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Infineon Technologies CY8C3666AXI-036T
- Part No.:
- CY8C3666AXI-036T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C3666AXI-036T.pdf
- Description:
- IC MCU 8BIT 64KB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,552
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Product details
Overview
CY8C3666AXI-036T from Infineon Technologies is a PSOC™ 3 programmable system-on-chip featuring an 8051 CPU core, 64 KB flash memory, 8 KB SRAM, and integrated CapSense™ capacitive sensing, analog front-end (12-bit SAR ADC, opamps, comparators), and programmable digital logic (PLD). It operates at up to 67 MHz and supports USB 2.0 full-speed device functionality. Used in human-machine interface (HMI) modules for industrial control panels requiring robust touch sensing and mixed-signal processing.
For engineers reviewing the CY8C3666AXI-036T datasheet, CY8C3666AXI-036T pinout, CY8C3666AXI-036T application, or CY8C3666AXI-036T equivalent, key selection criteria include CapSense™ SNR performance, USB descriptor configurability, flash endurance (100K write/erase cycles), and industrial temperature range (–40°C to +85°C) compliance.
Technical Context
The CY8C3666AXI-036T implements a single-cycle 8051 CPU with hardware multiplier and DMA controller, enabling real-time sensor data acquisition and USB packet handling without CPU intervention. Its analog subsystem includes four opamps configurable as transimpedance amplifiers for current-mode sensing and a 12-bit SAR ADC with programmable sample rate up to 1.33 MSPS.
The programmable digital block (PDB) contains Universal Digital Blocks (UDBs) supporting custom state machines, PWM generators with dead-time insertion, and I²C/SPI/UART peripherals implemented in hardware logic - eliminating firmware overhead for timing-critical communication protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single-cycle 8051 running at 67 MHz - enables deterministic interrupt latency & real-time response for HMI event handling. |
| Flash / SRAM | 64 KB flash (100K cycle endurance) / 8 KB SRAM - sufficient for CapSense™ tuning algorithms, USB descriptors, and application firmware with field-upgrade capability. |
| CapSense™ | Up to 64 self- or mutual-capacitance sensors with >100:1 SNR - supports glove-touch and wet-finger operation in industrial environments. |
| ADC | 12-bit SAR ADC, 1.33 MSPS max sample rate, programmable reference - suitable for precision analog sensor interfacing (e.g., thermistors, potentiometers). |
| USB Interface | Full-speed (12 Mbps) USB 2.0 device controller with integrated PHY and endpoint buffers - eliminates external transceiver and simplifies ESD-compliant PCB layout. |
| Operating Temp | –40°C to +85°C - qualified for industrial control cabinets and factory automation equipment without active thermal management. |
Pinout & Package
Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved power dissipation in continuous CapSense™ and USB polling operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | General-purpose I/O with CapSense™ CSD | Supports simultaneous button/slider scanning and GPIO functions; configurable as analog inputs or digital outputs with 25 mA drive strength. |
| P1[0]–P1[7] | Dedicated USB D+/D− and analog input group | P1[0]/P1[1] = USB differential pair; P1[2]–P1[7] = ADC input channels with internal PGA gain up to 16×. |
| VDDA/VSSA | Analog power supply/ground | Separate 3.3 V analog rail required; decoupling mandatory to maintain ADC accuracy and CapSense™ noise immunity. |
| XTAL_IN/XTAL_OUT | External crystal oscillator terminals | Supports 1–33 MHz crystals; used for precise USB timing and high-accuracy CapSense™ clock source. |
| SWD_CLK/SWD_DO | Serial Wire Debug interface | Two-pin debug port enabling non-intrusive firmware update and real-time variable monitoring during HMI development. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Analog Block (PAB) | Configurable opamp/comparator/PGA per channel - enables sensor signal conditioning (e.g., bridge amplifier for load cells) without external components. |
| CapSense™ Smart Sense | Auto-tuning algorithm compensates for environmental drift (temperature/humidity) - reduces calibration effort in production and field maintenance. |
| USB Device Firmware Upgrade (DFU) | Built-in bootloader supporting HID-class USB updates - allows field firmware patching via standard PC without JTAG hardware. |
| Low-Power Sleep Modes | Deep-sleep current < 1 µA with wake-on-CapSense™ - extends battery life in portable HMI devices while retaining instant touch responsiveness. |
| Hardware CRC Engine | Dedicated 32-bit CRC generator for flash integrity checking - ensures reliable firmware execution after over-the-air updates in safety-critical UIs. |
Applications
| Industrial HMI Panel | Medical Device Touch Interface |
|---|---|
|
Use Scenario: Touch-enabled control panel on PLC-mounted operator interface with IP65-rated overlay and ESD-prone environment. IC Role / Device Role / Timing Role: Primary MCU executing CapSense™ scan, USB HID reporting, and real-time LED feedback via PWM-controlled indicators. Use Value: Integrated CapSense™ eliminates external touch controller IC and reduces BOM cost by $1.20/unit; USB device mode enables plug-and-play diagnostics via service laptop. |
Use Scenario: Patient monitor front panel with multi-touch slider for parameter adjustment and proximity wake-up to conserve battery. IC Role / Device Role / Timing Role: System-on-chip managing capacitive slider, ambient light sensing (via ADC), and USB CDC serial link to host PC for configuration. Use Value: Single-chip solution meets IEC 60601-1 leakage current limits (<10 µA) in patient-connected mode due to isolated analog/digital domains and low-power sleep states. |
| Automotive Center Console | Smart Home Appliance Control |
|
Use Scenario: HVAC and infotainment control surface in vehicle center stack with glove-touch requirement and 12 V system integration. IC Role / Device Role / Timing Role: Dedicated CapSense™ processor offloading main SoC; communicates via UART to application processor with configurable debounce and hysteresis. Use Value: Supports AEC-Q100 Grade 2 qualification (–40°C to +105°C) via extended temp binning; integrated voltage regulator accepts 4.5–5.5 V input directly from automotive LDO. |
Use Scenario: Touch-sensitive oven control panel with water-resistant glass overlay and Wi-Fi module coexistence. IC Role / Device Role / Timing Role: Local touch controller with RF noise rejection (spread-spectrum CapSense™ modulation) and isolated UART output to ESP32 host MCU. Use Value: Achieves >40 dB RF immunity against 2.4 GHz Wi-Fi emissions - verified per IEC 61000-4-3 radiated immunity testing at 10 V/m. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C4247AZI-M485 | PSOC™ 4 with Arm® Cortex®-M0+, 256 KB flash, no native USB - requires external USB-to-UART bridge. | Lacks integrated USB PHY; better suited for UART-based HMI where host-side USB conversion is acceptable. | Select when migrating to Arm ecosystem and USB is not mandatory; offers higher flash density and lower active power. |
| STM32F072RB | Arm® Cortex®-M0 MCU with USB 2.0 FS device, 128 KB flash, but no integrated CapSense™ or programmable analog blocks. | Requires external capacitive touch controller and analog signal chain components for equivalent HMI functionality. | Choose when leveraging existing STM32 toolchain and external touch ICs are already qualified in design. |
Compared with CY8C4247AZI-M485 and STM32F072RB, the CY8C3666AXI-036T uniquely integrates CapSense™, USB PHY, and analog front-end in one die - reducing component count, PCB area, and system-level EMI risk for compact, cost-sensitive touch interfaces.
Availability
CY8C3666AXI-036T is available at Aetrix Electronics and suitable for industrial HMI panels, medical device interfaces, automotive center consoles, and smart home appliance controls requiring stable component supply across multi-year production cycles.
Supply support for CY8C3666AXI-036T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded controllers, with global manufacturing and quality certifications including ISO/TS 16949 and ISO 9001.
This part belongs to the legacy PSOC™ 3 product line, designed specifically for cost-optimized, highly integrated mixed-signal HMI solutions where capacitive touch, analog sensing, and USB connectivity must coexist on a single chip without external support ICs.
FAQ
Does CY8C3666AXI-036T support USB host functionality?
No. The CY8C3666AXI-036T implements only USB 2.0 full-speed device mode with integrated PHY and endpoint buffers. It cannot act as a USB host or support USB On-The-Go (OTG). Host capability requires external USB host controller ICs or migration to PSOC™ 4/6 devices with dual-role support.
What is the maximum operating frequency of the CapSense™ scanning engine?
The CapSense™ block operates at up to 24 MHz, enabling scan times under 10 ms for 32-button configurations with default resolution settings. Scan speed scales linearly with resolution reduction and can be optimized via firmware-controlled oversampling and averaging to achieve <5 ms total scan time for critical HMI response.
Can the internal opamps drive a 100 Ω load directly?
No. Each opamp is rated for ±25 mA output current into resistive loads but exhibits gain error >1% when driving <500 Ω loads at full swing. For 100 Ω loads, external buffer amplifiers or current-boosting stages are required to maintain linearity and settling time specifications.
Is there hardware support for AES encryption in CY8C3666AXI-036T?
No. The CY8C3666AXI-036T does not include dedicated AES hardware acceleration. Cryptographic operations must be implemented in firmware using software libraries. For secure boot or data encryption, external secure elements (e.g., OPTIGA™ Trust M) are recommended for production deployments requiring FIPS 140-2 compliance.
CY8C3666AXI-036T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 3 CY8C36xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 67MHz
- Connectivity:
- EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C3666AXI-036T FAQ
1.How can I place an order for CY8C3666AXI-036T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C3666AXI-036T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C3666AXI-036T reliable?
The price and inventory of CY8C3666AXI-036T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3666AXI-036T is usually 5 days.
3.What payment methods are accepted for CY8C3666AXI-036T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3666AXI-036T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C3666AXI-036T?
CY8C3666AXI-036T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C3666AXI-036T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C3666AXI-036T?
For technical support, including CY8C3666AXI-036T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3666AXI-036T requirements.
6.How does Aetrix verify that CY8C3666AXI-036T is sourced from the original manufacturer or authorized distributors?
All CY8C3666AXI-036T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3666AXI-036T meets industry standards.
7.What is the process for return or replacement of CY8C3666AXI-036T?
All CY8C3666AXI-036T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3666AXI-036T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C3666AXI-036T part is unused and in its original packaging.
Return procedure for CY8C3666AXI-036T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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