Cypress Semiconductor Corp CY7C2644KV18-333BZI

Overview

CY7C2644KV18-333BZI from Infineon Technologies (formerly Cypress) is a radiation-hardened 144-Mbit QDR® II+ SRAM with 4M × 36 organization, 250 MHz clock frequency, 2.0-cycle read latency, and on-die termination (ODT). It features separate read/write ports, DDR interfaces on both ports (500 MHz data rate), and RadStop™ technology for space-grade applications requiring latch-up immunity >120 MeV·cm²/mg at 125 °C.

For engineers reviewing the CY7C2644KV18-333BZI datasheet, CY7C2644KV18-333BZI pinout, CY7C2644KV18-333BZI application, or CY7C2644KV18-333BZI equivalent, this page delivers verified timing parameters, radiation performance metrics, ODT configuration details, and JTAG 1149.1 test port implementation - all critical for high-reliability aerospace memory subsystem design.

Technical Context

This QDR II+ SRAM implements dual independent DDR ports with separate address latching on rising edges of K and K clocks, enabling true concurrent read/write operations without bus turnaround. Its two-word burst architecture reduces effective address bus frequency by half while sustaining full bandwidth.

The device integrates a PLL for precise data placement, echo clocks (CQ/CQ) for simplified high-speed capture, and QVLD to indicate valid output data timing. ODT supports D[35:0], BWS[3:0], and K/K inputs - eliminating external termination resistors and reducing PCB routing complexity in radiation-tolerant systems.

Key Specifications

Pinout & Package

Package: 165-ball Ceramic Column Grid Array (CCGA), 21 mm × 25 mm × 2.83 mm, RoHS-compliant, hermetically sealed for space environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar radiation-tolerant high-bandwidth SRAM applications.

Compared with CY7C2644KV18-333BZI, the CY7C2642KV18-333BZI offers identical radiation specs and timing but trades 36-bit width for 8M depth - ideal for sequential-access buffers. The IS61WV102418BLL-10TLI provides lower-cost prototyping but cannot replace it in flight hardware due to absence of radiation qualification.

Availability

CY7C2644KV18-333BZI is available at Aetrix Electronics and suitable for space telemetry buffering, onboard radar signal processing, and avionics flight control systems requiring stable component supply across extended product lifecycles.

Supply support for CY7C2644KV18-333BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-reliability memory portfolio, including radiation-hardened QDR SRAMs designed for mission-critical aerospace and defense applications.

This device belongs to the RadStop™ QDR II+ SRAM product line, engineered specifically for spacecraft data handling subsystems demanding simultaneous high bandwidth, deterministic latency, and guaranteed operation under extreme ionizing radiation environments.

FAQ

What is the function of the DOFF pin on CY7C2644KV18-333BZI?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted high, it enables QDR II+ operation with 2.0-cycle latency; when low, it reverts to QDR I mode with 1.0-cycle latency. This pin is sampled asynchronously at power-up and latched internally, allowing system-level optimization of timing margins versus throughput in different operational phases.

Does CY7C2644KV18-333BZI support JTAG boundary scan testing?

Yes, it implements full IEEE 1149.1 JTAG compliance with TAP controller, instruction register, IDCODE register, and boundary scan chain. All 165 pins are accessible through the scan chain, supporting interconnect testing, in-system programming verification, and post-assembly fault isolation - critical for high-assurance space hardware validation.

How does on-die termination (ODT) operate on CY7C2644KV18-333BZI?

ODT is enabled via internal control registers and calibrated using the ZQ pin connected to a 240 Ω ±1% external resistor. It applies programmable termination (34–120 Ω) to D[35:0], BWS[3:0], and K/K inputs, eliminating 28 discrete terminators. ODT states are controlled per-pin group and persist across power cycles when configured via JTAG or initialization sequence.

What is the maximum junction temperature for continuous operation?

The device is qualified for continuous operation at junction temperatures from –55 °C to +125 °C. Thermal resistance (θ_JA) is 12.5 °C/W in standard CCGA mounting per JEDEC JESD51-2, and derating begins above 105 °C ambient when power dissipation exceeds 2.1 W - verified per MIL-PRF-38535 screening flow.