Cypress Semiconductor Corp CY7C2644KV18-300BZI

Overview

CY7C2644KV18-300BZI from Infineon Technologies (formerly Cypress) is a radiation-hardened 144-Mbit QDR® II+ SRAM with 4M × 36 organization, 250 MHz clock frequency, 2.0-cycle read latency, and on-die termination (ODT). It features separate read/write ports, DDR interfaces on both ports (500 MHz data rate), and RadStop™ technology for space-grade applications including satellite command/data handling and onboard processors.

For engineers reviewing the CY7C2644KV18-300BZI datasheet, CY7C2644KV18-300BZI pinout, CY7C2644KV18-300BZI application, or CY7C2644KV18-300BZI equivalent, key selection criteria include radiation tolerance (200 Krad TID, >120 MeV·cm²/mg latch-up immunity), HSTL I/O compatibility (VDDQ = 1.4–1.8 V), dual echo clocks (CQ/CQ), and JTAG 1149.1 test access support.

Technical Context

This QDR II+ SRAM implements independent read and write ports with fully pipelined, synchronous operation-address latched on alternate rising edges of K/K clocks, data transferred on every rising edge of both clocks. Its two-word burst architecture eliminates address bus turnover and enables sustained 500 MT/s throughput per port.

The device integrates a PLL for precise data placement, ODT configurable for D[35:0], BWS[3:0], and K/K inputs, and QVLD to indicate valid output data timing. DOFF pin selects between 2.0-cycle (QDR II+) and 1.0-cycle (QDR I-compatible) read latency modes.

Key Specifications

Pinout & Package

Package: 165-ball CCGA (21 mm × 25 mm × 2.83 mm), RoHS-compliant, hermetically sealed ceramic column grid array optimized for thermal cycling resilience and radiation hardness.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed radiation-tolerant SRAM applications.

Compared with CY7C2644KV18-300BZI, the CY7C2642KV18-300BZI offers identical radiation hardness and timing but trades 36-bit width for 8M depth - ideal for address-intensive buffering. The IS61WV102432ALL-10BLI provides lower-cost QDR-II functionality but omits RadStop™, echo clocks, and ODT - making it unsuitable for flight-critical space applications.

Availability

CY7C2644KV18-300BZI is available at Aetrix Electronics and suitable for satellite telemetry buffering, spacecraft command execution units, and spaceborne AI inference accelerators requiring stable component supply, long-term obsolescence management, and radiation-hardened assurance.

Supply support for CY7C2644KV18-300BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-reliability memory portfolio, including radiation-hardened QDR SRAMs for aerospace and defense applications.

This device belongs to the RadStop™ QDR II+ SRAM product line, engineered specifically for mission-critical space electronics requiring guaranteed operation under extreme radiation, thermal, and vacuum conditions.

FAQ

What is the maximum data rate supported by CY7C2644KV18-300BZI?

The device supports 500 MT/s (mega-transfers per second) on both read and write ports due to double-data-rate operation at 250 MHz clock frequency. Each transfer corresponds to one 36-bit word, yielding 18 Gbps per port. This is achieved using separate DDR interfaces and echo clocks (CQ/CQ) for precise timing alignment.

Does CY7C2644KV18-300BZI require external termination resistors?

No. The device integrates programmable on-die termination (ODT) for D[35:0], BWS[3:0], and K/K inputs. When enabled via the ODT pin, internal 50-Ω terminations eliminate the need for external resistors, reducing PCB area, BOM cost, and routing complexity while maintaining signal integrity at 500 MHz.

How does the DOFF pin affect read latency behavior?

When DOFF is asserted high, the device operates in QDR II+ mode with 2.0-cycle read latency, optimizing bandwidth and timing margin. When DOFF is low, it reverts to QDR I-compatible 1.0-cycle latency - useful for legacy system compatibility or lower-power operation where reduced latency outweighs bandwidth trade-offs.

Is JTAG boundary scan supported, and what standard does it follow?

Yes, CY7C2644KV18-300BZI includes a fully compliant IEEE 1149.1 JTAG test access port (TAP) with TCK, TMS, TDI, and TDO pins. It supports boundary scan for production testing, in-system diagnostics, and verification of solder joint integrity in high-reliability CCGA assemblies.