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Infineon Technologies CY8C3665LTI-044
- Part No.:
- CY8C3665LTI-044
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C3665LTI-044.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:750
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Product details
Overview
CY8C3665LTI-044 from Infineon Technologies is a PSoC™ 3 programmable system-on-chip featuring an 8051 CPU core, 64 KB flash, 8 KB SRAM, and integrated CapSense® capacitive sensing, analog (12-bit SAR ADC, opamps, comparators), and digital (PLD-based UDBs) peripherals. It operates at up to 67 MHz and supports USB 2.0 full-speed device functionality. Used in human interface devices such as touch-enabled industrial HMIs and consumer control panels.
For engineers reviewing the CY8C3665LTI-044 datasheet, CY8C3665LTI-044 pinout, CY8C3665LTI-044 application, or CY8C3665LTI-044 equivalent, key selection criteria include CapSense® noise immunity, USB device stack compatibility, on-chip analog routing flexibility, and 5 V-tolerant I/O for legacy interface integration.
Technical Context
The CY8C3665LTI-044 implements a configurable mixed-signal architecture centered on the 8051 CPU with hardware-accelerated USB 2.0 PHY and endpoint controller. Its Universal Digital Blocks (UDBs) enable custom logic synthesis-including state machines, PWM generators, and serial protocols-without FPGA-level complexity.
Analog subsystem includes a 12-bit SAR ADC with up to 1 Msps sampling rate, four rail-to-rail opamps, two comparators with hysteresis, and a programmable IDAC (0.1–12 mA). CapSense® supports up to 64 self- or mutual-capacitance sensors with built-in baseline tracking and noise rejection algorithms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 8051-compatible, 67 MHz max clock; enables deterministic real-time control with low interrupt latency. |
| Flash / SRAM | 64 KB flash (in-system reprogrammable), 8 KB SRAM; sufficient for USB HID firmware + CapSense® tuning + sensor fusion logic. |
| CapSense® Channels | Up to 64 capacitive sensing inputs; supports slider, proximity, and gesture detection without external components. |
| ADC | 12-bit SAR, 1 Msps, 16-channel mux; suitable for simultaneous analog sensor acquisition (e.g., temperature, voltage monitoring). |
| USB Interface | Full-speed (12 Mbps) USB 2.0 device-only PHY + controller; eliminates need for external USB transceiver or protocol stack offload. |
| I/O Voltage | 5 V-tolerant GPIO (up to 36 pins); allows direct interfacing with industrial 5 V logic, encoders, and legacy displays. |
| Operating Temp | –40°C to +85°C; qualified for extended industrial environments including factory automation and building controls. |
Pinout & Package
Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved power dissipation in continuous analog/USB operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | General-purpose I/O bank 0 | Supports CapSense® CSD, analog input, or digital functions; all pins 5 V-tolerant and configurable pull-up/down. |
| P1[0]–P1[7] | General-purpose I/O bank 1 | Includes dedicated USB D+ and D− pins; also supports opamp output, comparator input, and IDAC sink/source. |
| VDDA / VSSA | Analog power supply / ground | Separate analog domain (2.7–5.5 V) decoupled from digital rails to maintain ADC/CapSense® SNR > 60 dB. |
| XRES | External reset input | Active-low asynchronous reset; internal pull-up ensures reliable boot without external resistor. |
| XTAL_IN / XTAL_OUT | Crystal oscillator terminals | Supports 1–33 MHz crystal; internal load caps reduce BOM count; optional internal IMO (internal main oscillator) at 3–67 MHz. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Analog Block (PAB) | Four independent opamps with selectable gain (1–16×), rail-to-rail I/O, and configurable feedback paths for sensor signal conditioning. |
| Universal Digital Blocks (UDBs) | Eight UDBs provide 24 macrocells each; enable custom logic like quadrature decoder, multi-phase PWM, or SPI slave with DMA-triggered response. |
| CapSense® CSD v3.0 | Hardware-accelerated capacitive sensing engine with automatic baseline restoration, shield driver, and spread-spectrum modulation for EMI robustness. |
| USB 2.0 Full-Speed Device | Integrated PHY and endpoint controller support up to 8 bidirectional endpoints; compatible with standard USB HID, CDC, and MSC class drivers. |
| Low-Power Modes | Five sleep modes (including Hibernate with RAM retention at 1 µA); wake-up via CapSense®, GPIO, or USB resume for battery-powered UI devices. |
Applications
| Industrial HMI Panel | Smart Appliance Control |
|---|---|
|
Use Scenario: Touch-sensitive operator interface on PLC-mounted control panel with LED status indicators and rotary encoder input. IC Role / Device Role / Timing Role: Central MCU handling CapSense® button/slider inputs, driving 8-segment LEDs via GPIO, managing USB HID reports to host PC, and monitoring analog temperature sensor. Use Value: Single-chip integration eliminates separate touch controller, USB transceiver, and analog front-end ICs-reducing BOM cost by ~35% and PCB area by 40%. |
Use Scenario: User interface for refrigerator with proximity wake-up, touch slider for temperature setting, and buzzer feedback. IC Role / Device Role / Timing Role: CapSense® proximity detection wakes device from Hibernate; touch slider adjusts setpoint; internal opamp conditions NTC signal; USB enumerates as CDC for field service diagnostics. Use Value: Self-contained analog/digital/USB capability enables Class B EMC compliance without external filtering components on CapSense® lines. |
| Medical Device Keypad | Automotive Cabin Control |
|
Use Scenario: Disinfectant-resistant touch keypad for infusion pump with tactile feedback via piezo driver. IC Role / Device Role / Timing Role: CapSense® detects gloved finger input; IDAC drives piezo element for haptic response; ADC monitors battery voltage and motor current. Use Value: 5 V-tolerant I/O interfaces directly with existing 5 V pump controller bus; internal opamp gain stages replace discrete instrumentation amplifier. |
Use Scenario: Overhead console control module with ambient light sensing, touch buttons, and LIN communication to body controller. IC Role / Device Role / Timing Role: CapSense® handles touch inputs; SAR ADC reads photodiode and thermistor; UDBs implement LIN physical layer timing and checksum generation. Use Value: Programmable UDBs eliminate need for external LIN transceiver and microcontroller co-processor-reducing component count and qualification effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C3866AXI-065 | Higher flash (128 KB), larger SRAM (16 KB), added CAN 2.0B controller; same package and CapSense® engine. | Required for CAN-based vehicle subsystems or firmware-over-the-air updates needing dual-bank flash. | Select when CAN bus connectivity or field-upgradable firmware is mandatory; otherwise over-spec'd for pure USB/CapSense® use. |
| PSOC™ 4200DS (CY8C4247LQI-M485) | Arm® Cortex®-M0 core, 256 KB flash, 32 KB SRAM, no USB PHY; CapSense® Gen5 with lower power per sensor. | Better suited for Bluetooth LE gateway nodes where USB is replaced by BLE radio and higher code density is needed. | Prefer for new designs targeting BLE + CapSense®; not drop-in due to missing USB PHY and different toolchain (PSoC Creator vs ModusToolbox). |
Compared with CY8C3866AXI-065, the CY8C3665LTI-044 offers optimal cost/performance for USB-connected touch UIs without CAN. Against PSOC™ 4200DS, it retains essential USB 2.0 device functionality and mature CapSense® v3.0 tooling-critical for time-constrained industrial UI development.
Availability
CY8C3665LTI-044 is available at Aetrix Electronics and suitable for industrial HMI panels, smart appliance interfaces, medical keypad modules, and automotive cabin controls requiring stable component supply and long-term manufacturability.
Supply support for CY8C3665LTI-044 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and programmable mixed-signal devices with global manufacturing and quality certification (ISO/TS 16949, AEC-Q200).
The PSoC™ 3 product line was designed to unify analog, digital, and interface functions in a single configurable chip for cost-sensitive, medium-complexity embedded UI and sensor processing applications-prioritizing rapid prototyping and design reuse.
FAQ
Does CY8C3665LTI-044 support USB host functionality?
No. The device integrates only a USB 2.0 full-speed device controller with hardware PHY-capable of acting as HID, CDC, or MSC peripheral-but lacks host controller logic, OTG support, or external transceiver interface. Host capability requires external USB host IC or migration to PSoC™ 5LP/6 with USB host stack.
Can CapSense® operate reliably in high-noise industrial environments?
Yes. CapSense® CSD v3.0 includes hardware-based spread-spectrum modulation, shield driver, and adaptive baseline tracking. Tested per IEC 61000-4-3 (10 V/m radiated immunity) and IEC 61000-4-6 (10 V conducted immunity), achieving >95% touch recognition at 3 mm acrylic overlay under 10 kHz motor noise.
What debug interfaces are supported?
The part supports SWD (Serial Wire Debug) via dedicated P1[6]/P1[7] pins and full JTAG access through the 10-pin SWD/JTAG header. PSoC™ Creator IDE provides real-time variable watch, breakpoint, and memory inspection; no external debugger required beyond standard ARM SWD probe (e.g., KitProg3).
Is there qualified automotive-grade packaging available?
No. CY8C3665LTI-044 is rated for industrial temperature range (–40°C to +85°C) and packaged in commercial-grade QFN. For AEC-Q100 qualified alternatives, consider CY8C4247LQI-M485 (Grade 2, –40°C to +105°C) or CY8C5868LTI-LP097 (Grade 2, with CAN), both requiring redesign for USB replacement.
CY8C3665LTI-044 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 3 CY8C36xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 67MHz
- Connectivity:
- EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C3665LTI-044 FAQ
1.How can I place an order for CY8C3665LTI-044 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C3665LTI-044 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C3665LTI-044 reliable?
The price and inventory of CY8C3665LTI-044 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3665LTI-044 is usually 5 days.
3.What payment methods are accepted for CY8C3665LTI-044?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3665LTI-044 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C3665LTI-044?
CY8C3665LTI-044 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C3665LTI-044 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C3665LTI-044?
For technical support, including CY8C3665LTI-044 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3665LTI-044 requirements.
6.How does Aetrix verify that CY8C3665LTI-044 is sourced from the original manufacturer or authorized distributors?
All CY8C3665LTI-044 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3665LTI-044 meets industry standards.
7.What is the process for return or replacement of CY8C3665LTI-044?
All CY8C3665LTI-044 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3665LTI-044, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C3665LTI-044 part is unused and in its original packaging.
Return procedure for CY8C3665LTI-044:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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