Cypress Semiconductor Corp CY7C2570KV18-400BZC
- Part No.:
- CY7C2570KV18-400BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C2570KV18-400BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:116
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Product details
Overview
CY7C2570KV18 from Cypress Semiconductor is a 72-Mbit synchronous pipelined SRAM with DDR II+ architecture, configured as 2M × 36-bit, supporting 2-word burst reads at 2.5-cycle latency. It operates at 400 MHz clock frequency (800 MT/s effective data rate), features on-die termination (ODT) for DQ/BWS/K/K inputs, and uses HSTL I/O with VDD = 1.8 V and VDDQ = 1.4–1.8 V. It is deployed in high-bandwidth packet buffering for network line cards.
For engineers reviewing the CY7C2570KV18 datasheet, CY7C2570KV18 pinout, CY7C2570KV18 application, or CY7C2570KV18 equivalent, key selection criteria include 2M × 36 organization, 400 MHz K-clock timing, ODT support on 36-bit data bus, echo clocks CQ/CQ for source-synchronous capture, and QVLD-driven data validity signaling.
Technical Context
This device implements a synchronous pipelined SRAM core with DDR II+ interface logic, where address and control signals are registered on rising edges of K clock only, while write data and read data transfer on both K and K rising edges. The 2-word burst mode reduces address bus toggling frequency by half relative to single-word access.
It integrates a PLL for precise internal timing alignment, supports programmable ODT impedance selection via ODT pin and ZQ calibration resistor, and delivers valid output data synchronized to echo clocks CQ/CQ with QVLD assertion aligned to those edges - eliminating need for external strobes in high-speed systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 72 Mbit total; 2M × 36-bit configuration - provides wide-data-path buffering for 36-bit parallel interfaces like legacy PCI-X or custom ASIC interconnects. |
| Maximum Clock Frequency | 400 MHz (K input) - defines maximum sustained transaction rate; enables 800 MT/s effective throughput on 36-bit bus. |
| Read Latency | 2.5 clock cycles when DOFF = HIGH - ensures deterministic timing for pipeline-aligned memory access in FPGA-based switch fabric controllers. |
| VDD / VDDQ | Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V - supports dual-voltage operation compatible with 1.5 V or 1.8 V system I/O rails. |
| On-Die Termination | Supported on D[35:0], BWS[3:0], K, K - eliminates need for 72 discrete 50 Ω resistors, reducing PCB area and signal integrity complexity. |
| Output Valid Indicator | QVLD pin edge-aligned with CQ/CQ - provides unambiguous, clock-synchronized enable for latching 36-bit output data without setup/hold margin estimation. |
| Package | 165-ball FBGA (13 mm × 15 mm × 1.4 mm) - standard footprint for high-pin-count, thermally demanding SRAMs in telecom modules. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm body, 1.4 mm height, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data bus | 36-bit DDR data path; sampled on K/K rising edges during writes, driven on same edges during reads; tri-stated automatically on deselect. |
| BWS[3:0] | Byte write select (active LOW) | Four independent byte masks controlling D[8:0], D[17:9], D[26:18], D[35:27]; enables partial writes without read-modify-write overhead. |
| K / K | Differential clock inputs | K only used for address/control registration; both K and K drive data transfers - enables true DDR timing with single-ended clock domain control. |
| CQ / CQ | Echo clocks (output) | Source-synchronous clocks phase-matched to DQ outputs; eliminate skew between data and capture clock in receiving logic. |
| QVLD | Valid data indicator | Asserted coincident with first valid DQ word on CQ/CQ edge - removes need for fixed delay chains or eye-diagram-based sampling windows. |
| ODT | On-die termination control | Selects ODT resistance range (low/high) during power-up; pairs with ZQ pin to calibrate termination to external 240 Ω resistor. |
| LD | Load signal | Defines start of burst cycle on K rising edge; synchronizes address, R/W, and BWS sampling - critical for deterministic latency behavior. |
Key Features
| Feature | Design Value |
|---|---|
| 2-Word Burst Architecture | Halves required address bus toggle rate versus single-word access - reduces routing congestion and EMI on dense backplanes. |
| 2.5-Cycle Read Latency (DOFF = HIGH) | Enables predictable pipeline depth for multi-stage switch fabric controllers - simplifies timing closure in FPGA-based designs. |
| HSTL Class I Inputs / Variable Drive Outputs | Guarantees signal integrity at 400 MHz with controlled slew rates and impedance matching - avoids overshoot/ringing on long traces. |
| JTAG IEEE 1149.1 Test Access Port | Supports boundary scan testing of SRAM interconnects without functional access - critical for high-reliability telecom board validation. |
| Programmable Impedance Calibration (ZQ) | Automatically adjusts ODT and output driver strength based on external 240 Ω reference resistor - maintains consistent termination across voltage/temperature. |
Applications
| Network Packet Buffering | FPGA Co-Processor Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packets in 10G Ethernet line cards before classification and forwarding. IC Role / Device Role / Timing Role: High-throughput, low-latency shared buffer accessed by multiple traffic managers via 36-bit parallel bus. Use Value: 2M × 36 organization matches typical packet descriptor + payload alignment; 2.5-cycle latency enables tight scheduling in time-sensitive forwarding pipelines. |
Use Scenario: Off-chip cache for Xilinx Virtex-5/6 FPGA-based video processing engines handling 4K frame buffers. IC Role / Device Role / Timing Role: Synchronous burst-access memory mapped into FPGA AXI HP slave port with minimal glue logic. Use Value: Echo clocks CQ/CQ and QVLD eliminate need for dynamic phase adjustment in FPGA IDELAYCTRL - cuts design iteration time by ~3 weeks. |
| Telecom Baseband Processing | Industrial Real-Time Control |
|
Use Scenario: Interleaved data storage for multi-carrier LTE baseband processors performing FFT/IFFT on 2048-point symbols. IC Role / Device Role / Timing Role: Dual-port-like access via burst reads/writes synchronized to symbol timing clock derived from K. Use Value: On-die termination on all 36 DQ lines prevents stub reflections across 8-layer RF-digital PCBs - improves BER by >3 dB at 400 MHz. |
Use Scenario: Deterministic data logging in SIL-3-rated PLC modules capturing sensor fusion streams from CAN/IO-Link field buses. IC Role / Device Role / Timing Role: Atomic write buffer ensuring no data loss during power-fail events, backed by external capacitor hold-up. Use Value: Synchronous self-timed writes guarantee completion within 1 K-cycle window - meets IEC 61508 worst-case write latency requirement of ≤2.5 ns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256B-15JCIN | 512K × 36-bit, 15 ns async access, no DDR, no ODT, 3.3 V only | Limited to lower-bandwidth control-plane buffering; requires external termination and wider timing margins | Choose only if system lacks DDR clock infrastructure and bandwidth demand < 200 MB/s |
| IS61WV204836BLL-10BLI | 2M × 36-bit, 10 ns async access, no burst, no echo clocks, 3.3 V core/I/O | Suitable for non-pipelined microcontroller co-processors; incompatible with DDR timing-critical FPGA interfaces | Select when deterministic sub-10 ns latency matters more than bandwidth, and JTAG test is not required |
Compared with AS7C3256B-15JCIN and IS61WV204836BLL-10BLI, CY7C2570KV18 uniquely delivers DDR II+ burst throughput at 400 MHz with integrated ODT and echo-clock synchronization - essential for FPGA-ASIC interconnects where signal integrity and timing predictability outweigh cost sensitivity.
Availability
CY7C2570KV18 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom baseband processing requiring stable component supply across extended product lifecycles.
Supply support for CY7C2570KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.
CY7C2570KV18 belongs to the QDR II+ SRAM product line, engineered specifically for deterministic, high-bandwidth data buffering in packet-switched infrastructure where DDR timing precision and on-die signal integrity features are mandatory.
FAQ
What is the function of the DOFF pin on CY7C2570KV18?
The DOFF (Data Output OFF) pin selects read latency mode: when asserted HIGH, it configures the device for 2.5-cycle read latency; when LOW, it reverts to 1-cycle latency like standard DDR I devices. This allows runtime optimization between bandwidth and pipeline depth in FPGA-based systems.
How does the ZQ pin work with ODT calibration?
ZQ connects to an external 240 Ω resistor to ground, enabling internal calibration of on-die termination resistance and output driver strength. During power-up initialization, the device measures ZQ and adjusts ODT values to match target impedance - ensuring consistent signal integrity across voltage and temperature variations.
Can CY7C2570KV18 operate with only a single-ended clock?
No. The device requires differential K and K clock inputs for DDR data transfers. While address and control signals use K only, data input/output timing depends on both edges - using only K violates AC timing specifications and will cause data corruption or failure to meet 400 MHz operation.
Is JTAG boundary scan supported on CY7C2570KV18?
Yes. The device implements IEEE 1149.1 JTAG TAP with TDI, TDO, TCK, and TMS pins. Boundary scan supports interconnect testing of all 165 balls, including DQ, BWS, and clock nets - validated per Cypress Application Note AN54117 for telecom board certification.
CY7C2570KV18-400BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C2570KV18-400BZC FAQ
1.How can I place an order for CY7C2570KV18-400BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C2570KV18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C2570KV18-400BZC reliable?
The price and inventory of CY7C2570KV18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C2570KV18-400BZC is usually 5 days.
3.What payment methods are accepted for CY7C2570KV18-400BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C2570KV18-400BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C2570KV18-400BZC?
CY7C2570KV18-400BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C2570KV18-400BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C2570KV18-400BZC?
For technical support, including CY7C2570KV18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C2570KV18-400BZC requirements.
6.How does Aetrix verify that CY7C2570KV18-400BZC is sourced from the original manufacturer or authorized distributors?
All CY7C2570KV18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C2570KV18-400BZC meets industry standards.
7.What is the process for return or replacement of CY7C2570KV18-400BZC?
All CY7C2570KV18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C2570KV18-400BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C2570KV18-400BZC part is unused and in its original packaging.
Return procedure for CY7C2570KV18-400BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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