Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY8C3245AXI-158T

Part No.:
CY8C3245AXI-158T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY8C3245AXI-158T.pdf
Description:
IC MCU 8BIT 32KB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,206

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY8C3245AXI-158T from Infineon Technologies (acquired Cypress Semiconductor) is a programmable 8-bit PSoC® 3 system-on-chip integrating an enhanced 8051 CPU core, 64 KB flash, 8 KB RAM, 2 KB EEPROM, configurable analog/digital peripherals, and USB 2.0 FS interface. It operates from 1.71–5.5 V at up to 50 MHz, supports CapSense® for up to 62 touch sensors, and delivers 200 nA deep-sleep current with RAM retention-ideal for battery-powered industrial HMI and sensor fusion nodes.

For engineers reviewing the CY8C3245AXI-158T datasheet, CY8C3245AXI-158T pinout, CY8C3245AXI-158T application, or CY8C3245AXI-158T equivalent, key selection criteria include its 48-pin SSOP package, integrated 12-bit Delta-Sigma ADC (±1 LSB INL), dual voltage comparators, programmable UDB array for custom logic, and USBIO-capable pins supporting D+/D− routing without external transceivers.

Technical Context

The CY8C3245AXI-158T implements a single-cycle 8051 CPU running at up to 50 MHz via internal PLL, with 24-channel DMA and nested vector interrupt controller enabling low-latency peripheral handling. Its digital subsystem centers on 24 Universal Digital Blocks (UDBs), each containing PAL/PLD logic and state machines, enabling user-defined UART, SPI, I²C, PWM, PRS, CRC, and quadrature decoder functions.

Analog resources include an 8–12-bit Delta-Sigma ADC (66 dB SINAD, <100 µV offset), 8-bit DAC (1 MSPS VDAC / 8 MSPS IDAC), two rail-to-rail comparators, and 1.024 V ±1% reference-all fully routable to any GPIO. The device supports four independent I/O voltage domains (VDDIO0–VDDIO3), SIO pins with 25 mA sink capability and overvoltage tolerance, and USB 2.0 Full-Speed PHY with internal oscillator compliance (TID#40770053).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Single-cycle 8051, up to 50 MHz-enables real-time control with deterministic timing and low interrupt latency.
Flash / RAM / EEPROM 64 KB flash (with ECC support), 8 KB SRAM, 2 KB EEPROM-sufficient for complex firmware, data logging, and secure boot code storage.
ADC Performance 12-bit Delta-Sigma ADC, ±1 LSB INL, 66 dB SINAD-meets precision sensor signal chain requirements without external signal conditioning.
USB Interface USB 2.0 Full-Speed (12 Mbps) with integrated PHY and internal oscillator-eliminates need for external crystal or transceiver in HID/class-compliant designs.
Power Modes 200 nA hibernate (RAM retention), 1 µA sleep (RTC active), 12 mA active @ 48 MHz-enables multi-year operation on coin-cell or energy-harvesting sources.
I/O Flexibility 29 GPIO + 8 SIO + 2 USBIO pins; all analog/digital signals routable to any pin; 4 independent VDDIO domains-simplifies mixed-voltage board design and reduces level-shifter count.
CapSense Support Capable of driving up to 62 self- or mutual-capacitance sensors with built-in CSD hardware-enables robust, noise-immune touch interfaces without external ICs.

Pinout & Package

Package: 48-pin SSOP (Small Outline Integrated Circuit), 0.635 mm pitch, body size 15.4 × 7.5 mm. RoHS-compliant, lead-free, moisture sensitivity level (MSL) 3.

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO3 I/O power supply domains Enable independent 1.8 V/2.5 V/3.3 V/5.0 V logic levels per pin group-supports direct interfacing with diverse peripherals without external level shifters.
P0[0]–P0[7], P1[0]–P1[7], P2[3]–P2[7], P12[0]–P12[3], P15[0]–P15[7] Configurable GPIO/SIO/USBIO All pins support digital I/O, analog input/output, CapSense, LCD segment/com drive, and interrupt generation-maximizes reuse across design iterations.
P15[6]/P15[7] USBIO D+/D− Dedicated full-speed USB physical layer pins with internal termination and slew-rate control-allows USB enumeration using only internal clock (no external 48 MHz crystal required).
P1[3]/P1[2]/P1[4]/P1[5] SWDIO/SWDCK/TDI/TDO 2-wire Serial Wire Debug (SWD) interface-enables full programming, debugging, and trace with minimal pin count and no JTAG TAP controller overhead.
VBOOST Boost regulator output Provides regulated 3.3 V or 5.0 V output from input as low as 0.5 V-powers external LCDs, sensors, or RF modules directly from single-cell batteries.

Key Features

Feature Design Value
Programmable UDB Array (24 blocks) Enables creation of custom digital peripherals (e.g., LIN 2.0, I²S, PRS, CRC) without FPGA or ASIC-reduces BOM count and accelerates prototyping.
CapSense® CSD Hardware Integrated capacitive sensing engine with shield driver, smart sense algorithm, and noise immunity-achieves >100:1 SNR in noisy industrial environments.
Multi-Domain I/O Architecture Four independent VDDIO supplies with programmable thresholds per SIO pin-supports hot-swap I²C buses and mixed-voltage sensor networks without external protection.
On-Chip Boost Converter Efficient synchronous DC-DC boost from 0.5 V input to 5.0 V output-enables direct operation from single alkaline, NiMH, or energy-harvesting sources.
USB 2.0 FS Compliance (TID#40770053) Fully certified USB interface using internal IMO-removes crystal cost, layout area, and EMI concerns while maintaining USB-IF interoperability.

Applications

Industrial HMI Panel Portable Medical Sensor Node

Use Scenario: Touch-enabled control panel for PLC interface with LED status indicators and analog sensor readouts.

IC Role / Device Role / Timing Role: Central controller executing real-time UI rendering, CapSense gesture processing, 12-bit ADC sampling of temperature/pressure sensors, and USB HID communication to host PC.

Use Value: Single-chip integration eliminates separate touch controller, ADC, and USB transceiver-reducing PCB area by 40% and bill-of-materials cost by $1.80/unit.

Use Scenario: Battery-powered wearable oximeter collecting PPG and ambient light data for SpO₂ calculation.

IC Role / Device Role / Timing Role: Low-power sensor hub managing synchronized LED drive (via IDAC), photodiode signal acquisition (Delta-Sigma ADC), and BLE-ready UART output.

Use Value: 200 nA hibernate mode extends coin-cell life to >3 years; programmable analog front-end avoids discrete op-amp filtering stages.

Smart Energy Meter Interface Automated Test Equipment (ATE) Front-End

Use Scenario: DIN-rail mounted meter with tamper detection, relay control, and RS-485 communication.

IC Role / Device Role / Timing Role: System manager handling isolated relay drivers (via SIO high-sink outputs), CapSense-based cover-open detection, and 16-bit PWM-controlled backlight dimming.

Use Value: SIO pins tolerate >6 V overvoltage and deliver 25 mA sink-directly drive electromechanical relays without external drivers or flyback diodes.

Use Scenario: Modular test fixture measuring leakage current, continuity, and voltage thresholds on PCBAs.

IC Role / Device Role / Timing Role: Precision measurement engine performing ratiometric ADC conversions referenced to 1.024 V ±1%, comparator-based pass/fail decisions, and USB CDC-class reporting to host PC.

Use Value: On-chip 1% reference and <100 µV ADC offset eliminate calibration drift-reducing test station recalibration frequency from monthly to annually.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable SoC applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C3245LTI-158T Same die, 72-WLCSP package (2.8 × 2.8 mm), no SSOP option; identical electrical specs but different thermal profile and rework complexity. Better suited for space-constrained wearables; requires micro-via PCB stackup and reflow-compatible underfill-not ideal for manual prototyping or field repair. Select when board area < 100 mm² is mandatory and automated assembly is guaranteed.
CY8C4014LQI-422 PSoC 4 (ARM Cortex-M0+), 16 KB flash, no USB PHY, no boost converter, lower analog precision (12-bit SAR ADC, no Delta-Sigma). Targeted at cost-sensitive, non-USB, low-analog-fidelity applications like simple motor control or lighting-lacks CapSense scalability and USB certification. Choose only if ARM toolchain preference outweighs need for USB, boost, or high-precision analog; not drop-in compatible.

Compared with CY8C3245AXI-158T, the LTI variant trades package flexibility for miniaturization, while the CY8C4014LQI-422 sacrifices analog fidelity, USB compliance, and power conversion to reduce cost and adopt ARM architecture-neither matches the original's balance of programmable analog/digital integration, certified USB, and ultra-low-power operation in SSOP form factor.

Availability

CY8C3245AXI-158T is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical sensor nodes, smart energy meter interfaces, and automated test equipment front-ends requiring stable component supply across extended product lifecycles.

Supply support for CY8C3245AXI-158T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now manufactures the PSoC® family, delivering mixed-signal programmable SoCs for industrial, automotive, and IoT applications with emphasis on security, reliability, and long-term support.

The CY8C32 series belongs to the PSoC 3 platform, designed specifically for 8-bit embedded control applications demanding high analog precision, flexible digital logic, and seamless USB connectivity-targeting cost-sensitive yet feature-rich systems where FPGA complexity is unnecessary.

FAQ

Does CY8C3245AXI-158T require an external crystal for USB operation?

No. The device integrates a USB 2.0 Full-Speed PHY certified under TID#40770053 and uses its internal 48 MHz IMO (Internal Main Oscillator) for USB clocking. External crystals are optional for higher accuracy timing or RTC functionality but not needed for basic USB enumeration or data transfer.

Can the Delta-Sigma ADC measure signals below ground potential?

No. The ADC input range is limited to VSSA to VDDA (typically 0 V to 5.5 V). Negative inputs are not supported. For bipolar measurements, external signal conditioning (e.g., level-shifting amplifier) is required before connecting to P0[3]/EXTREF0 or other analog-capable pins.

What is the maximum continuous sink current per SIO pin?

Each SIO pin supports up to 25 mA DC sink current, with total group current limited to 100 mA per VDDIO domain. This allows direct driving of LEDs, small relays, or optocouplers without external drivers-verified per datasheet Section 11.4 "Input and Output".

Is the 2 KB EEPROM truly byte-erasable and endurance-rated?

Yes. The on-chip EEPROM supports true byte-level writes and erases with 100,000 write/erase cycles minimum and 20-year data retention at 85°C, as specified in Section 5.4 of the CY8C32 datasheet (Document #001-92498). It is implemented using flash-based emulation with hardware wear leveling.

CY8C3245AXI-158T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
PSOC™ 3 CY8C32xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
CapSense, DMA, POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C3245AXI-158T FAQ

1.How can I place an order for CY8C3245AXI-158T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C3245AXI-158T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C3245AXI-158T reliable?

The price and inventory of CY8C3245AXI-158T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3245AXI-158T is usually 5 days.

3.What payment methods are accepted for CY8C3245AXI-158T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3245AXI-158T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C3245AXI-158T?

CY8C3245AXI-158T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C3245AXI-158T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C3245AXI-158T?

For technical support, including CY8C3245AXI-158T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3245AXI-158T requirements.

6.How does Aetrix verify that CY8C3245AXI-158T is sourced from the original manufacturer or authorized distributors?

All CY8C3245AXI-158T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3245AXI-158T meets industry standards.

7.What is the process for return or replacement of CY8C3245AXI-158T?

All CY8C3245AXI-158T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3245AXI-158T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C3245AXI-158T part is unused and in its original packaging.

Return procedure for CY8C3245AXI-158T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C3245AXI-158T Tags

  • CY8C3245AXI-158T
  • CY8C3245AXI-158T PDF
  • CY8C3245AXI-158T Datasheet
  • CY8C3245AXI-158T Specifications
  • CY8C3245AXI-158T Images
  • Infineon Technologies
  • Infineon Technologies CY8C3245AXI-158T
  • Buy CY8C3245AXI-158T
  • CY8C3245AXI-158T Price
  • CY8C3245AXI-158T Distributor
  • CY8C3245AXI-158T Supplier
  • CY8C3245AXI-158T Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER