My Inquiry
My Account
Infineon Technologies CY8C3666AXI-202T
- Part No.:
- CY8C3666AXI-202T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C3666AXI-202T.pdf
- Description:
- IC MCU 8BIT 64KB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,535
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C3666AXI-202T from Infineon Technologies is a PSOC™ 3 programmable system-on-chip featuring an 8051 CPU core, 64 KB flash memory, 8 KB SRAM, and integrated CapSense™ capacitive sensing, analog PSoC blocks (including op-amps, comparators, ADCs), and programmable digital logic. It operates at up to 67 MHz with industrial temperature range (–40°C to +85°C) and supports USB 2.0 full-speed interface. Used in human-machine interface (HMI) modules requiring touch control and mixed-signal processing.
For engineers reviewing the CY8C3666AXI-202T datasheet, CY8C3666AXI-202T pinout, CY8C3666AXI-202T application, or CY8C3666AXI-202T equivalent, key selection criteria include CapSense™ channel count (up to 32), analog resource flexibility (dual 12-bit SAR ADCs, configurable op-amp gain), USB transceiver integration, and QFN-68 package compatibility with industrial HMI layout constraints.
Technical Context
This device belongs to the legacy PSOC™ 3 family, built on a mixed-signal architecture where analog and digital resources are configured via hardware description language (HDL)-based design flow in PSoC Creator IDE. Its 8051 core runs at up to 67 MHz using internal PLL with crystal or external clock input.
The chip integrates two independent 12-bit SAR ADCs (each with 1 MSPS sampling rate), four programmable op-amps (rail-to-rail I/O, gain up to 128×), eight comparators, and a dedicated CapSense™ block supporting proximity, slider, and button sensing with <1% baseline drift over temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 8051, 67 MHz max - enables deterministic real-time control for HMI firmware with low interrupt latency. |
| Flash / SRAM | 64 KB / 8 KB - sufficient for CapSense™ tuning algorithms, USB HID stack, and sensor fusion logic. |
| CapSense™ Channels | Up to 32 - supports multi-touch sliders, proximity wake-up, and noise-immune button arrays in compact layouts. |
| SAR ADC | Dual 12-bit, 1 MSPS each - allows simultaneous analog monitoring (e.g., battery voltage + temperature) without multiplexing delay. |
| Op-Amps | 4 × rail-to-rail, programmable gain (1–128×) - configurable as transimpedance amps for current-sensing or active filters. |
| USB Interface | Full-speed (12 Mbps), integrated PHY - eliminates external transceiver, reduces BOM cost and PCB area for HID-class devices. |
| Operating Temp | –40°C to +85°C - qualified for industrial panel-mount HMIs exposed to ambient thermal cycling. |
Pinout & Package
Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved power dissipation during sustained CapSense™ scanning.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO / CapSense™ CSD | Configurable as general-purpose I/O or CapSense™ sense lines with integrated IDACs and routing to CSD block. |
| P1[0]–P1[7] | GPIO / Analog Input | Supports analog muxing to SAR ADC inputs or op-amp terminals; includes hysteresis for robust digital input. |
| USB_DP / USB_DM | USB 2.0 differential pair | Integrated full-speed transceiver with internal termination; requires only 27-Ω series resistors and ESD protection diodes. |
| VDDA / VSSA | Analog supply / ground | Dedicated 3.3 V analog domain pins isolate sensitive ADC/CapSense™ circuitry from digital switching noise. |
| XRES | External reset input | Active-low asynchronous reset with internal pull-up; compatible with pushbutton or supervisor IC assertion. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Analog Blocks | Four op-amps, eight comparators, dual 12-bit SAR ADCs - enable custom signal conditioning chains without external components. |
| CapSense™ CSD Engine | Dedicated hardware block with auto-tuning, smart sensing, and noise immunity up to 20 Vpp - eliminates firmware-based capacitance measurement overhead. |
| USB Full-Speed PHY | On-die transceiver with suspend/resume support - reduces bill-of-materials and simplifies compliance testing for HID-compliant devices. |
| Flexible Clock System | Internal IMO (1–67 MHz), PLL, and external crystal support - allows precise timing for CapSense™ scanning and USB frame synchronization. |
| Low-Power Modes | Deep sleep (2 µA typical), hibernate (1 µA), and wakeup on CapSense™ event - extends battery life in portable HMIs. |
Applications
| Industrial HMI Panel | Medical Device Touch Interface |
|---|---|
|
Use Scenario: Wall-mounted control panel in factory automation with 12-button array and 3-segment slider for parameter adjustment. IC Role / Device Role / Timing Role: Primary controller handling CapSense™ scan, USB HID reporting, and local LED feedback timing. Use Value: Single-chip solution replaces microcontroller + discrete analog front-end + USB transceiver, reducing component count by 7 parts and layout area by 35%. |
Use Scenario: Touch-enabled infusion pump interface requiring glove-compatible operation and ESD immunity per IEC 60601-1-2. IC Role / Device Role / Timing Role: CapSense™ acquisition engine with adaptive baseline tracking and fast response (<15 ms) to user input. Use Value: Hardware-accelerated CapSense™ achieves >99.5% touch detection accuracy under saline-glove conditions without firmware compensation. |
| Automotive Cabin Control | Smart Home Appliance UI |
|
Use Scenario: Center console climate control with proximity wake-up and rotary slider for fan speed. IC Role / Device Role / Timing Role: System-on-chip managing proximity sensing, slider position decoding, and CAN message forwarding via external transceiver. Use Value: Integrated CapSense™ supports proximity detection at 40 mm distance with <50 mW average power, meeting automotive EMC Class 3 requirements. |
Use Scenario: Microwave oven control panel with moisture-sensitive touch keys and status LED dimming. IC Role / Device Role / Timing Role: Mixed-signal processor executing CapSense™ scan, PWM-driven LED brightness control, and thermal shutdown monitoring. Use Value: On-chip op-amps condition thermistor signals directly into ADC, eliminating external amplifier and reducing calibration drift to ±0.5°C over temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C3866AXI-063 | Same PSOC™ 3 architecture, but 256 KB flash, 32 KB SRAM, and 128-pin TQFP package - no USB PHY, adds CAN 2.0B controller. | Better suited for CAN-connected industrial nodes needing larger firmware space; lacks USB HID capability. | Select when CAN bus integration is required and USB is unnecessary; board redesign needed for TQFP footprint. |
| PSOC™ 4200 (CY8C4247LQI-M485) | Arm® Cortex®-M0 core, 256 KB flash, 32 KB SRAM, CapSense™ v3.0, no USB PHY - supports BLE via external module. | Lower power (1.71–5.5 V operation), higher CapSense™ SNR, but requires external USB bridge for HID. | Prefer for battery-powered designs needing >10-year shelf life; trade-off is added USB bridge IC and firmware complexity. |
Compared with CY8C3666AXI-202T, CY8C3866AXI-063 offers greater memory and CAN but sacrifices USB integration and increases package size, while PSOC™ 4200 delivers superior low-power CapSense™ and modern Arm core at the cost of external USB interface and higher software abstraction layer overhead.
Availability
CY8C3666AXI-202T is available at Aetrix Electronics and suitable for industrial HMI panels, medical device interfaces, automotive cabin controls, and smart home appliance UIs requiring stable component supply across long-lifecycle production programs.
Supply support for CY8C3666AXI-202T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and ISO 9001.
This part belongs to the legacy PSOC™ 3 product line, designed specifically for cost-sensitive, mixed-signal embedded applications demanding integrated analog peripherals, capacitive touch, and USB connectivity in a single chip.
FAQ
Does CY8C3666AXI-202T support USB device enumeration without external components?
Yes - it integrates a full-speed USB 2.0 transceiver with internal 1.5 kΩ pull-up resistor on D+ and ESD protection diodes. Only external 27 Ω series resistors and a TVS diode per line are required for USB compliance. No external PHY or level-shifter is needed.
What is the maximum number of simultaneous CapSense™ buttons supported?
The device supports up to 32 CapSense™ sensors in mutual-capacitance mode or 64 in self-capacitance mode, constrained by available GPIO and routing resources. Real-world implementation typically achieves 24–28 robust buttons with noise filtering enabled, verified per AN76195 CapSense™ design guidelines.
Can the on-chip op-amps drive a 10 kΩ load at 3.3 V?
Yes - each op-amp delivers ±25 mA output current with rail-to-rail swing and maintains stability driving capacitive loads up to 100 pF. Driving a 10 kΩ resistive load at 3.3 V results in <0.1% gain error and <1 µs settling time to 0.1%, per Electrical Characteristics table in datasheet DS110018.
Is there hardware support for AES encryption in CY8C3666AXI-202T?
No - this PSOC™ 3 device does not include dedicated AES hardware acceleration. Cryptographic operations must be implemented in firmware using the 8051 core. For secure boot or data encryption, external secure elements or migration to PSOC™ 6 (with TrustZone and hardware AES) is recommended.
CY8C3666AXI-202T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 3 CY8C36xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 67MHz
- Connectivity:
- EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C3666AXI-202T FAQ
1.How can I place an order for CY8C3666AXI-202T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C3666AXI-202T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C3666AXI-202T reliable?
The price and inventory of CY8C3666AXI-202T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3666AXI-202T is usually 5 days.
3.What payment methods are accepted for CY8C3666AXI-202T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3666AXI-202T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C3666AXI-202T?
CY8C3666AXI-202T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C3666AXI-202T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C3666AXI-202T?
For technical support, including CY8C3666AXI-202T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3666AXI-202T requirements.
6.How does Aetrix verify that CY8C3666AXI-202T is sourced from the original manufacturer or authorized distributors?
All CY8C3666AXI-202T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3666AXI-202T meets industry standards.
7.What is the process for return or replacement of CY8C3666AXI-202T?
All CY8C3666AXI-202T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3666AXI-202T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C3666AXI-202T part is unused and in its original packaging.
Return procedure for CY8C3666AXI-202T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C3666AXI-202T Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
