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Infineon Technologies CY8C4025FNI-T412T
- Part No.:
- CY8C4025FNI-T412T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 25-XFBGA, WLCSP
- Datasheet:
-
CY8C4025FNI-T412T.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 25XFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,624
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Product details
Overview
CY8C4025FNI-T412T from Infineon is a 32-bit Arm® Cortex®-M0+ microcontroller with fifth-generation CAPSENSE™ and multi-sense HMI technology, operating from 1.71 V to 5.5 V, delivering 48 MHz CPU performance, 32 KB flash, 4 KB SRAM, and hardware-accelerated capacitive + inductive sensing for ultra-low-power touch interfaces in wearables and IoT edge devices.
For engineers reviewing the CY8C4025FNI-T412T datasheet, CY8C4025FNI-T412T pinout, CY8C4025FNI-T412T application, or CY8C4025FNI-T412T equivalent, key selection criteria include deep-sleep current (6 µA with always-on touch), 13.5-bit ENOB resolution, 16-sensor capacitive support, 6-channel inductive sensing capability, and WLCSP-25 package compatibility with 0.35 mm pitch.
Technical Context
The CY8C4025FNI-T412T integrates an Arm® Cortex®-M0+ core with dedicated hardware blocks for autonomous CAPSENSE™ scanning - including ratio-metric multi-sense converter (MSCLP) and hardware-based wake-on-touch - enabling CPU-independent sensing during Deep Sleep mode. It supports both self- and mutual-capacitance configurations alongside flyback inductive sensing across 40 kHz–5.7 MHz excitation range.
Its dual reconfigurable serial communication blocks (SCBs) deliver runtime-switchable I²C/SPI/UART functionality, while two 16-bit TCPWM units provide center-aligned PWM, quadrature decoding, and comparator-triggered kill signals. Clocking includes ±2% IMO and 40 kHz ILO, and GPIOs are configurable for sensing, digital I/O, or analog functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz max - enables real-time firmware execution with single-cycle multiply for sensor fusion algorithms. |
| Flash / SRAM | 32 KB flash / 4 KB SRAM - sufficient for CAPSENSE™ middleware, low-power state machine, and BLE stack integration. |
| Supply Range | 1.71 V to 5.5 V - supports direct battery operation (e.g., coin cell, Li-ion, USB VBUS) without external LDO. |
| Deep Sleep Current | 6 µA with active touch sensing - allows multi-week battery life in wearable HMI applications. |
| Sensing Resolution | 13.5-bit ENOB - delivers high-fidelity proximity and hover detection even under wet or noisy conditions. |
| Capacitive Channels | Up to 16 electrodes - supports complex touchpads, sliders, and gesture-enabled controls in compact form factors. |
| Inductive Channels | Up to 6 sensor pairs - enables metal-detection UI, liquid-level sensing, and robust proximity in EMI-heavy environments. |
Pinout & Package
Package: 25-pin Wafer-Level Chip Scale Package (WLCSP) with 0.35 mm pitch, 2.13 mm × 2.13 mm body size, and 0.29 mm height - optimized for space-constrained wearables and hearables.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main power supply input | Accepts 1.71–5.5 V; powers digital core, analog subsystem, and CAPSENSE™ hardware. |
| VSS | Digital ground reference | Common return path for all digital logic and I/O buffers; must be low-impedance. |
| P0.0–P0.7 | Programmable GPIO / CAPSENSE™ electrode | Supports self/mutual capacitance sensing; configurable as analog input or digital I/O. |
| P1.0–P1.7 | Programmable GPIO / inductive sensing terminal | Drives/receives flyback inductive signals; supports differential pair configuration for noise immunity. |
| P2.2 / P2.3 | I²C SCL / SDA (bootloader default) | Pre-configured for DFU via ModusToolbox™; requires external 4.7 kΩ pull-ups. |
| SWDIO / SWCLK | Serial Wire Debug interface | Enables full on-chip debug and programming; security lock disables access after firmware commit. |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous CAPSENSE™ scanning | Hardware-accelerated channel scanning in Deep Sleep mode eliminates CPU wakeups, reducing average system current to 200 µA during active tracking. |
| Multi-sense converter (MSCLP) | Ratio-metric architecture achieves >5:1 SNR and superior liquid tolerance - validated per AN239805 for water-covered touch surfaces. |
| Flyback inductive sensing | Supports 100 nH–200 µH coil range with spread-spectrum excitation - enables reliable metal detection through plastic housings up to 8 mm thick. |
| Class-B firmware library | Pre-certified functional safety components simplify IEC 61508 SIL-2 or UL 60730 compliance for HMI control systems. |
| ModusToolbox™ integration | Out-of-box support for CAPSENSE™ Tuner, PDL drivers, and DFU middleware - cuts development time for production-ready touch firmware by ≥40%. |
Applications
| Smart Wearable Touchband | Water-Resistant Appliance Control Panel |
|---|---|
|
Use Scenario: A wrist-worn fitness tracker with gesture-controlled UI and sweat-resistant touch buttons. IC Role / Device Role / Timing Role: MCU host + CAPSENSE™ sensor hub with always-on wake-on-touch and inductive proximity for strap detection. Use Value: 6 µA Deep Sleep current extends battery life beyond 14 days; 13.5-bit ENOB ensures reliable swipe detection under saline perspiration. |
Use Scenario: Dishwasher control panel requiring touch operation with splash and detergent exposure. IC Role / Device Role / Timing Role: Primary HMI controller executing CAPSENSE™ liquid-tolerant overlay and inductive metal-door latch detection. Use Value: MSCLP architecture maintains >5:1 SNR despite conductive film contamination; Class-B library accelerates UL 60730 certification. |
| Wireless Earbud Case Interface | Industrial Human-Machine Terminal |
|
Use Scenario: Compact charging case with capacitive lid-open detection and inductive battery level sensing. IC Role / Device Role / Timing Role: Dual-mode sensing controller using mutual-capacitance for lid status and flyback inductance for battery coil coupling. Use Value: Single-chip solution replaces discrete Hall + cap sense; WLCSP-25 footprint fits ≤12 mm × 12 mm PCB area. |
Use Scenario: Factory-floor HMI panel exposed to oil mist, vibration, and EMI from motor drives. IC Role / Device Role / Timing Role: Ruggedized touch controller with hardware filtering, spread-spectrum inductive sensing, and watchdog-managed firmware recovery. Use Value: Flyback method rejects 50/60 Hz line noise; autonomous scanning prevents UI freeze during CPU-intensive PLC communication cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power HMI microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C4025LQI-T412T | Same die, 24-pin QFN-0.5 mm pitch instead of WLCSP-25 - larger footprint, easier rework, higher thermal mass. | Preferred for prototyping or industrial panels where board space permits and hand-soldering is required. | Select when mechanical robustness or test accessibility outweighs miniaturization needs. |
| CY8C4025FNI-S412T | Same WLCSP-25 package but with 64 KB flash / 8 KB SRAM - identical pinout and sensing IP, higher memory headroom. | Suitable for designs adding BLE connectivity or advanced gesture algorithms requiring >32 KB code space. | Choose if future firmware expansion or dual-role (sensor + comms) functionality is planned. |
Compared with CY8C4025FNI-T412T, the QFN variant trades miniaturization for assembly flexibility, while the -S412T variant retains identical sensing performance but adds memory headroom - neither offers improved SNR or lower deep-sleep current.
Availability
CY8C4025FNI-T412T is available at Aetrix Electronics and suitable for smart wearables, water-resistant appliance interfaces, and wireless earbud accessories requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.
Supply support for CY8C4025FNI-T412T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, and microcontroller solutions for industrial, automotive, and IoT markets.
The PSoC™ 4000T product line delivers fifth-generation CAPSENSE™ and multi-sense HMI technology - purpose-built for ultra-low-power, liquid-tolerant, and EMI-resilient human interface applications in space-constrained edge devices.
FAQ
What is the default bootloader configuration for CY8C4025FNI-T412T?
The factory-installed bootloader uses I²C interface on P2.2 (SCL) and P2.3 (SDA) at slave address 0x0C and 400 kbps data rate. It occupies the bottom 12.5 KB of flash (0x00000000–0x00003200), supports single application loading starting at 0x00003200, and includes a two-second timeout before launching user firmware.
Does CY8C4025FNI-T412T support hardware-based wake-on-touch in Deep Sleep mode?
Yes - it features dedicated CAPSENSE™ hardware that performs autonomous electrode scanning and threshold comparison without CPU involvement. A hardware interrupt triggers wake-up only upon valid touch event, maintaining 6 µA typical current draw during standby.
Can the same firmware binary run on both CY8C4025FNI-T412T and CY8C4025LQI-T412T?
Yes - they share identical silicon die, memory map, peripheral register layout, and CAPSENSE™ IP. Firmware compiled for one will operate functionally identically on the other; only PCB layout and thermal design differ due to WLCSP vs. QFN packaging.
What inductive sensing topologies are supported by the CY8C4025FNI-T412T?
It implements flyback inductive sensing using integrated current sources and ADCs, supporting series-resonant LC tank configurations with 100 nH–200 µH inductance range. Excitation frequency is programmable from 40 kHz to 5.7 MHz, and spread-spectrum clocking is available to reduce EMI impact on adjacent circuits.
CY8C4025FNI-T412T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 25-XFBGA, WLCSP
- Series:
- PSOC™ 4 CY8C4000S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, Microwire, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, POR, PWM, WDT
- Number of I/O:
- 21
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4025FNI-T412T FAQ
1.How can I place an order for CY8C4025FNI-T412T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4025FNI-T412T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4025FNI-T412T reliable?
The price and inventory of CY8C4025FNI-T412T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4025FNI-T412T is usually 5 days.
3.What payment methods are accepted for CY8C4025FNI-T412T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4025FNI-T412T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4025FNI-T412T?
CY8C4025FNI-T412T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4025FNI-T412T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4025FNI-T412T?
For technical support, including CY8C4025FNI-T412T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4025FNI-T412T requirements.
6.How does Aetrix verify that CY8C4025FNI-T412T is sourced from the original manufacturer or authorized distributors?
All CY8C4025FNI-T412T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4025FNI-T412T meets industry standards.
7.What is the process for return or replacement of CY8C4025FNI-T412T?
All CY8C4025FNI-T412T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4025FNI-T412T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4025FNI-T412T part is unused and in its original packaging.
Return procedure for CY8C4025FNI-T412T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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