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Cypress Semiconductor Corp CY7C2565KV18-500BZC

Part No.:
CY7C2565KV18-500BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C2565KV18-500BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,432

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Product details

Overview

CY7C2565KV18 from Cypress Semiconductor is a 72-Mbit QDR®II+ SRAM with 2M × 36 organization, 500 MHz operation, 2.5-cycle read latency, and on-die termination (ODT) supporting D[35:0], BWS[3:0], and K/K inputs. It features separate read/write DDR ports, echo clocks (CQ/CQ), QVLD data-valid signaling, and operates at VDD = 1.8 V ± 0.1 V with VDDQ = 1.4–1.8 V for high-bandwidth packet buffering in network line cards.

For engineers reviewing the CY7C2565KV18 datasheet, CY7C2565KV18 pinout, CY7C2565KV18 application, or CY7C2565KV18 equivalent, key selection criteria include burst depth (4-word), concurrent read/write capability, FBGA-165 package compatibility, ODT configuration flexibility, and PLL-synchronized timing for deterministic 1100 MT/s data transfer.

Technical Context

The CY7C2565KV18 implements a synchronous pipelined QDR II+ architecture with independent read and write ports sharing a multiplexed 19-bit address bus (A[18:0]). Read and write operations are latched on alternate rising edges of the K clock, enabling true concurrency without bus turnaround.

It integrates a phase-locked loop (PLL) for precise data placement, echo clocks (CQ/CQ) to simplify high-speed capture, and programmable ODT on data, byte-write-select, and clock inputs-eliminating external termination resistors while maintaining signal integrity at 500 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 organization)
Max Clock Frequency500 MHz - enables 1100 MT/s DDR throughput per port
Read Latency2.5 cycles - fixed pipeline delay for deterministic timing in switch fabric control paths
VDD / VDDQCore: 1.8 V ± 0.1 V; I/O: 1.4–1.8 V - supports dual-voltage board design with HSTL-compatible interfaces
Burst Length4-word - reduces address bus toggling frequency by 4× versus single-word access
On-Die TerminationSupported on D[35:0], BWS[3:0], K/K - eliminates 72 external 50-Ω resistors and saves >120 mm² PCB area
Package165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in telecom modules

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, 1.0 mm ball pitch.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data input36-bit parallel data sampled on rising edge of K/K; full-width interface for packet payload writes
Q[35:0]Synchronous read data output36-bit DDR output with QVLD strobe; delivers burst-aligned payload to switch ASIC
BWS[3:0]Byte write select (active low)Independent control over four 9-bit bytes; enables partial-word updates without read-modify-write
K / KDifferential clock inputsRising-edge-triggered; K drives write logic, K drives read logic - eliminates internal clock skew
CQ / CQDDR echo clocksOutput-synchronized copies of K/K; used by FPGA/ASIC to latch Q[35:0] with zero setup/hold margin
QVLDData valid indicatorAsserted one cycle before first valid Q word; enables immediate data consumption without fixed latency assumptions
DOFFLatency mode selectHIGH → 2.5-cycle latency; LOW → 1-cycle latency - runtime-configurable for latency-critical vs. bandwidth-critical modes
ODTOn-die termination enableActive HIGH; activates internal 50-Ω termination on D[35:0], BWS[3:0], and K/K pins

Key Features

FeatureDesign Value
Separate read/write DDR portsEnables simultaneous 1100 MT/s ingress and egress - critical for full-duplex packet buffering in 10G+ Ethernet switches
4-word burst architectureReduces effective address bus frequency to 125 MHz at 500 MHz clock - simplifies routing and timing closure on dense backplanes
Programmable ODTEliminates need for 76 external 50-Ω resistors - cuts BOM cost by ~$0.35/unit and removes 144 solder joints per device
PLL + echo clocks (CQ/CQ)Provides sub-100 ps data-eye alignment at 1100 MT/s - allows use with standard FPGA I/O without custom delay chains
Depth expansion supportWPS/RPS port selects enable stacking of multiple CY7C2565KV18s to build 4M×36 or wider memories - preserves timing across devices

Applications

Network Packet BufferingSwitch Fabric Memory

Use Scenario: Storing variable-length Ethernet frames in a 10G line card prior to classification and forwarding.

IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM acting as ingress/egress FIFO with concurrent read/write capability.

Use Value: 2.5-cycle latency and 4-word burst deliver 8.8 GB/s aggregate bandwidth - sufficient for full-rate 10G wire-speed buffering with <1 µs queuing delay.

Use Scenario: Holding header lookup results and forwarding tables in a modular chassis switch ASIC.

IC Role / Device Role / Timing Role: Deterministic-access memory providing synchronized read/write responses to parallel search engines.

Use Value: Echo clocks (CQ/CQ) and QVLD eliminate timing uncertainty - enables reliable 500 MHz operation without manual PCB delay tuning.

Telecom Baseband ProcessingHigh-Speed Test Equipment Memory

Use Scenario: Buffering IQ samples between ADC/DAC and DSP cores in LTE/5G remote radio units.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as ping-pong buffer with independent clock domains for sample capture and processing.

Use Value: Separate K/K clocks allow asynchronous read/write timing - decouples RF sampling rate (e.g., 245.76 MHz) from DSP processing rate (e.g., 500 MHz).

Use Scenario: Capturing high-speed digital waveforms in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Burst-mode acquisition memory with precise trigger-aligned readout via QVLD and echo clocks.

Use Value: DOFF pin enables 1-cycle latency mode during trigger capture - reduces post-trigger dead time to 2 ns at 500 MHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T36150QDR-II, 72-Mbit, 550 MHz max, no ODT, requires external terminationLacks integrated ODT and echo clocks - increases layout complexity and signal integrity risk above 400 MHzPrefer when legacy system uses discrete termination and existing layout cannot accommodate CY7C2565KV18's ODT configuration pins
ISSI IS61QW25636BQDR-II+, 72-Mbit, 500 MHz, same 165-BGA package, but only supports VDDQ = 1.5 V (not 1.4–1.8 V range)Fixed 1.5 V I/O voltage - incompatible with mixed-voltage designs requiring 1.4 V or 1.8 V VDDQ operationChoose only if board already uses strict 1.5 V VDDQ distribution and does not require dynamic ODT control

Compared with IDT72T36150 and IS61QW25636B, the CY7C2565KV18 uniquely combines programmable ODT, 1.4–1.8 V VDDQ flexibility, and echo-clock–assisted timing - delivering lower system-level BOM cost, broader voltage interoperability, and higher timing margin in 500 MHz packet-processing systems.

Availability

CY7C2565KV18 is available at Aetrix Electronics and suitable for network line cards, telecom baseband modules, high-speed test instrumentation, and switch fabric subsystems requiring stable component supply, long-lifecycle support, and verified QDR-II+ timing compliance.

Supply support for CY7C2565KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The QDR®II+ SRAM product line was designed specifically for deterministic, high-bandwidth buffering in networking and telecommunications infrastructure - emphasizing concurrent access, low latency, and signal integrity at multi-GHz data rates.

FAQ

What is the function of the DOFF pin on CY7C2565KV18?

The DOFF (Delay OFF) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle read latency for maximum bandwidth; when LOW, it reverts to 1-cycle latency for minimal access delay. This is a static configuration pin sampled at power-up and must remain stable during operation - it does not support runtime switching.

How does On-Die Termination (ODT) work on CY7C2565KV18?

ODT is enabled by driving the ODT pin HIGH, activating 50-Ω termination resistors on D[35:0], BWS[3:0], and K/K inputs. Termination strength is fixed and non-adjustable. The feature eliminates external resistors, reduces stub length sensitivity, and improves signal integrity at 500 MHz - but requires proper ODT pin biasing and is disabled when ODT = LOW.

Can CY7C2565KV18 operate with different VDDQ and VDD voltages?

Yes: VDD is fixed at 1.8 V ± 0.1 V for core logic, while VDDQ supports 1.4 V to 1.8 V for I/O buffers - allowing interoperability with 1.5 V or 1.8 V ASIC interfaces. VDDQ must be ≥ VDD − 0.4 V and ≤ VDD; using VDDQ = 1.4 V reduces I/O power by ~22% versus 1.8 V at full bandwidth.

What is the purpose of CQ and CQ echo clocks?

CQ and CQ are output-synchronized copies of the K and K input clocks, aligned to Q[35:0] data edges. They provide a clean, low-skew reference for the receiving device (e.g., FPGA) to latch read data without needing adjustable input delays - essential for reliable 1100 MT/s DDR capture with zero setup/hold margin requirements.

CY7C2565KV18-500BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
500 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C2565KV18-500BZC FAQ

1.How can I place an order for CY7C2565KV18-500BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C2565KV18-500BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C2565KV18-500BZC reliable?

The price and inventory of CY7C2565KV18-500BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C2565KV18-500BZC is usually 5 days.

3.What payment methods are accepted for CY7C2565KV18-500BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C2565KV18-500BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C2565KV18-500BZC?

CY7C2565KV18-500BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C2565KV18-500BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C2565KV18-500BZC?

For technical support, including CY7C2565KV18-500BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C2565KV18-500BZC requirements.

6.How does Aetrix verify that CY7C2565KV18-500BZC is sourced from the original manufacturer or authorized distributors?

All CY7C2565KV18-500BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C2565KV18-500BZC meets industry standards.

7.What is the process for return or replacement of CY7C2565KV18-500BZC?

All CY7C2565KV18-500BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C2565KV18-500BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C2565KV18-500BZC part is unused and in its original packaging.

Return procedure for CY7C2565KV18-500BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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