Cypress Semiconductor Corp CY7C2570XV18-633BZXC

Overview

CY7C2570XV18-633BZXC from Cypress Semiconductor is a 72-Mbit synchronous pipelined DDR II+ Xtreme SRAM with 2 M × 36 organization, 633 MHz clock frequency, 2.5-cycle read latency (DOFF = HIGH), on-die termination (ODT) for DQ/BWS/K/K inputs, and HSTL I/O interface operating at 1.5 V VDDQ. It serves as a high-bandwidth data buffer in network packet processors requiring deterministic burst reads and precise DDR timing alignment.

For engineers reviewing the CY7C2570XV18-633BZXC datasheet, CY7C2570XV18-633BZXC pinout, CY7C2570XV18-633BZXC application, or CY7C2570XV18-633BZXC equivalent, key selection criteria include its 2.5-cycle vs. 1-cycle configurable read latency, echo-clock–synchronized QVLD timing, ODT range selection via ODT pin, and 165-ball FBGA package compatibility with high-density routing constraints.

Technical Context

The CY7C2570XV18 implements a two-word burst architecture where each address access delivers 36-bit data across two consecutive K/K rising edges. Its DDR II+ interface uses dual input clocks (K and K) - both sampled on rising edges - to register write data and drive read outputs, while internal pipelining enables overlapping address latching and data output staging.

On-die termination supports programmable impedance matching for DQ[35:0], BWS[3:0], and K/K inputs via external ZQ resistor; ODT activation is write-only and controlled by ODT pin logic level. The device integrates a PLL for accurate data placement and provides echo clocks (CQ/CQ) edge-aligned with output data and QVLD to simplify system-level capture without per-device skew compensation.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant Pb-free construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with AS7C3256A-15JCIN and IS61WV102432BLL-10BLI, the CY7C2570XV18-633BZXC delivers 14× higher bandwidth (1266 MT/s vs. ~66 MT/s), eliminates external termination, and provides hardware-synchronized data validity - making it uniquely suited for next-generation packet processing and test instrumentation.

Availability

CY7C2570XV18-633BZXC is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, telecom line card buffering, and avionics data acquisition requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C2570XV18-633BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable systems-on-chip for industrial, automotive, and communications markets.

The CY7C2570XV18 belongs to the DDR II+ Xtreme SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in infrastructure equipment where signal integrity, timing precision, and board-level integration are critical.

FAQ

What is the function of the DOFF pin on CY7C2570XV18-633BZXC?

The DOFF (Double-Off) pin configures read latency mode: when asserted HIGH, the device operates in DDR II+ mode with 2.5-cycle latency; when LOW, it reverts to DDR I mode with 1-cycle latency. This pin is sampled during power-up initialization and remains static during operation - it does not support dynamic switching.

How does on-die termination (ODT) work on this SRAM?

ODT is enabled only during write operations and applies to DQ[35:0], BWS[3:0], and K/K inputs. Its resistance value is set by the ODT pin logic level and an external ZQ resistor: ODT = LOW selects RQ/3.33 (175–350 Ω range); ODT = HIGH selects RQ/1.66 (175–250 Ω range). Floating defaults to HIGH-range mode.

Can CY7C2570XV18-633BZXC operate with a 1.8 V VDDQ supply?

No. The device requires VDDQ between 1.4 V and 1.6 V for HSTL-compliant I/O operation. Core VDD is fixed at 1.8 V ± 0.1 V, but VDDQ must remain within specification to ensure proper driver strength, signal swing, and ODT calibration - exceeding 1.6 V risks I/O damage and invalidates AC timing parameters.

What is the purpose of the QVLD signal and how is it timed?

QVLD (Valid Output Indicator) asserts synchronously with the rising edges of CQ and CQ to indicate that concurrent DQ[35:0] outputs are valid. It is generated internally and edge-aligned to echo clocks - not derived from K/K - enabling reliable data capture in FPGA receivers without additional delay-matching circuitry.