Cypress Semiconductor Corp CY7C2565KV18-400BZXC
- Part No.:
- CY7C2565KV18-400BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C2565KV18-400BZXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,110
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Product details
Overview
CY7C2565KV18 from Cypress Semiconductor is a 2M × 36-bit, 72-Mbit QDR®II+ SRAM with 4-word burst architecture, 2.5-cycle read latency, on-die termination (ODT), and DDR interfaces on independent read/write ports operating at 550 MHz (1100 MT/s). It delivers high-bandwidth buffering for network packet processing in telecom line cards.
For engineers reviewing the CY7C2565KV18 datasheet, CY7C2565KV18 pinout, CY7C2565KV18 application, or CY7C2565KV18 equivalent, key selection criteria include its 2.5-cycle read latency mode, x36 data width, 165-ball FBGA package, 1.8V core / 1.4–1.8V I/O supply support, and HSTL-compatible DDR timing with echo clocks (CQ/CQ) and QVLD signaling.
Technical Context
This device implements a synchronous pipelined QDR II+ architecture with physically separate read and write data paths, eliminating bus turnaround overhead. It uses dual input clocks (K/K) - both rising-edge-triggered - and dedicated echo clocks (CQ/CQ) to align data capture at 1100 MT/s without external phase alignment circuitry.
The internal PLL ensures precise data placement relative to clock edges, while ODT supports programmable termination on D[35:0], BWS[3:0], and K/K inputs. Depth expansion is enabled via RPS/WPS port selects, and write operations are self-timed synchronously with K/K, maintaining full coherency across concurrent read/write transactions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 400 MHz - supports sustained 800 MT/s DDR data rate (1600 MB/s bandwidth) |
| Read Latency | 2.5 cycles - enables deterministic timing for pipeline-constrained switch fabric buffers |
| Core Supply | VDD = 1.8 V ± 0.1 V - fixed low-voltage core for reduced dynamic power |
| I/O Supply Range | VDDQ = 1.4 V to 1.8 V - interoperable with 1.5 V or 1.8 V system I/O rails |
| Termination | On-Die Termination (ODT) on D[35:0], BWS[3:0], K/K - eliminates 72 external 50-Ω resistors |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - meets JEDEC JESD8-15A timing margins |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | 36-bit parallel data sampled on rising edge of K/K; supports byte-select writes via BWS[3:0] |
| Q[35:0] | Synchronous read data outputs | 36-bit DDR output bus with echo-clock-aligned timing; QVLD indicates valid window |
| A[18:0] | Multiplexed address inputs | 19-bit address latched on K rising edge for both read/write; covers full 2M depth |
| K / K | Dual input clocks | Identical 400 MHz clocks - rising edges control all synchronous registers; no differential pair required |
| CQ / CQ | Echo clocks | Delayed copies of K/K - simplify PCB routing and eliminate need for matched trace lengths to Q[35:0] |
| WPS / RPS | Write/Read Port Select | Active-low enables independent port activation; allows depth expansion without external logic |
| BWS[3:0] | Byte Write Selects | Four independent active-low signals controlling 8-bit segments of D[35:0]; enables partial writes without read-modify-write |
| DOFF | Latency mode control | High = 2.5-cycle read latency; Low = 1-cycle (QDR I compatibility mode) |
| QVLD | Data validity indicator | Asserted one cycle before first valid Q[35:0] word - eliminates need for fixed delay counters in FPGA capture logic |
| ODT | On-Die Termination enable | Global control for ODT on D[35:0], BWS[3:0], and K/K - reduces signal integrity tuning effort |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Enables true concurrent access - e.g., simultaneous packet header read + payload write in buffer memory |
| 4-Word Burst Architecture | Reduces effective address bus frequency by 4× - lowers routing complexity and timing closure burden |
| Programmable Read Latency | DOFF pin selects between 2.5-cycle (high bandwidth) and 1-cycle (legacy compatibility) modes |
| HSTL I/O with Variable Drive | Output drive strength configurable per bank - optimizes signal integrity across mixed-load PCB traces |
| JTAG 1149.1 Test Access Port | Enables boundary-scan testing of SRAM interconnects without requiring functional test vectors |
Applications
| Network Packet Buffering | Switch Fabric Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer with independent read/write ports. Use Value: 2.5-cycle latency and 4-word burst reduce arbitration overhead, enabling line-rate forwarding at 10 Gbps+. | Use Scenario: Interfacing between scheduler ASICs and crossbar switch planes in modular routers. IC Role / Device Role / Timing Role: Synchronous dual-port memory acting as a decoupling FIFO between clock domains. Use Value: Echo clocks (CQ/CQ) and QVLD eliminate setup/hold timing uncertainty, simplifying FPGA-based interface design. |
| Telecom Line Card Buffering | Baseband Processing Memory |
Use Scenario: Temporary storage of processed frames in CPRI/OBSAI fronthaul interface modules. IC Role / Device Role / Timing Role: Burst-mode SRAM supporting deterministic latency for time-sensitive transport protocols. Use Value: ODT on all data and control lines removes 76 external termination resistors, saving >12 mm² PCB area. | Use Scenario: Intermediate result storage in LTE/5G baseband ASIC pipelines during FFT/IFFT and channel estimation. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory interfaced to multi-core DSP clusters. Use Value: x36 data width matches 32-bit + parity or 2×16-bit parallel datapaths, minimizing bus width conversion logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 400 MHz max, x36, 72-Mbit, QDR II+ compatible but lacks DOFF-configurable latency mode | Fixed 2.5-cycle latency only; no QDR I compatibility mode | Select when strict latency consistency is required and legacy mode not needed |
| ISSI IS61WV102436B | 200 MHz max, x36, 72-Mbit, asynchronous SRAM with no DDR or ODT | No burst, no echo clocks, no QVLD - requires external timing control logic | Select only for cost-sensitive, non-high-speed designs where bandwidth < 400 MB/s suffices |
Compared with IDT72T3615L10BG and ISSI IS61WV102436B, CY7C2565KV18 uniquely supports dual-latency operation (via DOFF), integrated ODT for signal integrity, and echo clocks that reduce FPGA capture logic complexity - making it optimal for new high-speed packet buffer designs.
Availability
CY7C2565KV18 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, telecom line card buffering, and baseband processing memory requiring stable component supply across multi-year production cycles.
Supply support for CY7C2565KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.
The QDR®II+ SRAM product line targets high-bandwidth, low-latency buffering in packet-switched infrastructure - optimized for deterministic timing, signal integrity, and seamless FPGA/ASIC integration.
FAQ
What is the function of the DOFF pin on CY7C2565KV18?
The DOFF (Data-Off) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle read latency for maximum bandwidth; when LOW, it reverts to 1-cycle latency compatible with legacy QDR I timing. This pin is sampled at power-up and remains static during operation - no runtime switching is supported.
How does On-Die Termination (ODT) operate on CY7C2565KV18?
ODT is controlled by the ODT pin and applies programmable 50-Ω termination to D[35:0], BWS[3:0], and K/K inputs simultaneously. It eliminates the need for external series or parallel termination resistors, reducing PCB component count, board area, and routing complexity - especially critical for high-density 165-ball FBGA layouts.
Can CY7C2565KV18 be used with a 1.5V I/O supply?
Yes - VDDQ supports 1.4 V to 1.8 V, including 1.5 V nominal. The device's HSTL Class I inputs and variable-drive outputs maintain specified timing margins and signal integrity at 1.5 V, enabling direct interfacing with 1.5 V FPGAs or ASICs without level-shifting circuitry.
What is the purpose of CQ and CQ echo clocks?
CQ and CQ are delayed replicas of the K and K input clocks, routed alongside Q[35:0] outputs. They provide a clean, phase-aligned reference for capturing DDR read data in the receiving FPGA/ASIC - eliminating the need for complex delay-chain calibration or deskew logic, and relaxing PCB trace-length matching requirements.
CY7C2565KV18-400BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C2565KV18-400BZXC FAQ
1.How can I place an order for CY7C2565KV18-400BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C2565KV18-400BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C2565KV18-400BZXC reliable?
The price and inventory of CY7C2565KV18-400BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C2565KV18-400BZXC is usually 5 days.
3.What payment methods are accepted for CY7C2565KV18-400BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C2565KV18-400BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C2565KV18-400BZXC?
CY7C2565KV18-400BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C2565KV18-400BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C2565KV18-400BZXC?
For technical support, including CY7C2565KV18-400BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C2565KV18-400BZXC requirements.
6.How does Aetrix verify that CY7C2565KV18-400BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C2565KV18-400BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C2565KV18-400BZXC meets industry standards.
7.What is the process for return or replacement of CY7C2565KV18-400BZXC?
All CY7C2565KV18-400BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C2565KV18-400BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C2565KV18-400BZXC part is unused and in its original packaging.
Return procedure for CY7C2565KV18-400BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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