My Inquiry
My Account
Infineon Technologies CY8C3866FNI-210T
- Part No.:
- CY8C3866FNI-210T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 72-UFBGA, WLCSP
- Datasheet:
-
CY8C3866FNI-210T.pdf
- Description:
- IC MCU 8BIT 64KB FLASH 72WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,397
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C3866FNI-210T from Infineon Technologies (formerly Cypress Semiconductor) is a programmable System-on-Chip (PSoC® 3) integrating an 8-bit 8051 CPU, configurable analog and digital peripherals, 64 KB flash, 8 KB RAM, and full CAN 2.0b interface - designed for embedded control in industrial sensors, medical diagnostics, and low-power HMI systems.
For engineers reviewing the CY8C3866FNI-210T datasheet, CY8C3866FNI-210T pinout, CY8C3866FNI-210T application, or CY8C3866FNI-210T equivalent, key selection criteria include its 67-MHz operation, 1.71–5.5 V supply range, 29–72 I/O routing flexibility, ultra-low-power sleep modes (1 µA), and integrated CapSense® support for touch interfaces.
Technical Context
The CY8C3866FNI-210T implements a mixed-signal SoC architecture centered on an enhanced 8051 core with DMA and a 24-bit Digital Filter Processor (DFB). Its digital subsystem uses Universal Digital Blocks (UDBs) to synthesize custom logic, timers, UARTs, SPI, LIN, and CRC engines - all routable to any GPIO via the Digital System Interconnect (DSI).
Analog functionality includes a configurable 8–20-bit delta-sigma ADC, four opamps, four comparators, four 8-bit DACs, and programmable SC/CT blocks for PGA, TIA, and mixer functions. Clocking supports internal oscillators (3–62 MHz), PLL up to 67 MHz, and external crystals (4–25 MHz), with 12 dividers distributed across peripherals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Enhanced 8-bit 8051 running up to 67 MHz with 32 interrupt inputs and hardware DMA controller |
| Memory | 64 KB flash (with cache & security), 8 KB SRAM, 2 KB EEPROM, and 8 KB ECC flash for error resilience |
| Power Range | 1.71–5.5 V across up to six independent power domains; supports 1 µA sleep and 200 nA hibernate with RAM retention |
| Digital Peripherals | Four 16-bit TCPWM blocks, full CAN 2.0b (16 Rx / 8 Tx buffers), USB 2.0 Full-Speed (12 Mbps), I²C at 1 Mbps |
| Analog Peripherals | Configurable delta-sigma ADC (8–20 bit), four opamps, four comparators, four 8-bit DACs, CapSense® for up to 62 sensors |
| I/O System | 72-pin WLCSP package with up to 62 GPIOs, eight SIO pins (25 mA sink, overvoltage tolerant), and full peripheral-to-pin routing |
| Clock Sources | Internal oscillator (3–62 MHz, ±1% at 3 MHz), PLL, 32.768-kHz watch crystal input, and 4–25 MHz external crystal support |
Pinout & Package
Package: 72-pin Wafer-Level Chip Scale Package (WLCSP), 3.1 mm × 3.1 mm, 0.4 mm pitch, bottom-side solder balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O Power Supply | Four independent I/O voltage domains (1.2–5.5 V) enabling mixed-voltage interfacing and level-shifting |
| VDDD | Digital Core Supply | Primary 1.71–5.5 V supply for CPU, memory, and digital subsystem; powers UDB array and DSI |
| VDDA | Analog Core Supply | Dedicated analog supply rail for ADC, DAC, opamps, and comparators; improves noise immunity and precision |
| P0[0]–P0[7] | General-Purpose I/O | Programmable GPIOs supporting CapSense®, analog routing, digital peripherals, and LCD segment drive |
| USB_DP / USB_DM | USB Physical Interface | Differential pair for USB 2.0 Full-Speed (12 Mbps); requires no external PHY - fully integrated with internal transceiver |
| CAN_TX / CAN_RX | CAN Bus Interface | Dedicated differential signaling pins for full CAN 2.0b compliance; support 1 Mbps operation with built-in protocol engine |
| XRES | External Reset Input | Active-low asynchronous reset pin; accepts 1.2–5.5 V logic levels and triggers full system initialization |
| SWDCK / SWDIO | Debug Interface | 2-wire Serial Wire Debug (SWD) interface for programming, real-time debugging, and trace via SWV |
Key Features
| Feature | Design Value |
|---|---|
| Configurable UDB Array | 24 Universal Digital Blocks enable synthesis of custom digital logic (e.g., PRS, quadrature decoders, CRC) without FPGA-level complexity |
| CapSense® Integration | On-die capacitive sensing engine supports up to 62 self- or mutual-capacitance sensors with automatic baseline tracking and noise rejection |
| Flexible Analog Routing | Any analog peripheral (ADC, DAC, opamp, comparator) can be connected to any GPIO via programmable analog mux bus - no fixed signal paths |
| Multi-Domain Power Management | Six independent power domains allow selective shutdown of unused analog/digital sections, reducing active current to sub-mA levels |
| Integrated USB Transceiver | Full-Speed USB 2.0 PHY + protocol stack in silicon eliminates need for external USB ICs or crystal - reduces BOM and layout area |
Applications
| Industrial Sensor Node | Medical Diagnostic Handheld |
|---|---|
Use Scenario: Battery-powered wireless sensor node monitoring temperature, pressure, and vibration in factory automation. IC Role / Device Role / Timing Role: Central PSoC 3 controller managing analog sensor conditioning, CAN bus telemetry, and low-power sleep/wake scheduling. Use Value: Integrated delta-sigma ADC (16+ bit) and programmable opamp gain eliminate external signal-chain ICs; 200 nA hibernate mode extends battery life to >5 years. | Use Scenario: Portable ECG or pulse oximeter requiring analog front-end precision, touch UI, and USB data export. IC Role / Device Role / Timing Role: Single-chip analog/digital hub performing biopotential amplification, 20-bit ADC sampling, CapSense® button navigation, and USB HID reporting. Use Value: On-chip PGA and TIA blocks enable direct electrode connection; CapSense® eliminates mechanical buttons; USB FS avoids external transceivers. |
| Smart Home Thermostat | Automotive Body Control Module |
Use Scenario: HVAC control unit with ambient sensing, display driving, and Zigbee/Bluetooth coexistence via UART/I²C. IC Role / Device Role / Timing Role: Main MCU executing PID loop, driving 46×16-segment LCD directly from GPIOs, and managing multi-protocol communication stacks. Use Value: LCD direct-drive capability removes display driver IC; flexible UDBs implement custom protocol timing for proprietary RF modules. | Use Scenario: Low-voltage interior lighting or mirror control module in 12 V automotive systems with CAN network integration. IC Role / Device Role / Timing Role: CAN endpoint node handling command parsing, PWM dimming control, and fault monitoring via analog inputs. Use Value: Full CAN 2.0b engine with 16 Rx buffers ensures robust message filtering and prioritization; wide 1.71–5.5 V operation tolerates cold-crank conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C5868LTI-LP097 | 32-bit ARM Cortex-M3 core, higher clock (80 MHz), larger memory (256 KB flash), but no integrated CAN or USB PHY | Requires external CAN transceiver and USB PHY; better suited for high-throughput firmware-intensive tasks than mixed-signal edge sensing | Select when migrating to ARM ecosystem and needing higher compute throughput - not drop-in replacement |
| STM32F072RBT6 | ARM Cortex-M0+, 48 MHz, 128 KB flash, integrated CAN and USB, but fixed analog blocks (no programmable SC/CT or CapSense®) | Lacks configurable analog routing and CapSense®; requires external components for high-precision sensor front-ends or touch UI | Choose for cost-sensitive CAN/USB endpoints where analog flexibility is secondary to toolchain maturity and volume pricing |
Compared with CY8C3866FNI-210T, the CY8C5868LTI-LP097 offers greater processing headroom but sacrifices integrated mixed-signal configurability, while the STM32F072RBT6 provides strong CAN/USB integration at lower cost but lacks on-die CapSense® and programmable analog blocks essential for sensor and HMI convergence.
Availability
CY8C3866FNI-210T is available at Aetrix Electronics and suitable for industrial sensor nodes, portable medical devices, smart home thermostats, and automotive body control modules requiring stable component supply and long-term lifecycle support.
Supply support for CY8C3866FNI-210T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and secure microcontrollers.
The CY8C38 family belongs to Infineon's PSoC® 3 programmable SoC product line, engineered for ultra-low-power embedded control with integrated analog/digital flexibility - targeting applications where sensor fusion, human interface, and protocol bridging converge on a single chip.
FAQ
What development tools are required to program the CY8C3866FNI-210T?
PSoC Creator™ IDE (free download from Infineon) is the official development environment, providing schematic-based hardware design, C firmware coding with Keil 8051 compiler integration, and drag-and-drop PSoC Components™. Programming requires MiniProg3 or KitProg debug probe via SWD or JTAG interface - no external programmer needed for standard workflows.
Does the CY8C3866FNI-210T support true hardware CAN arbitration and error handling?
Yes - it implements full CAN 2.0b protocol stack in hardware, including bit arbitration, ACK slot generation, error frame transmission, and automatic retransmission. The 16 Rx and 8 Tx message buffers support mailbox-style filtering and priority-based transmission without CPU intervention.
Can the internal 32.768-kHz watch crystal oscillator drive real-time clock (RTC) functions with battery backup?
Yes - the dedicated 32.768-kHz external crystal input connects to the low-power oscillator circuit, enabling RTC operation in hibernate mode with RAM retention. The device supports wake-up from hibernate on RTC alarm, external interrupt, or CAN activity - all while consuming only 200 nA.
Is CapSense® operation affected by moisture or conductive contaminants on the PCB surface?
CapSense® includes shield electrode support and adaptive threshold algorithms that mitigate false touches caused by moisture films or salt contamination. Layout guidelines (e.g., guard rings, shield traces) and firmware tuning (baseline update rate, noise threshold) are documented in AN85951 and AN81434 to ensure robust operation in humid or industrial environments.
CY8C3866FNI-210T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 72-UFBGA, WLCSP
- Series:
- PSOC™ 3 CY8C38xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 67MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x20b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C3866FNI-210T FAQ
1.How can I place an order for CY8C3866FNI-210T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C3866FNI-210T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C3866FNI-210T reliable?
The price and inventory of CY8C3866FNI-210T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C3866FNI-210T is usually 5 days.
3.What payment methods are accepted for CY8C3866FNI-210T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C3866FNI-210T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C3866FNI-210T?
CY8C3866FNI-210T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C3866FNI-210T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C3866FNI-210T?
For technical support, including CY8C3866FNI-210T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C3866FNI-210T requirements.
6.How does Aetrix verify that CY8C3866FNI-210T is sourced from the original manufacturer or authorized distributors?
All CY8C3866FNI-210T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C3866FNI-210T meets industry standards.
7.What is the process for return or replacement of CY8C3866FNI-210T?
All CY8C3866FNI-210T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C3866FNI-210T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C3866FNI-210T part is unused and in its original packaging.
Return procedure for CY8C3866FNI-210T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C3866FNI-210T Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
