for improved timing margin; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting directly controls internal register staging and must be held stable during initialization and operation.

How does On-Die Termination (ODT) work on this SRAM?

ODT is enabled by driving the ODT pin HIGH, activating 50Ω termination resistors on D[17:0], BWS[1:0], and K/K inputs. This matches standard HSTL transmission lines, eliminating the need for external 50Ω resistors and reducing PCB layer count, BOM cost, and signal reflection at 450 MHz.

Can CY7C2563KV18-450BZC be used with a 1.5V VDDQ supply?

Yes - the device supports VDDQ from 1.4V to 1.8V, including 1.5V. At 1.5V, HSTL output drive strength is reduced but remains compliant with HSTL Class I specifications; timing parameters (e.g., tAC, tHZ) must be verified per the 1.5V column in the AC Electrical Characteristics table of the datasheet.

What is the purpose of the CQ and CQ echo clocks?

CQ and CQ are output-synchronized copies of the K and K input clocks, driven with zero skew relative to Q[17:0] data transitions. They allow receiving logic to sample output data using the same clock edge that launched it - removing setup/hold uncertainty and enabling reliable capture at 450 MHz without complex delay tuning.

CY7C2563KV18-450BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C2563KV18-450BZC FAQ

1.How can I place an order for CY7C2563KV18-450BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C2563KV18-450BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C2563KV18-450BZC reliable?

The price and inventory of CY7C2563KV18-450BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C2563KV18-450BZC is usually 5 days.

3.What payment methods are accepted for CY7C2563KV18-450BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C2563KV18-450BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C2563KV18-450BZC?

CY7C2563KV18-450BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C2563KV18-450BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C2563KV18-450BZC?

For technical support, including CY7C2563KV18-450BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C2563KV18-450BZC requirements.

6.How does Aetrix verify that CY7C2563KV18-450BZC is sourced from the original manufacturer or authorized distributors?

All CY7C2563KV18-450BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C2563KV18-450BZC meets industry standards.

7.What is the process for return or replacement of CY7C2563KV18-450BZC?

All CY7C2563KV18-450BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C2563KV18-450BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C2563KV18-450BZC part is unused and in its original packaging.

Return procedure for CY7C2563KV18-450BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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