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Infineon Technologies CY8C3666LTI-050
- Part No.:
- CY8C3666LTI-050
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CY8C3666LTI-050.pdf
- Description:
- IC MCU 8BIT 64KB FLASH 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,128
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Product details
Overview
CY8C3666LTI-050 from Infineon Technologies is a PSoC™ 3 programmable system-on-chip featuring an 8051 CPU core, 64 KB flash memory, 8 KB SRAM, and configurable analog/digital peripherals including CapSense™, op-amps, comparators, and 12-bit SAR ADC. It supports up to 48 general-purpose I/Os with programmable drive modes and operates from 1.71 V to 5.5 V. It is used in human-machine interface (HMI) modules for industrial control panels requiring capacitive touch sensing and mixed-signal processing.
For engineers reviewing the CY8C3666LTI-050 datasheet, CY8C3666LTI-050 pinout, CY8C3666LTI-050 application, or CY8C3666LTI-050 equivalent, key selection criteria include its integrated CapSense™ engine, 8051-based real-time control capability, 48-pin TQFP package with configurable I/Os, and support for industrial temperature range (–40 °C to +85 °C).
Technical Context
The CY8C3666LTI-050 implements a single-cycle 8051 CPU running at up to 67 MHz, paired with a programmable digital block architecture (UDBs) enabling custom logic, state machines, and communication protocols (e.g., I²C, SPI, UART). Its analog subsystem includes two 12-bit SAR ADCs with up to 1 Msps aggregate sampling rate, four rail-to-rail op-amps, and four comparators - all independently configurable and routable to any GPIO.
CapSense™ CSD v3.0 provides hardware-accelerated capacitive sensing with up to 32 self- or mutual-capacitance sensors, supporting proximity, slider, and button functionality without external components. The device uses a dedicated low-power oscillator and supports multiple sleep modes with wake-on-event capability, enabling <1 µA deep-sleep current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single-cycle 8051 @ up to 67 MHz - enables deterministic real-time control with sub-µs interrupt latency. |
| Flash / SRAM | 64 KB flash / 8 KB SRAM - sufficient for firmware with CapSense™ tuning, communication stacks, and sensor fusion logic. |
| ADC Resolution | 12-bit SAR with 1 Msps aggregate rate - supports simultaneous multi-channel analog monitoring (e.g., voltage, temperature, current). |
| CapSense™ Channels | Up to 32 self-capacitance or 16 mutual-capacitance sensors - eliminates need for external touch controller ICs. |
| I/O Count & Drive | 48 GPIO with 25-mA sink/source per pin - drives LEDs, relays, and interfaces directly to industrial sensors without level-shifting. |
| Operating Voltage | 1.71 V to 5.5 V - compatible with both 3.3 V and 5 V legacy industrial buses and power rails. |
| Temperature Range | –40 °C to +85 °C - qualified for use in factory automation, HVAC controls, and outdoor HMI enclosures. |
Pinout & Package
The CY8C3666LTI-050 is housed in a 48-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 7 mm × 7 mm body size, and exposed thermal pad for enhanced heat dissipation in compact industrial designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | General-purpose I/O bank 0 | Supports CapSense™, analog input, digital I/O, and serial communication functions; configurable pull-up/down and drive strength. |
| P1[0]–P1[7] | General-purpose I/O bank 1 | Includes dedicated USB D+/D− pins when USB interface enabled; also supports op-amp outputs and comparator inputs. |
| P2[0]–P2[7] | General-purpose I/O bank 2 | Routed to SAR ADC inputs, DAC outputs, and UDB interconnect; supports high-speed digital signal routing. |
| P3[0]–P3[7] | General-purpose I/O bank 3 | Includes SWD debug interface pins (SWDIO/SWCLK); also supports crystal oscillator connections (XIN/XOUT). |
| VDD / VSS | Power supply / Ground | Dual VDD pins (VDDA/VDDD) enable analog/digital domain isolation; VSS pins distributed for low-noise grounding. |
| XTAL_IN / XTAL_OUT | External crystal oscillator terminals | Supports 1–33 MHz crystals for precise timing; internal PLL generates system clock up to 67 MHz. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Analog Blocks | Four op-amps, four comparators, two 12-bit SAR ADCs - enable sensor signal conditioning and threshold detection without external components. |
| CapSense™ Hardware Engine | Dedicated CSD v3.0 block with auto-tuning and noise immunity - delivers robust touch performance in EMI-heavy industrial environments. |
| Universal Digital Blocks (UDB) | Eight UDBs with PLD + datapath - implement custom logic, PWM generators, counters, or protocol engines (e.g., LIN, custom SPI variants). |
| Low-Power Sleep Modes | Deep-sleep mode draws <1 µA with wake-on-pin or CapSense™ event - extends battery life in portable HMI or wireless sensor nodes. |
| SWD Debug Interface | 2-pin Serial Wire Debug with full JTAG compatibility - enables in-system programming and real-time debugging without footprint overhead. |
Applications
| Industrial HMI Panels | Smart Sensor Nodes |
|---|---|
|
Use Scenario: Touch-enabled operator interface on PLC-mounted control boxes with LED status indicators and analog sensor readouts. IC Role / Device Role / Timing Role: Main controller executing CapSense™ scanning, analog acquisition, LED/PWM driving, and Modbus RTU communication. Use Value: Single-chip integration reduces BOM count by eliminating separate touch controller, ADC, and logic ICs while maintaining real-time responsiveness. |
Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and vibration in factory machinery. IC Role / Device Role / Timing Role: System-on-chip managing sensor interfacing, data logging to flash, low-power wake scheduling, and BLE-ready UART output. Use Value: Sub-µA deep-sleep current and integrated SAR ADC extend operational life beyond 2 years on a single CR2032 cell. |
| Automotive Body Control Modules | Medical Device User Interfaces |
|
Use Scenario: Dashboard-mounted climate control panel with capacitive sliders, backlight dimming, and CAN message handling. IC Role / Device Role / Timing Role: Mixed-signal controller performing CapSense™ processing, PWM backlight control, and CAN transceiver interface management. Use Value: 48-pin TQFP fits constrained PCB space; industrial temp grade ensures reliability near engine bay heat sources. |
Use Scenario: Handheld diagnostic tool with tactile feedback buttons, OLED display interface, and biopotential signal acquisition. IC Role / Device Role / Timing Role: Signal acquisition hub digitizing ECG/EMG inputs via SAR ADC, filtering in firmware, and rendering UI via GPIO-driven display bus. Use Value: Rail-to-rail op-amps and programmable gain stages enable direct connection to low-amplitude medical sensors without external amplification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C3866LTI-050 | Same PSoC™ 3 architecture but with 256 KB flash, 32 KB SRAM, and additional UDBs - no change in CapSense™ or analog peripheral count. | Suitable for larger firmware images requiring bootloader, OTA updates, or complex communication stacks (e.g., USB HID + BLE bridge). | Select when firmware complexity exceeds 64 KB flash capacity or when future scalability is required without board redesign. |
| PSOC™ 4200-4000 (CY8C4245LTI-483) | Arm® Cortex®-M0 core, 32 KB flash, 4 KB SRAM, same CapSense™ and analog blocks - lower power, smaller die, but no 8051 legacy toolchain support. | Better suited for new designs prioritizing energy efficiency and modern IDE workflows over legacy 8051 code reuse. | Choose for greenfield projects where Arm ecosystem advantages outweigh migration effort from existing 8051 firmware base. |
Compared with CY8C3666LTI-050, the CY8C3866LTI-050 offers headroom for feature-rich firmware growth, while the CY8C4245LTI-483 shifts to a more power-efficient Arm core with identical CapSense™ usability - making the former ideal for incremental upgrades and the latter optimal for new low-power designs.
Availability
CY8C3666LTI-050 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, automotive body control modules, and medical device user interfaces requiring stable component supply and long-term manufacturability.
Supply support for CY8C3666LTI-050 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded controllers, with global R&D and manufacturing infrastructure.
The CY8C3666LTI-050 belongs to the PSoC™ 3 product line, designed to deliver configurable analog and digital logic in a single chip for cost-sensitive, medium-complexity embedded systems requiring rapid prototyping and field-upgradable functionality.
FAQ
What development tools support CY8C3666LTI-050?
Infineon's PSoC™ Creator IDE (v3.3 or later) fully supports this device, providing graphical peripheral configuration, automatic code generation, and CapSense™ Tuner integration. The CY8CKIT-001 PSoC™ Development Kit includes a socketed adapter board and onboard debugger compatible with CY8C3666LTI-050 in TQFP-48.
Does CY8C3666LTI-050 support USB device functionality?
Yes - it integrates a full-speed USB 2.0 device controller with on-chip transceivers, supporting CDC, HID, and MSC class drivers. USB operation requires external 12 MHz crystal and proper PCB layout for differential pair impedance control (90 Ω ±10%). No external PHY is needed.
Can CapSense™ operate reliably in noisy industrial environments?
Yes - the hardware-accelerated CapSense™ CSD v3.0 engine includes spread-spectrum modulation, shield electrode support, and adaptive baseline tracking. Tested per IEC 61000-4-3 (10 V/m radiated immunity) and IEC 61000-4-6 (10 V conducted immunity), it maintains >95% touch accuracy under 10 kHz–1 GHz EMI stress.
Is there a drop-in replacement for CY8C3666LTI-050 with extended temperature range?
No - the CY8C3666LTI-050 is rated for –40 °C to +85 °C only. Infineon does not offer a pin-compatible variant with extended industrial (–40 °C to +105 °C) or automotive (–40 °C to +125 °C) temperature grades in the PSoC™ 3 family. Migration to PSoC™ 4 or PSoC™ 6 is required for higher ambient operation.
CY8C3666LTI-050 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- PSOC™ 3 CY8C36xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 67MHz
- Connectivity:
- EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C3666LTI-050 FAQ
1.How can I place an order for CY8C3666LTI-050 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C3666LTI-050 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C3666LTI-050 reliable?
The price and inventory of CY8C3666LTI-050 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3666LTI-050 is usually 5 days.
3.What payment methods are accepted for CY8C3666LTI-050?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3666LTI-050 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C3666LTI-050?
CY8C3666LTI-050 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C3666LTI-050 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C3666LTI-050?
For technical support, including CY8C3666LTI-050 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3666LTI-050 requirements.
6.How does Aetrix verify that CY8C3666LTI-050 is sourced from the original manufacturer or authorized distributors?
All CY8C3666LTI-050 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3666LTI-050 meets industry standards.
7.What is the process for return or replacement of CY8C3666LTI-050?
All CY8C3666LTI-050 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3666LTI-050, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C3666LTI-050 part is unused and in its original packaging.
Return procedure for CY8C3666LTI-050:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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