My Inquiry
My Account
Infineon Technologies CY8C3446LTI-085T
- Part No.:
- CY8C3446LTI-085T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C3446LTI-085T.pdf
- Description:
- IC MCU 8BIT 64KB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,359
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C3446LTI-085T from Infineon Technologies (formerly Cypress Semiconductor) is a programmable 8-bit PSoC® 3 system-on-chip integrating an 8051 CPU, 64 KB flash, 8 KB RAM, full CAN 2.0b interface, USB 2.0 Full-Speed peripheral, and configurable analog/digital peripherals on a single die. It operates from 1.71–5.5 V across –40 to +85 °C, supports up to 50 MHz clocking via internal PLL, and targets embedded control in industrial sensing and automotive body electronics.
For engineers reviewing the CY8C3446LTI-085T datasheet, CY8C3446LTI-085T pinout, CY8C3446LTI-085T application, or CY8C3446LTI-085T equivalent, key selection criteria include its integrated CAN 2.0b controller with 16 Rx/8 Tx buffers, CapSense® support for up to 62 sensors, ultra-low-power hibernate mode (200 nA with RAM retention), and flexible routing of any peripheral to any GPIO.
Technical Context
The CY8C3446LTI-085T implements a highly configurable mixed-signal architecture centered on an enhanced 8051 core running at up to 50 MHz, supported by a 24-channel DMA controller and programmable digital subsystem based on 24 Universal Digital Blocks (UDBs). Its analog subsystem includes a configurable delta-sigma ADC (8–12-bit), two opamps, four comparators, two 8-bit DACs, and two programmable SC/CT blocks for PGA/TIA/mixer functions.
It features dual clock domains with a precision IMO (3–62 MHz, ±2% at 3 MHz), external crystal oscillator (4–25 MHz), 32.768-kHz RTC oscillator, and low-power ILO (1/33/100 kHz). Power management includes boost regulator (0.5–5 V), six independent power domains, and three low-power modes: Active (1.2 mA @ 6 MHz), Sleep (1 µA), and Hibernate (200 nA with RAM retention).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Enhanced 8-bit 8051, up to 50 MHz - enables deterministic real-time control with minimal code footprint and legacy toolchain compatibility. |
| Memory | 64 KB flash (with cache/security), 8 KB SRAM, 2 KB EEPROM - supports secure firmware updates, data logging, and bootloader storage without external memory. |
| CAN Interface | Full CAN 2.0b compliant, 16 Rx + 8 Tx buffers - handles high-priority vehicle network messaging with hardware message filtering and FIFO buffering. |
| Analog Peripherals | Configurable 8–12-bit delta-sigma ADC, two 8-bit DACs, four comparators, two opamps - enables sensor signal conditioning, closed-loop analog control, and precision measurement without external ICs. |
| I/O System | Up to 62 GPIOs with flexible routing, 8 SIO pins (25 mA sink, overvoltage tolerant), USBIO pins - allows direct connection to diverse sensors, actuators, and USB hosts while simplifying PCB layout. |
| Power Modes | Active (1.2 mA @ 6 MHz), Sleep (1 µA), Hibernate (200 nA w/ RAM retention) - extends battery life in portable and energy-harvested systems with fast wake-up from deep sleep. |
| Operating Range | 1.71–5.5 V supply, –40 to +85 °C ambient - supports wide-input industrial power rails and operation in harsh environmental conditions. |
Pinout & Package
Package: 68-pin QFN (9 mm × 9 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad. RoHS-compliant, lead-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Domains | Four independent 1.2–5.5 V I/O supply rails enabling mixed-voltage interfacing (e.g., 1.8 V logic with 3.3 V sensors). |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Configurable GPIO / Peripheral Pins | 62 general-purpose pins; each supports analog/digital routing, CapSense®, LCD drive, or USBIO function via firmware configuration. |
| USB_DP / USB_DM | USB 2.0 Full-Speed Differential Pair | Dedicated pins for 12 Mbps USB communication; require no external transceiver and support internal oscillator-based timing. |
| CAN_TX / CAN_RX | CAN 2.0b Physical Layer Interface | Direct connection to external CAN transceiver; integrated protocol engine handles bit timing, arbitration, and error handling in hardware. |
| XRES | External Reset Input | Active-low asynchronous reset pin with internal pull-up; compatible with standard microcontroller reset circuits and watchdog outputs. |
| SWDCK / SWDIO | Serial Wire Debug Interface | 2-wire debug interface supporting programming, real-time trace, and breakpoints without consuming GPIO resources. |
Key Features
| Feature | Design Value |
|---|---|
| CapSense® Support | Hardware-accelerated capacitive touch sensing on up to 62 GPIOs - eliminates need for external touch controllers and reduces BOM cost in HMI applications. |
| Programmable Analog Blocks | Two SC/CT blocks configurable as PGA, TIA, mixer, or sample-and-hold - enables custom front-end signal conditioning for current/voltage/impedance sensing. |
| Flexible Clocking | 12 routable clock dividers feeding any peripheral or I/O - allows independent timing domains for USB, CAN, ADC sampling, and PWM generation without clock contention. |
| UDB-Based Digital Logic | 24 Universal Digital Blocks implementing UART, SPI, LIN, CRC, PRS, quadrature decoder, or gate-level logic - replaces discrete logic ICs and enables rapid firmware-defined peripheral expansion. |
| Integrated Bootloader | Field-upgradable firmware via I2C, SPI, UART, or USB - supports secure over-the-air (OTA) updates and eliminates need for dedicated programming hardware in production. |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle systems. IC Role / Device Role / Timing Role: Main system controller with integrated CAN 2.0b for vehicle bus communication, CapSense® for touch-sensitive controls, and analog peripherals for potentiometer and temperature monitoring. Use Value: Reduces component count by consolidating MCU, CAN PHY interface logic, touch controller, and analog front-end into one chip, lowering PCB area and qualification effort. |
Use Scenario: Battery-powered wireless node measuring pressure, humidity, and temperature in factory automation environments. IC Role / Device Role / Timing Role: Low-power sensor hub performing analog signal acquisition (delta-sigma ADC), local processing, and data aggregation before transmission via UART-to-LoRa bridge. Use Value: 200 nA hibernate mode with RAM retention enables multi-year battery life; integrated opamps and comparators eliminate external signal conditioning components. |
| Medical Patient Monitor Front-End | Smart Home Appliance Control |
|
Use Scenario: Portable ECG or pulse oximetry device requiring precise analog front-end, patient isolation, and intuitive touch interface. IC Role / Device Role / Timing Role: Signal acquisition and preprocessing unit using programmable SC/CT blocks as TIAs for photodiode inputs, delta-sigma ADC for digitization, and CapSense® for non-mechanical button replacement. Use Value: Single-chip integration meets medical-grade noise immunity requirements while reducing design validation scope versus multi-IC solutions. |
Use Scenario: Washing machine or HVAC control panel with touch interface, motor control, and temperature feedback. IC Role / Device Role / Timing Role: Main application controller managing user input (CapSense®), motor PWM (TCPWM blocks), thermistor reading (ADC), and relay driving (GPIO + SIO pins). Use Value: 25 mA sink capability on SIO pins drives relays directly; flexible routing allows identical firmware across multiple board variants with different pin layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C3866AXI-063 | Higher memory (128 KB flash, 16 KB RAM), 100-pin TQFP package, same PSoC 3 architecture and peripheral set. | Targets more complex firmware with larger code/data footprints and higher I/O count requirements. | Select when >64 KB flash or >62 GPIOs are required; pinout and software are not compatible due to package and routing differences. |
| STM32F072RBT6 | ARM Cortex-M0 core, 128 KB flash, 16 KB RAM, integrated USB/CAN, but no configurable analog blocks or CapSense®. | Suitable for digital-centric control where analog flexibility is secondary to ARM ecosystem and tooling. | Choose when leveraging STM32CubeMX, HAL libraries, or existing ARM firmware; lacks hardware-accelerated capacitive sensing and programmable analog. |
Compared with CY8C3446LTI-085T, CY8C3866AXI-063 offers greater memory and I/O scalability within the same PSoC 3 architecture, while STM32F072RBT6 provides ARM toolchain advantages but requires external analog components and lacks CapSense® integration.
Availability
CY8C3446LTI-085T is available at Aetrix Electronics and suitable for industrial sensor nodes, automotive body electronics, medical front-ends, and smart appliance control requiring stable component supply, long-term lifecycle support, and qualified automotive-grade operation.
Supply support for CY8C3446LTI-085T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, industrial, and security solutions.
CY8C3446LTI-085T belongs to the PSoC® 3 family - designed specifically for ultra-low-power, highly integrated embedded control applications requiring both programmable analog and digital functionality in a single chip.
FAQ
Does CY8C3446LTI-085T support USB device enumeration without an external crystal?
Yes. The device integrates an internal oscillator certified for USB 2.0 Full-Speed (12 Mbps) operation, eliminating the need for an external 12 MHz crystal. This oscillator meets USB timing jitter requirements per TID#40770053, enabling simplified USB connectivity in space-constrained designs.
What is the maximum number of CapSense® sensors supported on this part?
CY8C3446LTI-085T supports up to 62 CapSense® sensors using any GPIO pin, enabled by dedicated hardware scanning engine and shield driver capability. Sensor count is limited only by available pins and mutual-capacitance layout constraints-not by firmware or resource allocation.
Can the internal boost regulator power the entire chip from a 0.5 V source?
No. The boost regulator generates up to 5 V output from ≥0.5 V input, but it powers only specific analog and I/O domains. The CPU and digital subsystem require a separate 1.71–5.5 V supply (VDDD). The boost regulator is intended for auxiliary analog rails or external sensor biasing-not main system power.
Is CAN FD supported on CY8C3446LTI-085T?
No. The integrated CAN controller complies strictly with ISO 11898-1:2003 (CAN 2.0b), supporting only classic 11-bit identifiers and up to 8 bytes per frame. CAN FD features such as extended data length and flexible bit rate are not implemented in the PSoC 3 CAN peripheral.
CY8C3446LTI-085T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 3 CY8C34xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 50MHz
- Connectivity:
- EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C3446LTI-085T FAQ
1.How can I place an order for CY8C3446LTI-085T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C3446LTI-085T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C3446LTI-085T reliable?
The price and inventory of CY8C3446LTI-085T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3446LTI-085T is usually 5 days.
3.What payment methods are accepted for CY8C3446LTI-085T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3446LTI-085T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C3446LTI-085T?
CY8C3446LTI-085T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C3446LTI-085T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C3446LTI-085T?
For technical support, including CY8C3446LTI-085T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3446LTI-085T requirements.
6.How does Aetrix verify that CY8C3446LTI-085T is sourced from the original manufacturer or authorized distributors?
All CY8C3446LTI-085T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3446LTI-085T meets industry standards.
7.What is the process for return or replacement of CY8C3446LTI-085T?
All CY8C3446LTI-085T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3446LTI-085T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C3446LTI-085T part is unused and in its original packaging.
Return procedure for CY8C3446LTI-085T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C3446LTI-085T Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
