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Infineon Technologies CY8C3666LTI-203T

Part No.:
CY8C3666LTI-203T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixCY8C3666LTI-203T.pdf
Description:
IC MCU 8BIT 64KB FLASH 68QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,905

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Product details

Overview

CY8C3666LTI-203T from Infineon is a PSoC™ 3 programmable system-on-chip featuring an 8051 CPU core, 64 KB flash, 8 KB SRAM, and integrated CapSense™ capacitive sensing, analog front-end (12-bit SAR ADC, op-amps, comparators), and programmable digital blocks (UDBs). It operates at up to 67 MHz and supports USB 2.0 full-speed device functionality. Used in human-machine interface (HMI) modules for industrial control panels.

For engineers reviewing the CY8C3666LTI-203T datasheet, CY8C3666LTI-203T pinout, CY8C3666LTI-203T application, or CY8C3666LTI-203T equivalent, key selection criteria include CapSense™ channel count, USB device stack support, analog resource allocation, and QFN-68 package thermal performance in space-constrained HMI designs.

Technical Context

This device belongs to the PSoC™ 3 family, built on a flexible mixed-signal architecture where analog and digital resources are configured via hardware description language (HDL) and firmware. It integrates a dedicated USB 2.0 full-speed PHY with endpoint buffers and supports descriptor-based enumeration without external transceivers.

The CapSense™ subsystem uses mutual-capacitance scanning across up to 32 sensors with baseline tracking and noise immunity algorithms. Analog resources include four op-amps (rail-to-rail I/O, gain-bandwidth product ≥ 5 MHz), two 12-bit SAR ADCs (1 Msps max, programmable input mux), and two 8-bit DACs.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Core8051-compatible, 67 MHz max - enables deterministic real-time control with cycle-accurate timing for sensor polling and USB ISR handling.
Flash Memory64 KB - sufficient for dual-application firmware images with bootloader and CapSense™ tuning libraries.
SRAM8 KB - supports simultaneous USB endpoint buffering, CapSense™ raw data storage, and application state variables.
CapSense™ ChannelsUp to 32 - allows multi-touch slider, proximity wake-up, and button matrix in single-chip HMI solutions.
USB InterfaceFull-speed (12 Mbps), integrated PHY - eliminates external transceiver, reduces BOM cost and PCB area for HID-class devices.
Analog Peripherals2× 12-bit SAR ADC (1 Msps), 4× op-amps, 2× 8-bit DAC - enables closed-loop analog signal conditioning and sensor calibration without external ICs.
Package68-pin QFN (10 mm × 10 mm, 0.5 mm pitch) - provides thermal pad for power dissipation in continuous CapSense™ scan operation.

Pinout & Package

The CY8C3666LTI-203T is housed in a 68-pin QFN package with exposed thermal pad (EP), designed for reflow soldering and thermal management in compact industrial enclosures.

Pin/TerminalCircuit RoleDesign Meaning
VDDCore & I/O supply3.3 V ±10% input; powers all digital logic, analog blocks, and USB PHY - requires local 10 µF + 100 nF decoupling.
VSSDigital groundReference return for digital circuits; must be connected to EP for low-impedance thermal and signal path.
USB_DP / USB_DMUSB differential pairDirect connection to USB connector; internal 1.5 kΩ pull-up on DP enables full-speed device enumeration.
P0[0]–P0[7]General-purpose I/OConfigurable as CapSense™ CSD or CSX electrodes, analog inputs, or digital GPIO with programmable drive strength.
XTAL_IN / XTAL_OUTCrystal oscillator terminalsSupports 1–33 MHz crystal; required for precise USB timing and high-accuracy CapSense™ scanning clock.

Key Features

FeatureDesign Value
Programmable Analog BlocksFour op-amps configurable as PGA, filter, or comparator - eliminates need for external signal-conditioning ICs in sensor front-ends.
CapSense™ Smart SensingHardware-accelerated mutual-capacitance scanning with automatic baseline restoration - enables robust touch detection under ESD and moisture.
USB 2.0 Full-Speed DeviceOn-die PHY and endpoint FIFOs - supports HID, CDC, and vendor-specific classes without external silicon or firmware USB stack licensing.
Universal Digital Blocks (UDB)Eight UDBs with PLD and datapath elements - implement custom PWM generators, UARTs, or protocol engines independent of CPU load.
Low-Power ModesDeep-sleep mode with 1 µA typical current and wake-on-CapSense™ - extends battery life in portable industrial handhelds.

Applications

Industrial HMI PanelMedical Device Touch Interface

Use Scenario: Operator-facing control panel in PLC cabinets with sealed membrane overlay and glove operation.

IC Role / Device Role / Timing Role: Primary MCU executing CapSense™ scan, USB HID reporting, and LED status feedback via programmable digital blocks.

Use Value: Single-chip integration reduces component count by >12 parts versus discrete MCU + touch controller + USB transceiver solution.

Use Scenario: Touch-sensitive parameter adjustment on infusion pump front bezel requiring IEC 60601-1 compliance.

IC Role / Device Role / Timing Role: Safety-critical HMI controller with CapSense™ noise rejection, isolated USB diagnostics port, and fail-safe deep-sleep entry on timeout.

Use Value: Built-in CapSense™ baseline tracking maintains accuracy across temperature drift and electrode contamination per medical EMC standards.

Automotive Cabin ControlSmart Home Appliance Interface

Use Scenario: Climate control panel in passenger compartment with ambient light compensation and haptic feedback.

IC Role / Device Role / Timing Role: Real-time sensor fusion hub combining CapSense™, ambient light ADC, and PWM-driven LED drivers.

Use Value: On-chip op-amps condition photodiode signals directly, avoiding external amplifiers and reducing layout sensitivity to EMI.

Use Scenario: Wash cycle selector dial and start button on front-loading washing machine with water-resistant overlay.

IC Role / Device Role / Timing Role: Standalone touch controller interfacing to main MCU via I²C, with autonomous CapSense™ scanning during sleep.

Use Value: Deep-sleep current <1 µA enables always-on touch wake-up while meeting Energy Star standby power requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable mixed-signal HMI applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY8C3866LTI-065Same PSoC™ 3 architecture but with 256 KB flash, 32 KB SRAM, and additional USB endpoints - no CapSense™ performance improvement.Targeted at complex USB composite devices (e.g., HID + CDC + MSC); over-spec'd for basic touch-only HMI.Select when firmware size exceeds 64 KB or multiple concurrent USB interfaces are required.
PSOC™ 4200 (CY8C4247LQI-M485)Arm® Cortex®-M0 core, 256 KB flash, 32 KB SRAM, CapSense™ v3.0 - higher CapSense™ SNR and lower power, but no native USB PHY.Requires external USB transceiver and more complex firmware stack; better suited for battery-powered IoT edge nodes.Select for new designs prioritizing ultra-low-power CapSense™ and Arm ecosystem tooling over USB integration simplicity.

Compared with CY8C3866LTI-065 and CY8C4247LQI-M485, the CY8C3666LTI-203T offers optimal balance of USB integration, CapSense™ channel density, and memory footprint for cost-sensitive industrial HMI - eliminating transceivers while retaining sufficient resources for real-time touch + USB HID operation.

Availability

CY8C3666LTI-203T is available at Aetrix Electronics and suitable for industrial HMI panels, medical device interfaces, automotive cabin controls, and smart home appliance touch modules requiring stable component supply and long-term manufacturability.

Supply support for CY8C3666LTI-203T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded security solutions, with global R&D and manufacturing infrastructure.

The PSoC™ 3 product line was engineered to unify analog, digital, and programmable interconnect resources in a single chip for rapid development of differentiated HMI and sensor-processing applications - targeting design cycles under 12 weeks.

FAQ

Does CY8C3666LTI-203T support USB host functionality?

No. This device implements only USB 2.0 full-speed device mode with integrated PHY and endpoint buffers. It cannot act as a USB host or OTG controller. Host capability requires external USB host controller ICs or migration to PSoC™ 6 series with dual-core architecture.

What is the maximum operating temperature for continuous CapSense™ scanning?

The CY8C3666LTI-203T is rated for industrial temperature range (–40°C to +85°C). Continuous CapSense™ scanning at 100 Hz with all 32 electrodes active draws ≤2.1 mA at 3.3 V, resulting in junction temperature rise <12°C above ambient in standard QFN layout - well within thermal limits.

Can the on-chip op-amps drive a 50 Ω coaxial cable for analog sensor output?

No. The op-amps are optimized for on-die signal conditioning (e.g., PGA, filter) with rail-to-rail output swing but limited to 25 mA short-circuit current. Driving 50 Ω loads requires external high-current buffer amplifiers such as the TLE2141 or OPA549.

Is there hardware support for AES encryption in CY8C3666LTI-203T?

No. This PSoC™ 3 variant lacks dedicated cryptographic accelerators. AES operations must be implemented in firmware using ROM-based library functions. For hardware-accelerated crypto, consider PSoC™ 6 devices with CryptoBlock or OPTIGA™ secure elements.

CY8C3666LTI-203T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
68-VFQFN Exposed Pad
Series:
PSOC™ 3 CY8C36xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
8051
Core Size:
8-Bit
Speed:
67MHz
Connectivity:
EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
CapSense, DMA, LCD, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C3666LTI-203T FAQ

1.How can I place an order for CY8C3666LTI-203T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C3666LTI-203T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C3666LTI-203T reliable?

The price and inventory of CY8C3666LTI-203T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3666LTI-203T is usually 5 days.

3.What payment methods are accepted for CY8C3666LTI-203T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3666LTI-203T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C3666LTI-203T?

CY8C3666LTI-203T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C3666LTI-203T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C3666LTI-203T?

For technical support, including CY8C3666LTI-203T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3666LTI-203T requirements.

6.How does Aetrix verify that CY8C3666LTI-203T is sourced from the original manufacturer or authorized distributors?

All CY8C3666LTI-203T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3666LTI-203T meets industry standards.

7.What is the process for return or replacement of CY8C3666LTI-203T?

All CY8C3666LTI-203T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3666LTI-203T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C3666LTI-203T part is unused and in its original packaging.

Return procedure for CY8C3666LTI-203T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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