Cypress Semiconductor Corp CY7C2565XV18-633BZXC

Overview

CY7C2565XV18-633BZXC from Cypress Semiconductor is a 2M × 36, 72-Mbit QDR® II+ Xtreme SRAM with four-word burst architecture, 2.5-cycle read latency, and on-die termination (ODT). It operates at 633 MHz with DDR interfaces on both read and write ports (1266 MT/s), supports separate read/write ports for concurrent transactions, and uses HSTL I/O with 1.8 V core and 1.5 V I/O supply-designed for high-bandwidth packet buffering in network switches and routers.

For engineers reviewing the CY7C2565XV18-633BZXC datasheet, CY7C2565XV18-633BZXC pinout, CY7C2565XV18-633BZXC application, or CY7C2565XV18-633BZXC equivalent, key selection criteria include 2.5-cycle vs. 1-cycle latency mode (DOFF-controlled), ODT configuration via ZQ/ODT pins, echo clock timing alignment (CQ/CQ), and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

This SRAM implements a synchronous pipelined QDR II+ architecture with independent read and write ports, eliminating data bus turnaround through dedicated I/O paths. It uses dual input clocks (K/K) sampled only on rising edges and delivers four sequential 36-bit words per access, achieving full bandwidth at 633 MHz with 1266 MT/s effective data rate.

The device integrates a PLL for precise data placement, supports depth expansion via RPS/WPS port selects, and features programmable on-die termination for D[35:0], BWS[3:0], and K/K inputs-configured by ODT pin state and external ZQ resistor (175–350 Ω). DOFF pin toggles between QDR II+ (2.5-cycle latency) and QDR I (1-cycle latency) operation modes.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free compatible.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T36150L10BG and IS61WV102436B, CY7C2565XV18-633BZXC uniquely balances 72-Mbit density, 1266 MT/s DDR bandwidth, 2.5-cycle latency configurability, and 1.8 V/HSTL compatibility - making it optimal for modern 10G+ networking and low-voltage FPGA-based accelerators.

Availability

CY7C2565XV18-633BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-frequency trading engines, and AI inference preprocessing requiring stable component supply across extended production lifecycles.

Supply support for CY7C2565XV18-633BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and power efficiency.

CY7C2565XV18 belongs to the QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, high-throughput data-path buffering in multi-gigabit communication infrastructure where concurrent read/write and sub-10 ns latency are mandatory.

FAQ

What is the function of the DOFF pin on CY7C2565XV18-633BZXC?

The DOFF (Data-Off) pin controls read latency mode: when asserted HIGH, the device operates in QDR II+ mode with 2.5-cycle read latency for maximum bandwidth; when LOW, it reverts to QDR I mode with 1-cycle latency for minimal access delay. This is a static configuration pin sampled at power-up and during reset - no runtime switching is supported.

How does on-die termination (ODT) work on this SRAM?

ODT is enabled via the ODT pin and calibrated using an external 240 Ω resistor on the ZQ pin. When ODT = HIGH, termination resistance equals RQ/1.66 (~144 Ω); when LOW, it equals RQ/3.33 (~72 Ω). This programmable termination applies to all D[35:0], BWS[3:0], and K/K inputs - eliminating 76 external resistors and improving signal fidelity at 1266 MT/s.

Can CY7C2565XV18-633BZXC be used with a 1.35 V I/O supply?

No. The device specifies VDDQ = 1.4 V to 1.6 V minimum/maximum operating range, with 1.5 V as the nominal value. Operation at 1.35 V falls outside datasheet limits and risks timing violations, data corruption, and reduced noise margin - especially on HSTL Class I outputs which require ≥1.4 V for valid logic thresholds.

What is the purpose of CQ and CQ echo clocks?

CQ and CQ are free-running, K/K-synchronized output clocks provided to simplify high-speed data capture in receiving logic (e.g., FPGA IOBs). They replicate the phase and jitter profile of K/K, allowing use of IDELAY/ODELAY primitives to deskew Q[35:0] relative to CQ - achieving <20 ps data-eye alignment without complex PLL-based clock recovery.