My Inquiry
My Account
Infineon Technologies CY8C4024AZI-S413
- Part No.:
- CY8C4024AZI-S413
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
CY8C4024AZI-S413.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 48TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,255
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4024AZI-S413 from Infineon is a 32-bit Arm® Cortex®-M0+ microcontroller with 24 KB flash, 4 KB SRAM, and integrated CAPSENSE™ capacitive sensing. It operates from 1.71 V to 5.5 V, supports Deep Sleep mode at 2.5 µA, and features two reconfigurable serial communication blocks (SCBs) for I²C/SPI/UART, five 16-bit TCPWMs, and programmable analog blocks including IDACs and low-power comparators. Used in touch-enabled industrial HMI and smart sensor nodes.
For engineers reviewing the CY8C4024AZI-S413 datasheet, CY8C4024AZI-S413 pinout, CY8C4024AZI-S413 application, or CY8C4024AZI-S413 equivalent, key selection criteria include its 24-pin QFN package, CAPSENSE™ sigma-delta SNR >5:1, SmartSense auto-tuning, 48 MHz CPU clock, and dual SCB flexibility for mixed-protocol interface design.
Technical Context
The device integrates a single-core Arm® Cortex®-M0+ CPU running at up to 48 MHz with single-cycle multiply, coupled with a dedicated hardware CAPSENSE™ v2 engine using capacitive sigma-delta modulation for high-noise immunity. Its analog subsystem includes two current DACs (IDACs) usable on any GPIO and two low-power comparators operational in Deep Sleep mode.
Digital resources comprise five TCPWM blocks supporting center-aligned PWM, comparator-triggered kill signals for motor control safety, and two SCBs that can be independently configured as I²C master/slave, SPI master/slave, or UART TX/RX - all runtime reconfigurable without reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz max - enables real-time firmware execution with deterministic interrupt latency for responsive touch and control loops. |
| Flash / SRAM | 24 KB flash / 4 KB SRAM - sufficient for CAPSENSE™ firmware + BLE stack coexistence or compact motor control algorithms. |
| Supply Range | 1.71 V to 5.5 V - supports direct connection to Li-ion, USB, or industrial 3.3/5 V rails without level-shifting. |
| Deep Sleep Current | 2.5 µA digital system current - enables battery-powered touch interfaces with multi-year operation on coin cells. |
| CAPSENSE™ SNR | >5:1 signal-to-noise ratio - ensures reliable touch detection under wet conditions or EMI-rich environments like factory floors. |
| TCPWM Count | 5 × 16-bit timer/counter/PWM blocks - supports simultaneous motor phase control, LED dimming, and encoder counting in compact designs. |
| SCB Count | 2 × reconfigurable serial blocks - allows concurrent I²C sensor hub + UART debug interface or SPI display + I²C EEPROM without external logic. |
Pinout & Package
Package: 24-pin QFN (4 mm × 4 mm, 0.5 mm pitch), exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | Accepts 1.71–5.5 V; powers all digital logic, analog blocks, and GPIO drivers. |
| GND | Ground reference | Common return for analog/digital domains; must be connected to thermal pad for thermal and noise performance. |
| P0[0]–P0[7] | Programmable GPIO | Support CAPSENSE™, analog input/output, digital logic, or LCD segment drive; configurable slew rate and drive strength. |
| SWDCLK / SWDIO | Debug interface | Serial Wire Debug pins - enable full-chip programming, breakpoint debugging, and real-time trace without external JTAG adapter. |
| XRES | External reset | Active-low asynchronous reset input; debounced internally; overrides all power modes. |
Key Features
| Feature | Design Value |
|---|---|
| SmartSense auto-tuning | Hardware-accelerated CAPSENSE™ calibration eliminates manual threshold tuning and compensates for environmental drift in production. |
| Runtime-reconfigurable SCBs | Each SCB can switch between I²C/SPI/UART protocols in firmware - reduces BOM count and simplifies firmware updates for field-deployed devices. |
| Deep Sleep with active analog | Low-power comparators and IDACs remain functional during 2.5 µA Deep Sleep - enables wake-on-touch or wake-on-threshold events without CPU intervention. |
| Programmable GPIO drive modes | 12 configurable drive modes per pin (e.g., strong, open-drain, resistive pull-up/down) - eliminates external biasing components for diverse interface requirements. |
Applications
| Industrial HMI Panels | Smart Home Sensors |
|---|---|
Use Scenario: Touch-enabled control panels in PLC cabinets or HVAC controllers exposed to dust, moisture, and EMI. IC Role / Device Role / Timing Role: Main MCU executing CAPSENSE™ firmware, managing local I/O, and communicating via UART to host controller. Use Value: >5:1 CAPSENSE™ SNR and water-tolerant sigma-delta sensing ensure reliable operation where mechanical buttons fail. | Use Scenario: Battery-powered occupancy/motion sensors with capacitive touch wake and environmental monitoring. IC Role / Device Role / Timing Role: System-on-chip handling sensor fusion, touch UI, and low-power wireless interface coordination. Use Value: 2.5 µA Deep Sleep with active analog enables >3-year battery life while maintaining instant wake-on-touch responsiveness. |
| Motor Drive Interface Modules | Medical Diagnostic Handhelds |
Use Scenario: Compact motor driver boards requiring PWM generation, fault monitoring, and human interface feedback. IC Role / Device Role / Timing Role: Real-time controller generating center-aligned PWM for BLDC commutation and detecting overcurrent via comparator-triggered TCPWM kill signals. Use Value: Hardware-integrated kill signal path reduces fault response time to <1 µs - critical for IGBT/MOSFET protection. | Use Scenario: Portable diagnostic tools with touch UI, analog sensor front-end, and USB connectivity. IC Role / Device Role / Timing Role: Single-chip solution managing CAPSENSE™ buttons, ADC acquisition of biopotential signals, and USB CDC virtual COM port. Use Value: Integrated 10-bit ADC function within CAPSENSE™ block enables simultaneous touch and analog sensing without resource contention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller-with-capacitive-sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C4014LQI-S403 | 16 KB flash, 2 KB SRAM, same 24-pin QFN package, identical CAPSENSE™ v2 engine and SCB architecture. | Limited memory headroom for complex CAPSENSE™ + BLE coexistence; suitable for basic touch-only applications. | Select when firmware footprint is ≤12 KB and no concurrent wireless stack is required. |
| STM32G031K8T6 | No integrated CAPSENSE™; requires external RC network and firmware-based touch algorithm; 64 KB flash, 8 KB SRAM, 32-pin LQFP. | Higher general-purpose compute headroom but adds BOM cost, layout area, and development time for touch robustness validation. | Select when analog sensor acquisition dominates over touch, or when existing STM32 toolchain investment outweighs CAPSENSE™ integration benefit. |
Compared with CY8C4014LQI-S403, CY8C4024AZI-S413 provides +8 KB flash and +2 KB SRAM for richer firmware features; versus STM32G031K8T6, it eliminates external touch components and firmware tuning effort but trades off ARM Cortex-M0 core maturity and ecosystem breadth.
Availability
CY8C4024AZI-S413 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, motor interface modules, and portable medical diagnostics requiring stable component supply across long-lifecycle programs.
Supply support for CY8C4024AZI-S413 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded controllers, with global manufacturing and R&D infrastructure.
CY8C40xx belongs to the PSoC™ 4000S product line - designed specifically for cost-sensitive, touch-enabled embedded systems requiring integrated analog, programmable logic, and low-power operation without external components.
FAQ
Does CY8C4024AZI-S413 support Bluetooth Low Energy?
No, CY8C4024AZI-S413 does not integrate a BLE radio. It lacks RF transceiver circuitry and associated antenna matching networks. However, it can interface with external BLE modules (e.g., CYW20735 or ESP32-WROOM-32) via its two SCBs configured as UART or SPI, enabling complete wireless-capable systems with separate RF partitioning.
What is the maximum operating temperature for this device?
CY8C4024AZI-S413 is rated for industrial temperature range: –40 °C to +85 °C ambient. This is confirmed in Section 6.2 ("Device level specifications") of the official Infineon datasheet 002-00123 Rev. *Q, and applies to continuous operation with proper PCB thermal design and voltage derating per absolute maximum ratings.
Can the CAPSENSE™ block measure absolute capacitance values?
No - the CAPSENSE™ v2 block in CY8C4024AZI-S413 performs relative capacitance measurement only. It outputs normalized raw counts proportional to delta-C changes, not absolute femtofarad values. Calibration and baseline tracking are handled automatically by SmartSense, but absolute capacitance extraction requires external instrumentation or custom firmware compensation.
Is SWD debug supported in Deep Sleep mode?
No, Serial Wire Debug (SWD) is disabled in Deep Sleep mode. The SWDCLK and SWDIO pins retain their debug functionality only in Active and Sleep modes. To debug low-power behavior, developers must use wakeup-triggered breakpoints or log data to SRAM before entering Deep Sleep, then read it upon wake.
CY8C4024AZI-S413 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-LQFP
- Series:
- PSOC™ 4 CY8C4000S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 24MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 1x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4024AZI-S413 FAQ
1.How can I place an order for CY8C4024AZI-S413 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4024AZI-S413 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4024AZI-S413 reliable?
The price and inventory of CY8C4024AZI-S413 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4024AZI-S413 is usually 5 days.
3.What payment methods are accepted for CY8C4024AZI-S413?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4024AZI-S413 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4024AZI-S413?
CY8C4024AZI-S413 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4024AZI-S413 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4024AZI-S413?
For technical support, including CY8C4024AZI-S413 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4024AZI-S413 requirements.
6.How does Aetrix verify that CY8C4024AZI-S413 is sourced from the original manufacturer or authorized distributors?
All CY8C4024AZI-S413 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4024AZI-S413 meets industry standards.
7.What is the process for return or replacement of CY8C4024AZI-S413?
All CY8C4024AZI-S413 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4024AZI-S413, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4024AZI-S413 part is unused and in its original packaging.
Return procedure for CY8C4024AZI-S413:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4024AZI-S413 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
