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Infineon Technologies CY8C3666AXI-052T
- Part No.:
- CY8C3666AXI-052T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C3666AXI-052T.pdf
- Description:
- IC MCU 8BIT 64KB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,500
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Product details
Overview
CY8C3666AXI-052T from Infineon (formerly Cypress) is a 32-bit PSoC™ 3 programmable system-on-chip featuring an 8051 CPU core, 64 KB flash, 8 KB SRAM, and integrated CapSense™ capacitive sensing, analog (12-bit SAR ADC, opamps, comparators), and digital (PLD-based UDBs) peripherals. It operates at up to 67 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin TQFP package.
For engineers reviewing the CY8C3666AXI-052T datasheet, CY8C3666AXI-052T pinout, CY8C3666AXI-052T application, or CY8C3666AXI-052T equivalent, key selection criteria include its mixed-signal programmability, on-chip CapSense™ for touch interfaces, configurable analog front-end, USB 2.0 full-speed interface, and support for low-power operation with multiple sleep modes.
Technical Context
The CY8C3666AXI-052T implements a single-cycle 8051 CPU with hardware multiplier and divider, executing instructions at up to 67 MHz via internal PLL. Its Universal Digital Blocks (UDBs) provide reconfigurable logic for custom state machines, PWMs, counters, and serial protocols without consuming CPU cycles.
Analog subsystem includes a 12-bit SAR ADC with up to 1 Msps sampling rate, four rail-to-rail opamps, two comparators, and a programmable IDAC (0.12–2.4 mA). CapSense™ block enables robust self- and mutual-capacitance touch sensing with built-in noise immunity and automatic tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 8051-based, single-cycle, up to 67 MHz - enables real-time control with deterministic timing and low interrupt latency. |
| Flash / SRAM | 64 KB flash / 8 KB SRAM - sufficient for firmware with CapSense™ library, USB stack, and sensor fusion logic. |
| ADC | 12-bit SAR, 1 Msps max - supports high-resolution analog monitoring of sensors or power rails. |
| CapSense™ | Up to 62 self-capacitance or 24 mutual-capacitance sensors - enables multi-button sliders, proximity detection, and gesture recognition. |
| USB Interface | Full-speed (12 Mbps), device-only, integrated PHY - eliminates external transceiver and simplifies USB HID or CDC class implementation. |
| Operating Temp | –40°C to +85°C - qualified for industrial and automotive cabin applications requiring extended thermal stability. |
| I/O Count | 72 GPIOs (5V-tolerant on select pins) - supports mixed-voltage interfacing and peripheral expansion without level shifters. |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 3.3 V supply domains (core/analog) with dedicated decoupling pads - ensures stable operation for mixed-signal precision. |
| P0[0]–P0[7] | General-purpose I/O bank | 5V-tolerant, configurable as digital input/output, analog input, or CapSense™ electrode - supports direct connection to legacy 5 V logic or sensors. |
| USB_DP / USB_DM | USB differential data pair | Integrated full-speed transceiver with internal termination - reduces BOM count and PCB layout complexity for USB connectivity. |
| SCLK / MOSI / MISO / SS | Quad SPI interface signals | Hardware-configurable SPI master/slave with DMA support - enables high-throughput communication with external flash or displays. |
| XTAL_IN / XTAL_OUT | External crystal oscillator terminals | Supports 1–33 MHz crystals for precise clocking; internal PLL generates 67 MHz system clock - provides frequency flexibility and jitter control. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Analog | Configurable opamp gain (1–100×), comparator hysteresis, and IDAC current - enables sensor signal conditioning without external components. |
| CapSense™ Engine | Dedicated hardware block with auto-calibration, baseline tracking, and noise rejection - delivers reliable touch performance in noisy EMI environments. |
| UDB Logic | Reconfigurable digital logic (PLD + datapath) - allows custom protocol engines (e.g., LIN, custom UART variants) without CPU overhead. |
| Low-Power Modes | Five sleep modes including Hibernate (200 nA typical) with RAM retention and wake-on-CapSense™ - extends battery life in portable human-interface devices. |
| USB Device Stack | Pre-certified HID and CDC class firmware libraries - accelerates development of plug-and-play USB peripherals like touch panels or diagnostic tools. |
Applications
| Industrial HMI Panels | Medical Patient Interfaces |
|---|---|
Use Scenario: Touch-enabled operator panels in factory automation systems requiring dust/water resistance and glove operation. IC Role / Device Role / Timing Role: Primary MCU handling CapSense™ touch decoding, display interface, and CAN/LIN communication. Use Value: Integrated CapSense™ eliminates external touch controller IC; 72 GPIOs support LED indicators, button feedback, and sensor inputs without expanders. | Use Scenario: Bedside patient monitors with touch sliders for volume/brightness control and proximity wake-up. IC Role / Device Role / Timing Role: System controller managing analog sensor acquisition (ECG/SpO₂ front-end), touch UI, and USB data export. Use Value: 12-bit ADC with programmable gain amplifiers directly digitizes low-level biopotential signals; CapSense™ supports wet-finger and gloved operation per IEC 60601-1. |
| Automotive Cabin Controls | Smart Home Control Hubs |
Use Scenario: Center-stack infotainment controls with haptic feedback and ambient light sensing. IC Role / Device Role / Timing Role: Dedicated touch controller interfacing with main SoC via I²C, managing multi-touch gestures and backlight dimming. Use Value: Industrial temp grade and AEC-Q100 stress qualification enable use in non-critical cabin zones; CapSense™ tolerates condensation and surface contaminants. | Use Scenario: Wall-mounted smart thermostat with capacitive slider, temperature/humidity sensing, and Zigbee/Bluetooth coexistence. IC Role / Device Role / Timing Role: Standalone UI processor handling touch, local sensor readout, and wireless module control via UART/SPI. Use Value: Low-power hibernate mode extends battery backup life; integrated opamps condition thermistor and humidity sensor outputs without external signal chain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C3866AXI-060 | Same PSoC™ 3 architecture, 128 KB flash, 16 KB SRAM, identical peripherals - higher memory capacity only. | Required when firmware exceeds 64 KB or needs larger bootloader/reserved sectors. | Select if future firmware growth or dual-bank OTA updates are planned; otherwise, CY8C3666AXI-052T offers optimal cost/performance balance. |
| PSOC™ 4200 (CY8C4245AXI-483) | Arm® Cortex®-M0 core, 32 KB flash, 4 KB SRAM, same CapSense™ and analog blocks - newer architecture, lower power, no USB. | Suitable for new designs prioritizing energy efficiency over USB connectivity or legacy 8051 toolchain compatibility. | Choose for greenfield projects needing Arm ecosystem support and lower active/sleep current; retain CY8C3666AXI-052T for USB-dependent or 8051-based code reuse. |
Compared with CY8C3866AXI-060, the CY8C3666AXI-052T trades flash/SRAM headroom for lower unit cost and footprint; versus PSOC™ 4200, it retains USB 2.0 and mature 8051 toolchains at the expense of Arm-based scalability and ultra-low-power modes.
Availability
CY8C3666AXI-052T is available at Aetrix Electronics and suitable for industrial HMI panels, medical patient interfaces, and automotive cabin controls requiring stable component supply, long-term manufacturability, and qualified industrial temperature operation.
Supply support for CY8C3666AXI-052T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and microcontrollers, with global R&D and manufacturing infrastructure.
CY8C3666AXI-052T belongs to the PSoC™ 3 family, designed to deliver configurable analog and digital logic in a single chip for cost-sensitive, medium-complexity embedded systems requiring rapid prototyping and hardware-software co-design.
FAQ
What development tools support CY8C3666AXI-052T?
Infineon's PSoC™ Creator IDE (v3.3 or later) fully supports this device, providing graphical peripheral configuration, automatic code generation, and debug via MiniProg3 or KitProg2 programmers. The IDE includes pre-verified CapSense™ tuning wizards, USB HID templates, and analog component libraries compatible with CY8C3666AXI-052T's specific UDB and analog routing constraints.
Does CY8C3666AXI-052T support hardware-based USB enumeration without firmware intervention?
No - USB enumeration requires firmware execution using Infineon's USBFS component library. However, the on-die USB transceiver and descriptor-handling APIs reduce host enumeration time to under 500 ms, and the device supports standard USB classes (HID, CDC, MSC) without external silicon.
Can the CapSense™ block operate during deep-sleep modes?
Yes - CapSense™ can run autonomously in Sleep and Deep-Sleep modes using the low-power analog block (LPAB), waking the CPU only upon threshold crossing or gesture completion. Typical current draw in CapSense™-only deep-sleep is 15 µA, enabling battery-powered touch interfaces with multi-week standby.
Is there a drop-in replacement for CY8C3666AXI-052T with enhanced ESD immunity?
No - the CY8C3666AXI-052T meets ±2 kV HBM ESD per JESD22-A114, and no pin-compatible variant offers higher rating. For improved system-level ESD robustness, Infineon recommends external TVS diodes on exposed I/O lines (e.g., USB_DP/DM, CapSense™ electrodes) per IEC 61000-4-2 Level 4 requirements.
CY8C3666AXI-052T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 3 CY8C36xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 67MHz
- Connectivity:
- EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- CapSense, DMA, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C3666AXI-052T FAQ
1.How can I place an order for CY8C3666AXI-052T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C3666AXI-052T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C3666AXI-052T reliable?
The price and inventory of CY8C3666AXI-052T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3666AXI-052T is usually 5 days.
3.What payment methods are accepted for CY8C3666AXI-052T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3666AXI-052T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C3666AXI-052T?
CY8C3666AXI-052T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C3666AXI-052T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C3666AXI-052T?
For technical support, including CY8C3666AXI-052T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3666AXI-052T requirements.
6.How does Aetrix verify that CY8C3666AXI-052T is sourced from the original manufacturer or authorized distributors?
All CY8C3666AXI-052T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3666AXI-052T meets industry standards.
7.What is the process for return or replacement of CY8C3666AXI-052T?
All CY8C3666AXI-052T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3666AXI-052T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C3666AXI-052T part is unused and in its original packaging.
Return procedure for CY8C3666AXI-052T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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