Cypress Semiconductor Corp CY7C2563KV18-500BZC

Overview

CY7C2563KV18-500BZC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR®II+ SRAM with separate read/write ports, 500 MHz clock operation, 2.5-cycle read latency, and on-die termination (ODT) for D[17:0], BWS[1:0], and K/K inputs. It supports concurrent read/write transactions in high-bandwidth networking buffers and packet memory applications.

For engineers reviewing the CY7C2563KV18-500BZC datasheet, CY7C2563KV18-500BZC pinout, CY7C2563KV18-500BZC application, or CY7C2563KV18-500BZC equivalent, key selection factors include its 4-word burst DDR interface, echo clocks (CQ/CQ), QVLD data-valid indicator, HSTL I/O compatibility, and 165-ball FBGA package with 13 mm × 15 mm footprint.

Technical Context

The CY7C2563KV18-500BZC implements a synchronous pipelined QDR II+ architecture with independent read and write data paths, eliminating bus turnaround overhead. Its dual DDR interfaces operate at 1100 Mbps effective data rate (500 MHz clock × 2 edges), and internal PLL ensures precise data placement aligned to echo clocks CQ/CQ.

Address latching occurs on alternate rising edges of K/K clocks, enabling full depth expansion via RPS/WPS port selects and byte-level write control using BWS[1:0]. The device supports both 1.5V and 1.8V I/O supply (VDDQ = 1.4V to VDD), with core VDD = 1.8V ± 0.1V and HSTL-compliant input/output buffers.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, the CY7C2563KV18-500BZC uniquely delivers 72-Mbit density with integrated ODT, echo clocks, and deterministic 2.5-cycle latency - making it optimal for new high-speed packet buffer designs where signal integrity and timing predictability are critical.

Availability

CY7C2563KV18-500BZC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, telecom line card buffering, and baseband processing memory requiring stable component supply and long-term industrial availability.

Supply support for CY7C2563KV18-500BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, communications, and industrial systems.

The QDR®II+ SRAM product line targets high-bandwidth, low-latency memory subsystems in packet-switched infrastructure - optimized for deterministic timing, concurrent access, and signal integrity at multi-GHz data rates.

FAQ

What is the function of the DOFF pin on CY7C2563KV18-500BZC?

The DOFF (Delay OFF) pin configures read latency mode: when asserted HIGH, the device operates in QDR II+ mode with 2.5-cycle read latency; when LOW, it reverts to QDR-I mode with 1-cycle latency. This pin is sampled synchronously on the rising edge of K and must be held stable during initialization to ensure correct pipeline behavior.

How does the ODT feature reduce system design complexity?

ODT provides programmable on-die termination for D[17:0], BWS[1:0], and K/K inputs, eliminating the need for 24 external 50Ω resistors. This reduces PCB layer count, routing congestion, and BOM cost while improving impedance matching and signal integrity at 500 MHz clock rates.

Can CY7C2563KV18-500BZC interface directly with Xilinx Virtex-6 FPGAs?

Yes - its HSTL Class I inputs and variable-drive HSTL outputs match Virtex-6 memory interface standards. The device's echo clocks (CQ/CQ) and QVLD signal align with Xilinx's source-synchronous capture methodology, and the 165-ball FBGA footprint is supported in Xilinx PCB layout guidelines for QDR-II+ interfaces.

What is the purpose of the ZQ pin and how must it be connected?

The ZQ pin serves as the reference for ODT calibration and must be connected to a precision 240Ω ±1% resistor tied to ground. During power-up or ODT initialization, the device measures this reference to tune internal termination resistors, ensuring accurate 50Ω matching across process, voltage, and temperature variations.