Cypress Semiconductor Corp CY7C25652KV18-550BZXI

Overview

CY7C25652KV18 from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 550 MHz clock frequency, 2.5-cycle read latency, and on-die termination (ODT) supporting D[35:0], BWS[3:0], and K/K inputs. It delivers 1100 MT/s DDR data rates on independent read/write ports and operates at core VDD = 1.8 V ± 0.1 V with I/O VDDQ = 1.4–1.8 V, targeting high-bandwidth packet buffering in network line cards.

For engineers reviewing the CY7C25652KV18 datasheet, CY7C25652KV18 pinout, CY7C25652KV18 application, or CY7C25652KV18 equivalent, key selection criteria include burst depth (four-word), echo clock timing (CQ/CQ), QVLD validity signaling, and FBGA-165 package compatibility with high-speed PCB routing constraints.

Technical Context

The device implements a synchronous pipelined architecture with physically separate read and write data paths, eliminating bus turnaround delays. It uses dual input clocks (K and K) - both rising edges drive DDR transfers - and embeds a PLL for precise data placement relative to echo clocks CQ/CQ.

All address latching, byte write select sampling (BWS[3:0]), and port enable control (RPS/WPS) are synchronized to K or K edges. The 2.5-cycle read latency is configurable via DOFF pin: HIGH enables QDR II+ mode; LOW reverts to 1-cycle QDR I behavior. ODT impedance ranges (RQ/1.66 or RQ/3.33) are selected by ODT pin state at power-up.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, with 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102432BLL-15BLI, CY7C25652KV18 provides double the density, deterministic 2.5-cycle latency, integrated ODT, and echo-clock–assisted timing - making it uniquely suited for next-generation packet-processing pipelines requiring sub-2-ns jitter tolerance.

Availability

CY7C25652KV18 is available at Aetrix Electronics and suitable for network line cards, switch fabric modules, telecom baseband units, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for CY7C25652KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C25652KV18 belongs to the QDR® II+ SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-switched infrastructure where concurrent read/write and precise timing alignment are mandatory.

FAQ

What is the function of the DOFF pin on CY7C25652KV18?

The DOFF (Data-Off) pin configures the device's read latency mode. When asserted HIGH, it enables QDR II+ operation with 2.5-cycle read latency and four-word burst. When LOW, it reverts to QDR I mode with 1-cycle latency and two-word burst. This pin is sampled at power-up and remains static during operation - it is not dynamically reconfigurable.

How does the ZQ pin affect output driver impedance?

The ZQ pin connects to an external precision resistor (RQ) to ground, calibrating the output driver impedance of Q[35:0], CQ, and CQ to exactly 0.2 × RQ. For example, a 200 Ω RQ sets output impedance to 40 Ω. Direct connection to VDDQ enables minimum impedance mode; connection to GND or floating is prohibited and may cause functional failure.

Can CY7C25652KV18 support depth expansion? If so, how?

Yes - depth expansion is achieved using RPS (Read Port Select) and WPS (Write Port Select) pins. Each device can be assigned unique RPS/WPS combinations to enable independent addressing across multiple chips. This allows stacking devices to increase total memory depth while maintaining full concurrency on each port, without requiring external address multiplexing logic.

Is the 165-ball FBGA package lead-free?

Yes - CY7C25652KV18 is offered in both Pb-free (RoHS-compliant) and non-Pb-free versions. The suffix "-ZI" in the part number (as in CY7C25652KV18-550BZXI) explicitly denotes the Pb-free, commercial temperature grade (–40 °C to +85 °C) variant in 165-ball FBGA packaging, with matte tin surface finish.