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Infineon Technologies CY8C3666LTI-201
- Part No.:
- CY8C3666LTI-201
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C3666LTI-201.pdf
- Description:
- IC MCU 8BIT 64KB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,405
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Product details
Overview
CY8C3666LTI-201 from Infineon Technologies is a PSoC™ 3 programmable system-on-chip integrating an 8051 CPU core, configurable analog and digital peripherals, 66 KB flash, 8 KB SRAM, and CapSense® capacitive sensing capability. It operates at up to 67 MHz, supports USB 2.0 full-speed device interface, and includes 24-channel DMA and hardware-based USB endpoint buffers. It is used in human-interface devices such as touch-enabled industrial HMI panels.
For engineers reviewing the CY8C3666LTI-201 datasheet, CY8C3666LTI-201 pinout, CY8C3666LTI-201 application, or CY8C3666LTI-201 equivalent, key selection criteria include USB device stack compatibility, CapSense® SNR performance, flash retention over temperature, and availability of pre-certified USB descriptors for HID-class devices.
Technical Context
This device belongs to the PSoC™ 3 family, built on a 8051 microcontroller core with single-cycle execution and hardware multiplier. It integrates programmable analog blocks (including opamps, comparators, and ADCs) and digital logic (UDBs) that can be configured as timers, counters, PWMs, or custom state machines.
The USB 2.0 full-speed interface uses dedicated hardware endpoints and internal transceivers compliant with USB-IF specifications. CapSense® subsystem employs mutual-capacitance and self-capacitance scanning with integrated IDACs and low-noise SAR ADCs for robust touch detection in noisy industrial environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 8051, single-cycle, up to 67 MHz - enables real-time deterministic control without RTOS overhead. |
| Flash Memory | 66 KB - sufficient for complex USB HID firmware plus CapSense® tuning and calibration tables. |
| SRAM | 8 KB - supports USB descriptor buffering, CapSense® raw data storage, and application stack. |
| USB Interface | Full-speed (12 Mbps), integrated PHY and endpoint buffers - eliminates external USB transceiver and reduces BOM cost. |
| CapSense® Channels | Up to 24 - allows multi-touch sliders, buttons, and proximity sensing in compact HMI designs. |
| Operating Voltage | 1.71 V to 5.5 V - supports direct connection to 3.3 V or 5 V rails without level-shifting. |
| Temperature Range | –40 °C to +85 °C - qualified for industrial ambient operation without derating. |
Pinout & Package
Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved power dissipation in continuous CapSense® or USB polling scenarios.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | Accepts 1.71–5.5 V; powers analog/digital domains and USB PHY. |
| VSS | Ground reference | Dedicated analog/digital ground pins reduce noise coupling into CapSense® sensors. |
| USBDP/USBDM | USB differential pair | Internal 1.5 kΩ pull-up on USBDP enables USB enumeration without external resistor. |
| P0[0]–P0[7] | General-purpose I/O | Configurable as CapSense® CSD or CSX electrodes; support high-frequency scanning. |
| XRES | External reset input | Active-low, Schmitt-triggered - ensures reliable reset under ESD or voltage droop. |
| XTAL_IN/XTAL_OUT | Crystal oscillator terminals | Supports 1–24 MHz crystals for precise USB timing and CapSense® clocking. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Analog Blocks | Configurable opamps, 12-bit SAR ADC, and current DACs enable sensor signal conditioning without external components. |
| Universal Digital Blocks (UDB) | Reconfigurable logic fabric supporting custom protocols, PWM generators, or CRC engines - replaces discrete glue logic. |
| CapSense® with SmartSense™ | Auto-tuning algorithm compensates for environmental drift and maintains stable touch thresholds across temperature/humidity. |
| Hardware USB Endpoint Buffers | Dedicated 64-byte RAM per endpoint - offloads CPU during USB interrupt service and prevents packet loss. |
| Low-Power Modes | Deep-sleep mode draws < 1 µA while retaining SRAM and wake-on-CapSense® - extends battery life in portable HMIs. |
Applications
| Industrial HMI Panels | Medical Device Interfaces |
|---|---|
Use Scenario: Touchscreen overlay on PLC operator terminals requiring ESD-hardened, noise-immune button/slider detection. IC Role / Device Role / Timing Role: Primary MCU executing CapSense® scan, USB HID report generation, and real-time status LED control. Use Value: Integrated CapSense® avoids external touch controller IC; USB full-speed enables plug-and-play configuration via PC host. | Use Scenario: Patient monitor front panel with tactile-free controls operating in 60 Hz AC-powered clinical environments. IC Role / Device Role / Timing Role: System-on-chip managing touch input, display interface, and USB diagnostic data upload. Use Value: 8 KB SRAM stores calibrated CapSense® baselines; 66 KB flash accommodates FDA-compliant firmware revision history. |
| Automotive Diagnostic Tools | Smart Home Control Hubs |
Use Scenario: Handheld OBD-II scanner with capacitive buttons and USB-CDC virtual COM port for vehicle ECU communication. IC Role / Device Role / Timing Role: USB CDC device controller interfacing with host PC; CapSense® provides sealed, waterproof user input. Use Value: Hardware USB endpoint buffers ensure reliable command-response timing; wide VDD range tolerates automotive battery fluctuations. | Use Scenario: Wall-mounted thermostat with slider-based temperature adjustment and local USB firmware update capability. IC Role / Device Role / Timing Role: Standalone CapSense® processor and USB device for field updates, decoupled from main Wi-Fi SoC. Use Value: Low-power deep-sleep mode extends battery backup runtime; SmartSense™ auto-calibration maintains accuracy across seasonal humidity shifts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C3866LTI-065 | Same PSoC™ 3 architecture but with 256 KB flash, 32 KB SRAM, and additional USB endpoints - no CapSense® enhancement. | Targeted at USB audio or mass-storage class devices requiring larger firmware footprint. | Select when >66 KB flash is needed and CapSense® channel count remains unchanged. |
| PSOC™ 4200 (CY8C4247LQI-M485) | Arm® Cortex®-M0 core, 256 KB flash, 32 KB SRAM, CapSense® v3.0 - lacks native USB 2.0 full-speed PHY. | Requires external USB transceiver or relies on USB HID over BLE; better suited for battery-powered IoT nodes. | Choose for lower active power and BLE integration; avoid if USB full-speed device compliance is mandatory. |
Compared with CY8C3666LTI-201, CY8C3866LTI-065 offers higher memory density but identical CapSense® capability, while PSOC™ 4200 trades USB hardware for Arm efficiency and BLE readiness - making CY8C3666LTI-201 optimal for cost-sensitive, USB-native industrial touch interfaces.
Availability
CY8C3666LTI-201 is available at Aetrix Electronics and suitable for industrial HMI panels, medical device interfaces, automotive diagnostic tools, and smart home control hubs requiring stable component supply and long-term manufacturability.
Supply support for CY8C3666LTI-201 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
This part belongs to the PSoC™ 3 product line, designed specifically for cost-optimized, USB-connected human-interface applications requiring integrated analog sensing, programmable logic, and deterministic 8051 real-time control.
FAQ
Does CY8C3666LTI-201 support USB suspend/resume and remote wakeup?
Yes. The device implements USB 2.0 specification-compliant suspend/resume states using its internal USB controller. Remote wakeup is enabled via CapSense® interrupt or GPIO edge detection, allowing the host to resume the device from USB suspend mode without external circuitry.
What is the maximum achievable CapSense® scan rate with this device?
At 67 MHz CPU clock and using hardware-accelerated scanning, CY8C3666LTI-201 achieves up to 200 Hz full-panel scan rate for 24 electrodes with baseline tracking enabled. Scan rate scales linearly with electrode count and is configurable via firmware tuning of IDAC current and sample averaging.
Can the internal flash be reprogrammed in-system via USB?
Yes. The device supports USB-based bootloader operation using Cypress-provided Bootloader Host utility. Firmware updates occur through standard USB HID or CDC class interfaces without requiring JTAG or SWD debug hardware, enabling field upgrades in deployed systems.
Is there factory-trimmed calibration data for the internal 12-bit SAR ADC?
Yes. Each unit contains factory-programmed ADC offset and gain calibration constants stored in dedicated flash rows. These values are automatically loaded by the PSoC™ Creator-generated startup code, ensuring ±1 LSB INL and DNL across the full operating temperature range without user calibration.
CY8C3666LTI-201 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 3 CY8C36xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 67MHz
- Connectivity:
- EBI/EMI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C3666LTI-201 FAQ
1.How can I place an order for CY8C3666LTI-201 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C3666LTI-201 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C3666LTI-201 reliable?
The price and inventory of CY8C3666LTI-201 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3666LTI-201 is usually 5 days.
3.What payment methods are accepted for CY8C3666LTI-201?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3666LTI-201 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C3666LTI-201?
CY8C3666LTI-201 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C3666LTI-201 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C3666LTI-201?
For technical support, including CY8C3666LTI-201 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3666LTI-201 requirements.
6.How does Aetrix verify that CY8C3666LTI-201 is sourced from the original manufacturer or authorized distributors?
All CY8C3666LTI-201 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3666LTI-201 meets industry standards.
7.What is the process for return or replacement of CY8C3666LTI-201?
All CY8C3666LTI-201 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3666LTI-201, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C3666LTI-201 part is unused and in its original packaging.
Return procedure for CY8C3666LTI-201:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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