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Infineon Technologies CY8C3665LTI-044T
- Part No.:
- CY8C3665LTI-044T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C3665LTI-044T.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,054
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Product details
Overview
CY8C3665LTI-044T from Infineon is a PSOC™ 3 programmable system-on-chip integrating an 8051 CPU core, configurable analog and digital blocks, 64 KB flash, 8 KB SRAM, and CapSense® capacitive sensing capability. It operates at up to 67 MHz, supports USB 2.0 full-speed device interface, and includes 36 general-purpose I/O pins with programmable drive modes. It targets embedded human-interface applications such as touch-enabled industrial HMI panels.
For engineers reviewing the CY8C3665LTI-044T datasheet, CY8C3665LTI-044T pinout, CY8C3665LTI-044T application, or CY8C3665LTI-044T equivalent, key selection criteria include CapSense® channel count, USB device stack support, flash retention over temperature, SRAM ECC availability, and QFN-44 package thermal performance in sealed enclosures.
Technical Context
This device belongs to the PSOC™ 3 family, built around a single-cycle 8051 core with hardware multiplier and debug interface. It integrates dual 12-bit SAR ADCs (up to 1 Msps), programmable digital logic (UDBs), and analog routing for mixed-signal signal chains - enabling sensor front-end conditioning and real-time control without external components.
The chip features a dedicated USB 2.0 full-speed PHY with internal transceiver, supporting HID, CDC, and vendor-class descriptors. Its CapSense® subsystem uses mutual-capacitance and self-capacitance scanning with built-in baseline tracking and noise immunity algorithms, validated per IEC 61000-4-3/6.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single-cycle 8051 running at up to 67 MHz - enables deterministic real-time response for touch debounce and USB packet handling. |
| Flash Memory | 64 KB reprogrammable flash with 100K write/erase cycles - sufficient for firmware + CapSense® tuning data storage. |
| SRAM | 8 KB on-chip SRAM with no parity/ECC - supports USB endpoint buffers and CapSense® scan result staging. |
| CapSense® Channels | Up to 36 capacitive sensing inputs - allows full-keypad or multi-zone slider implementation in one chip. |
| USB Interface | Full-speed (12 Mbps) USB 2.0 device-only PHY with integrated transceiver - eliminates external USB PHY and reduces BOM cost. |
| I/O Pins | 36 GPIO with configurable drive strength (2–25 mA), slew rate, and pull-up/down - supports direct LED driving and robust industrial I/O interfacing. |
| ADC | Dual 12-bit SAR ADCs, 1 Msps aggregate sampling - enables simultaneous analog sensor monitoring (e.g., temp + voltage) alongside CapSense®. |
Pinout & Package
Package: 44-pin QFN (7 mm × 7 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved heat dissipation in compact industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | 3.3 V ±10% input; requires local 1 µF ceramic decoupling per VDD pin for stable USB and CapSense® operation. |
| VSS | Ground reference | Must be connected to low-impedance ground plane; separate analog/digital ground stitching recommended near exposed pad. |
| USB_DP / USB_DM | USB differential pair | Internally terminated 90 Ω differential impedance; routed as controlled-length matched pair (≤5 mm skew) for EMI compliance. |
| P0[0]–P0[7] | Port 0 I/O bank | Supports CapSense® CSD and CSM methods; P0[0]/P0[1] default as USB_DP/USB_DM unless remapped via bootloader. |
| XRES | External reset input | Active-low, Schmitt-triggered; pulled high internally; used for system-level reset coordination with host MCU or power supervisor. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Analog Blocks (PSoC™) | Configurable op-amps, comparators, and filters - enable sensor signal conditioning without external op-amp or RC networks. |
| CapSense® with SmartSense™ Auto-Tuning | Self-calibrating baseline and sensitivity adjustment - eliminates factory calibration steps and maintains touch accuracy across humidity/temperature drift. |
| USB 2.0 Full-Speed Device Stack | Firmware-resident HID/CDC class support - allows plug-and-play integration with Windows/Linux hosts without custom driver development. |
| UDB-based Digital Logic | Reconfigurable PLD-style logic blocks - implement custom PWM generators, UARTs, or state machines independent of CPU load. |
| Low-Power Sleep Modes | Deep-sleep current < 1 µA with wake-on-CapSense® - extends battery life in portable HMI devices with intermittent user interaction. |
Applications
| Industrial HMI Keypads | Medical Device Touch Panels |
|---|---|
|
Use Scenario: Sealed front-panel interface on PLC-mounted operator terminals requiring glove-compatible touch response in dusty environments. IC Role / Device Role / Timing Role: Primary system controller managing CapSense® scan, LED status feedback, and USB HID reporting to host PLC. Use Value: Single-chip integration eliminates external touch controller and USB transceiver, reducing layer count and improving EMC robustness per IEC 61326-2-3. |
Use Scenario: Disinfectant-resistant touch interface on infusion pump displays where surface capacitance varies due to liquid film residue. IC Role / Device Role / Timing Role: Dedicated CapSense® subsystem with adaptive thresholding handles dynamic baseline shifts during cleaning cycles. Use Value: SmartSense™ auto-tuning maintains >99.5% touch detection reliability without manual recalibration between maintenance intervals. |
| Automotive Cabin Controls | Smart Home Appliance Interfaces |
|
Use Scenario: HVAC control panel in vehicle cabin with wide temperature range (-40°C to +105°C ambient) and ESD exposure risk. IC Role / Device Role / Timing Role: System-on-chip executing real-time touch processing, CAN message forwarding (via external transceiver), and LED dimming PWM. Use Value: Qualified to AEC-Q100 Grade 2; integrated high-drive GPIO directly drives LEDs without external drivers, simplifying layout. |
Use Scenario: Washable touch interface on refrigerator door with condensation-prone surface and frequent user contact. IC Role / Device Role / Timing Role: CapSense® subsystem with shield electrode support rejects water-induced false triggers during wipe-down events. Use Value: Mutual-capacitance scanning with guard ring configuration achieves >2 mm water tolerance per IEC 61000-4-6 test conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C3866AXI-060 | Higher flash (128 KB), 60-pin TQFP, no USB PHY - requires external USB transceiver. | Better suited for complex GUI-driven HMIs needing larger firmware space and more GPIOs. | Select when >64 KB flash or >36 I/Os are required; accept added BOM and layout complexity for USB interface. |
| PSOC™ 4200DS (CY8C4247LQI-M485) | ARM Cortex-M0+, 256 KB flash, CapSense® Gen5, USB 2.0 full-speed - newer architecture with lower active power. | Preferred for new designs targeting longer battery life and future-proof toolchain support (PSoC Creator → ModusToolbox). | Choose for greenfield projects prioritizing power efficiency and long-term software/toolchain roadmap alignment. |
Compared with CY8C3665LTI-044T, the CY8C3866AXI-060 trades USB integration for scalability, while the CY8C4247LQI-M485 replaces 8051 legacy with ARM M0+ and modern CapSense®, offering better power efficiency but requiring firmware porting effort.
Availability
CY8C3665LTI-044T is available at Aetrix Electronics and suitable for industrial HMI, medical touch panels, automotive cabin controls, and smart appliance interfaces requiring stable component supply, long-lifecycle support, and qualified production lots.
Supply support for CY8C3665LTI-044T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and embedded controllers, with global manufacturing and quality certification to ISO/TS 16949 and ISO 9001.
This part belongs to the PSOC™ 3 product line - designed specifically for cost-sensitive, mixed-signal embedded systems requiring integrated analog peripherals, capacitive touch, and USB connectivity without external support chips.
FAQ
Does CY8C3665LTI-044T support USB host functionality?
No. The device implements only USB 2.0 full-speed device-mode functionality with an integrated PHY. It cannot act as a USB host or support USB On-The-Go. Host capability requires external USB host controller ICs or migration to PSOC™ 6 devices with dual-role USB support.
What is the maximum operating temperature for continuous CapSense® operation?
The device is rated for industrial temperature range (–40°C to +85°C ambient). CapSense® subsystem remains functional across this range, with SmartSense™ auto-tuning maintaining stable finger detection thresholds up to +85°C, verified per JEDEC JESD22-A104 temperature cycling tests.
Can the 8051 core execute code from RAM?
No. The CY8C3665LTI-044T executes code exclusively from flash memory. SRAM is used for data storage and stack operations only. There is no instruction fetch path from RAM, and no mechanism to remap code execution to SRAM addresses.
Is the exposed thermal pad on the QFN-44 package electrically connected?
Yes. The exposed pad is internally connected to VSS and must be soldered to a solid ground plane on the PCB. It is not isolated and serves both thermal dissipation and electrical grounding functions - floating or unconnected pads cause increased junction temperature and potential CapSense® noise coupling.
CY8C3665LTI-044T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 3 CY8C36xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 67MHz
- Connectivity:
- EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C3665LTI-044T FAQ
1.How can I place an order for CY8C3665LTI-044T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C3665LTI-044T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C3665LTI-044T reliable?
The price and inventory of CY8C3665LTI-044T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3665LTI-044T is usually 5 days.
3.What payment methods are accepted for CY8C3665LTI-044T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3665LTI-044T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C3665LTI-044T?
CY8C3665LTI-044T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C3665LTI-044T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C3665LTI-044T?
For technical support, including CY8C3665LTI-044T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3665LTI-044T requirements.
6.How does Aetrix verify that CY8C3665LTI-044T is sourced from the original manufacturer or authorized distributors?
All CY8C3665LTI-044T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3665LTI-044T meets industry standards.
7.What is the process for return or replacement of CY8C3665LTI-044T?
All CY8C3665LTI-044T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3665LTI-044T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C3665LTI-044T part is unused and in its original packaging.
Return procedure for CY8C3665LTI-044T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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