Cypress Semiconductor Corp CY7C2568XV18-600BZXC

Overview

CY7C2568XV18-600BZXC from Cypress Semiconductor is a 72-Mbit DDR II+ Xtreme SRAM (4 M × 18 configuration) with synchronous pipelined architecture, 2.5-cycle read latency, on-die termination (ODT), and echo clocks (CQ/CQ) for precise DDR data capture. It operates at 600 MHz clock frequency (1200 MT/s effective data rate), supports 1.8 V core supply and 1.5 V I/O (VDDQ), and is packaged in a 165-ball FBGA (13 × 15 × 1.4 mm). It serves as high-bandwidth buffer memory in network packet processors and FPGA-based protocol accelerators.

For engineers reviewing the CY7C2568XV18-600BZXC datasheet, CY7C2568XV18-600BZXC pinout, CY7C2568XV18-600BZXC application, or CY7C2568XV18-600BZXC equivalent, key selection criteria include DDR II+ burst timing compliance, ODT support for DQ/BWS/K/K inputs, QVLD-synchronized output validity, HSTL-compatible I/O drive, and PLL-controlled data placement accuracy under 600 MHz operation.

Technical Context

This SRAM implements a two-word burst architecture where each address access delivers two consecutive 18-bit words on alternating rising edges of K and K clocks. Read latency is configurable: 2.5 cycles when DOFF = HIGH (DDR II+ mode), or 1 cycle when DOFF = LOW (DDR I compatibility mode).

The device integrates echo clocks (CQ/CQ) aligned to K/K for simplified system-level data capture, a dedicated QVLD signal edge-aligned to CQ/CQ indicating valid output data, and on-die termination enabled only during write operations for DQ[17:0], BWS[1:0], and both K/K inputs - eliminating external termination resistors.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with CY7C2568XV18-633BZXC, the -600BZXC offers greater timing margin at cost of 5.2% bandwidth reduction; versus IS61WV102418BLL-10TLI, it delivers 6× higher effective throughput and deterministic DDR timing but requires full DDR interface implementation.

Availability

CY7C2568XV18-600BZXC is available at Aetrix Electronics and suitable for network packet buffering, FPGA-based protocol acceleration, telecom line card memory, and high-speed test equipment buffering requiring stable component supply across extended production lifecycles.

Supply support for CY7C2568XV18-600BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.

The DDR II+ Xtreme SRAM product line was designed specifically for deterministic, high-bandwidth data buffering in DDR-capable networking and test equipment, emphasizing timing precision, on-die signal integrity features, and seamless FPGA/ASIC integration.

FAQ

What is the function of the DOFF pin on CY7C2568XV18-600BZXC?

The DOFF (Disable Off-mode) pin configures read latency mode: when asserted HIGH, it enables DDR II+ operation with 2.5-cycle read latency; when LOW, it reverts to DDR I–compatible 1-cycle latency. This pin is sampled at power-up and remains latched, allowing hardware-selectable timing behavior without firmware intervention.

How does on-die termination (ODT) operate on CY7C2568XV18-600BZXC?

ODT activates automatically only during write operations on DQ[17:0], BWS[1:0], and K/K inputs. Its resistance value is selected at power-up via the ODT pin state and calibrated using the ZQ pin's external resistor. ODT deactivates during reads, ensuring clean signal reception without loading the data bus.

Can CY7C2568XV18-600BZXC interface directly with Xilinx UltraScale FPGAs?

Yes - its HSTL Class I–compliant I/O, 600 MHz DDR timing, echo clocks (CQ/CQ), and QVLD signal align with Xilinx UltraScale FPGA memory interface requirements. The 165-ball FBGA footprint matches common FPGA package escape patterns, and the 1.5 V VDDQ is compatible with UltraScale HP I/O banks.

What is the role of the ZQ pin beyond impedance calibration?

ZQ exclusively calibrates output driver impedance for CQ, CQ, and Q[17:0] pins to 0.2 × RQ (where RQ is the resistor tied between ZQ and GND). It has no secondary function: it cannot be left floating, tied to VDDQ (allowed only for min-impedance mode), or connected to GND. Misconnection causes undefined output drive strength and signal integrity failure.