Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Cypress Semiconductor Corp CY7S1041G30-10BVXI

Part No.:
CY7S1041G30-10BVXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7S1041G30-10BVXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,301

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7S1041G30-10BVXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16-bit) asynchronous static RAM with embedded Error Correcting Code (ECC), PowerSnooze™ deep-sleep mode, and TTL-compatible I/O. It delivers 10 ns access time at 2.2–3.6 V, supports 15 µA deep-sleep current, and operates across industrial temperature (–40°C to +85°C) in a 48-ball VFBGA (6 × 8 × 1.0 mm) package. It is used in mission-critical industrial controllers requiring error-resilient, low-power memory retention.

For engineers reviewing the CY7S1041G30-10BVXI datasheet, CY7S1041G30-10BVXI pinout, CY7S1041G30-10BVXI application, or CY7S1041G30-10BVXI equivalent, key selection criteria include ECC-enabled single-bit error correction, 10 ns access timing at 3.0 V, 15 µA deep-sleep current, byte-selectable writes via BHE/ BLE, and VFBGA package compatibility with high-density PCB layouts.

Technical Context

The CY7S1041G30-10BVXI implements a synchronous-free, fully asynchronous SRAM architecture with dedicated ECC encoder/decoder logic that detects and corrects single-bit errors on read access without automatic write-back. Its PowerSnooze™ mode activates via the DS pin, reducing current to 15 µA while retaining data at 1.0 V.

It supports three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); this variant is rated for 2.2–3.6 V operation with 10 ns tAA. Byte enable control (BHE/ BLE) enables independent upper/lower 8-bit writes, and the ERR pin - absent in this BVXI variant - is omitted per ordering code suffix "G" (vs. "GE").

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K words × 16 bits = 4 Mbit; supports full-word or byte-aligned access without external glue logic.
Access Time (tAA) 10 ns at VCC = 3.0 V; enables direct interfacing with 100 MHz microcontrollers without wait states.
Deep-Sleep Current (IDS) 15 µA max at VCC = 3.6 V; sustains data retention during extended system sleep in battery-backed industrial nodes.
ECC Functionality Detects and corrects single-bit errors per 16-bit word on read; no automatic write-back - correction occurs transparently in read path.
Supply Voltage Range 2.2 V to 3.6 V; compatible with 3.3 V logic families and mixed-voltage SoC interfaces.
Operating Temperature –40°C to +85°C industrial grade; validated for use in programmable logic controllers and motor drives.
Package 48-ball VFBGA (6 × 8 × 1.0 mm, JEDEC-compliant BVXI footprint); supports fine-pitch routing and thermal dissipation via bottom-side solder balls.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm height, JEDEC-compliant BVXI footprint (I/O[7:0] and I/O[15:8] ball mapping matches JEDEC standard).

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256K-word addressing; internally decoded for row/column selection.
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; supports simultaneous full-word or byte-selectable transfers via BHE/ BLE.
CE Chip Enable Active-low global enable; places device in standby (ISB2 = 6 mA typ) when deasserted, enabling power gating.
WE Write Enable Active-low write strobe; initiates write cycle when CE and WE both low; controls data latch timing.
OE Output Enable Active-low read strobe; enables output drivers only when CE and OE are low; prevents bus contention.
BHE / BLE Byte Enable Controls BHE enables I/O8–I/O15 (upper byte); BLE enables I/O0–I/O7 (lower byte); allows partial-word writes without read-modify-write.
DS Deep-Sleep Input Active-low entry to ultra-low-power mode; asserts internal retention circuitry and disables all I/O drivers.
VCC / VSS Power / Ground Dual VCC pins (Balls A7, C3) and multiple VSS balls (A17, B6, C6, D1, E1, F1) reduce IR drop and improve noise immunity.
NC No Connect Balls D2, D3, E2, E3, F2, G2, G3, H2, H3 are unconnected; must be left floating or grounded per layout guidelines.

Key Features

Feature Design Value
Embedded ECC Logic Hardware-based single-bit error detection and correction per 16-bit word, eliminating need for external error-handling firmware overhead.
PowerSnooze™ Deep-Sleep Mode 15 µA max IDS enables >1-year battery-backed data retention in remote sensor nodes without refresh circuitry.
Multi-Voltage Operation Supports 2.2–3.6 V range with guaranteed 10 ns access, simplifying integration into 3.3 V systems with margin for voltage droop.
Byte-Selectable Write Architecture BHE/ BLE pins allow independent 8-bit writes - critical for efficient stack/queue operations in real-time OS environments.
VFBGA Thermal & Density Advantage 48-ball VFBGA offers 31.35°C/W θJA (vs. 68.85°C/W for TSOP II), enabling higher ambient operation in compact enclosures.

Applications

Industrial PLC Memory Buffer Medical Diagnostic Imaging Cache

Use Scenario: Stores real-time I/O scan data and ladder logic state variables in programmable logic controllers with strict uptime requirements.

IC Role / Device Role / Timing Role: Asynchronous SRAM buffer between ARM Cortex-M7 CPU and fieldbus interface ASIC; provides zero-wait-state access at 100 MHz burst rate.

Use Value: ECC prevents silent data corruption in safety-critical control loops; 15 µA deep-sleep current extends backup battery life during brownout events.

Use Scenario: Caches raw pixel frames from X-ray detector arrays prior to FPGA-based compression and transmission.

IC Role / Device Role / Timing Role: High-speed frame buffer interfacing directly with FPGA DDR3 controller using byte-enable writes for partial line updates.

Use Value: 10 ns access time minimizes pipeline stalls during multi-channel image acquisition; VFBGA package enables tight trace routing near high-speed ADCs.

Railway Signaling Data Logger Avionics Health Monitor RAM

Use Scenario: Logs GPS-synchronized event timestamps and sensor fault codes in EN 5012x-certified train control units.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding last-known-good configuration and fault history; retains data at 1.0 V during main power loss.

Use Value: Embedded ECC ensures integrity of logged safety records over 15+ year service life; industrial temp rating supports under-hood mounting.

Use Scenario: Stores flight-critical health metrics (voltage, temperature, vibration) sampled by A/D converters in DO-160G-certified avionics modules.

IC Role / Device Role / Timing Role: Low-power SRAM acting as scratchpad for ARM Cortex-R5F safety core; accessed via tightly coupled memory interface.

Use Value: 15 µA deep-sleep current meets RTCA DO-254 power budget constraints; 48-ball VFBGA meets IPC-7351B density requirements for 6-layer boards.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV25616EDBLL-10MLI No embedded ECC; 10 ns access at 3.3 V; 25 µA deep-sleep current; 48-ball TFBGA package. Lacks hardware ECC - requires software-level error checking or external ECC controller for safety-critical use. Select when cost sensitivity outweighs ECC requirement and system-level error mitigation is already implemented.
Micron MT45W8MW16BGX-107 IT:D DDR2 SDRAM (not SRAM); 107 MHz clocked interface; no deep-sleep mode; 150 µA self-refresh current. Requires clock, command/address bus, and refresh management - incompatible with asynchronous MCU interfaces. Choose only for bandwidth-intensive applications where synchronous DRAM architecture aligns with host controller capabilities.

Compared with IS61WV25616EDBLL-10MLI and MT45W8MW16BGX-107 IT:D, the CY7S1041G30-10BVXI uniquely combines true asynchronous operation, hardware ECC, and sub-20 µA deep-sleep - making it the sole option for deterministic, low-power, error-resilient SRAM in safety-certified embedded systems.

Availability

CY7S1041G30-10BVXI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, railway data loggers, and avionics health monitors requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.

Supply support for CY7S1041G30-10BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-reliability memory solutions.

This device belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for industrial and transportation applications demanding error-resilient, low-power, asynchronous memory with extended temperature and voltage tolerance.

FAQ

Does CY7S1041G30-10BVXI support automatic error correction write-back?

No. The embedded ECC logic detects and corrects single-bit errors during read operations only. Corrected data remains in the sense amplifier but is not automatically written back to the memory array. System firmware must initiate explicit write cycles if persistent correction is required. This behavior is documented in Note 1 of the datasheet and applies to all CY7S1041G variants.

What is the function of the DS pin, and how does it differ from CE or OE?

The DS (Deep-Sleep) pin is an active-low input that places the device into ultra-low-power data retention mode (IDS ≤ 15 µA), disabling all I/O drivers and internal logic except the retention circuit. Unlike CE (which enables standby mode at ~6 mA) or OE (which controls output drivers only), DS cuts power to the entire memory core while preserving stored data at 1.0 V.

Is the ERR pin present on CY7S1041G30-10BVXI?

No. The "G" suffix in CY7S1041G30-10BVXI indicates the non-ERR version. Only parts with "GE" in the ordering code (e.g., CY7S1041GE30-10BVXI) include the ERR output pin for 1-bit error indication. This variant uses the BVXI package without ERR pin connection, as confirmed in Figures 4–5 of the datasheet.

Can CY7S1041G30-10BVXI operate at 1.8 V?

No. This specific variant (suffix "30") is rated for 2.2 V to 3.6 V operation only. While the CY7S1041G family includes a 1.65–2.2 V speed grade (e.g., CY7S1041G18), the "30" designation confirms 10 ns timing at 3.0 V nominal, and operation below 2.2 V violates the specified VCC min and may cause timing violations or data retention failure.

CY7S1041G30-10BVXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7S1041G30-10BVXI FAQ

1.How can I place an order for CY7S1041G30-10BVXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7S1041G30-10BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7S1041G30-10BVXI reliable?

The price and inventory of CY7S1041G30-10BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7S1041G30-10BVXI is usually 5 days.

3.What payment methods are accepted for CY7S1041G30-10BVXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7S1041G30-10BVXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7S1041G30-10BVXI?

CY7S1041G30-10BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7S1041G30-10BVXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7S1041G30-10BVXI?

For technical support, including CY7S1041G30-10BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7S1041G30-10BVXI requirements.

6.How does Aetrix verify that CY7S1041G30-10BVXI is sourced from the original manufacturer or authorized distributors?

All CY7S1041G30-10BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7S1041G30-10BVXI meets industry standards.

7.What is the process for return or replacement of CY7S1041G30-10BVXI?

All CY7S1041G30-10BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7S1041G30-10BVXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7S1041G30-10BVXI part is unused and in its original packaging.

Return procedure for CY7S1041G30-10BVXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7S1041G30-10BVXI Tags

  • CY7S1041G30-10BVXI
  • CY7S1041G30-10BVXI PDF
  • CY7S1041G30-10BVXI Datasheet
  • CY7S1041G30-10BVXI Specifications
  • CY7S1041G30-10BVXI Images
  • Cypress Semiconductor Corp
  • Cypress Semiconductor Corp CY7S1041G30-10BVXI
  • Buy CY7S1041G30-10BVXI
  • CY7S1041G30-10BVXI Price
  • CY7S1041G30-10BVXI Distributor
  • CY7S1041G30-10BVXI Supplier
  • CY7S1041G30-10BVXI Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER