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Infineon Technologies CY8C4026FNI-T412T
- Part No.:
- CY8C4026FNI-T412T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 25-XFBGA, WLCSP
- Datasheet:
-
CY8C4026FNI-T412T.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 25XFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,900
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Product details
Overview
CY8C4026FNI-T412T from Infineon is a 32-bit Arm® Cortex®-M0+ microcontroller with fifth-generation CAPSENSE™ and multi-sense HMI technology, 48 MHz CPU, 32 KB flash, 4 KB SRAM, and deep-sleep current of 6 µA with always-on touch detection. It integrates capacitive and inductive sensing subsystems, two reconfigurable serial communication blocks (SCBs), and two 16-bit TCPWM modules - deployed in ultra-low-power wearable and hearable human-machine interface designs.
For engineers reviewing the CY8C4026FNI-T412T datasheet, CY8C4026FNI-T412T pinout, CY8C4026FNI-T412T application, or CY8C4026FNI-T412T equivalent, key selection criteria include deep-sleep current with hardware wake-on-touch, 13.5-bit ENOB resolution for capacitive sensing, inductive sensor excitation range (40 kHz–5.7 MHz), and WLCSP-25 package compatibility with 0.35 mm pitch.
Technical Context
The CY8C4026FNI-T412T implements a dedicated multi-sense converter (MSCLP) with ratio-metric architecture for simultaneous capacitive and inductive sensing, enabling autonomous channel scanning without CPU intervention. Its CAPSENSE™ subsystem supports self- and mutual-capacitance modes with automatic hardware tuning and Class-B firmware library support.
It features dual runtime-reconfigurable SCBs supporting I²C/SPI/UART in any combination, plus two TCPWM blocks with quadrature decode, center-aligned PWM, and comparator-triggered kill signals. Clocking includes ±2% IMO and 40 kHz ILO, and debug uses Arm® SWD with configurable security lockout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz - enables real-time HMI processing with single-cycle multiply for gesture math. |
| Flash / SRAM | 32 KB flash / 4 KB SRAM - sufficient for CAPSENSE™ middleware + BLE stack integration in compact wearables. |
| Deep Sleep Current | 6 µA with always-on touch detection - allows battery-powered devices to operate >1 year on coin cell with wake-on-touch. |
| CAPSENSE™ ENOB | 13.5-bit effective resolution - delivers high SNR (>5:1) for reliable proximity and hover detection through glass or plastic. |
| Inductive Sensing | Up to 6 sensors, 100 nH–200 µH range, 40 kHz–5.7 MHz excitation - supports metal-detection UIs and liquid-tolerant controls. |
| GPIO Count | 21 programmable pins - supports mixed-signal routing for sensor electrodes, I/O, and communication interfaces in WLCSP-25. |
| Operating Voltage | 1.71 V to 5.5 V - enables direct Li-ion or coin-cell operation without external LDO in space-constrained designs. |
Pinout & Package
The CY8C4026FNI-T412T is housed in a 25-pin Wafer-Level Chip Scale Package (WLCSP) with 0.35 mm pitch, optimized for ultra-compact wearable PCBs. Pin functions are validated per Infineon's PSOC™ 4000T datasheet Rev. *L, Table 2-1 (Pin Functions) and Figure 7-1 (WLCSP-25 package diagram).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0 / VDDIO | IO power supply | Supplies I/O bank voltage; must be decoupled locally for stable capacitive sensing reference. |
| P1.0 / SDA | I²C data line | Default I²C slave interface for bootloader communication (address 0x0C); requires external pull-up. |
| P2.2 / SCL | I²C clock line | Configured for factory bootloader; used with P2.3 for DFU over I²C at 400 kbps. |
| P3.0 / SWDIO | SWD debug I/O | Primary debug interface; supports full chip programming, tracing, and secure firmware update. |
| P4.0 / XRES | External reset input | Active-low asynchronous reset; internal pull-up ensures reliable boot without external component. |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous CAPSENSE™ scanning | Hardware-accelerated electrode scanning in Deep Sleep mode - eliminates CPU polling, reducing active time by >90%. |
| Multi-sense converter (MSCLP) | Dual-mode sensing engine with shared analog front-end - enables seamless transition between capacitive and inductive sensing on same electrodes. |
| Class-B certified firmware library | Pre-validated safety routines for IEC 61508 SIL2 - accelerates functional safety certification for industrial HMI. |
| Smart sensing algorithm | Real-time hardware-based auto-tuning of sensor baseline and sensitivity - maintains performance across temperature and humidity shifts. |
| SWD debug security lock | Firmware-controllable debug disable with permanent lock option - prevents unauthorized firmware extraction or reprogramming. |
Applications
| Smart Wearable Touchband | Water-Resistant Appliance Control Panel |
|---|---|
|
Use Scenario: A wrist-worn fitness tracker with gesture-enabled navigation and sweat-resistant touch controls. IC Role / Device Role / Timing Role: Primary MCU executing CAPSENSE™ firmware, managing BLE connectivity, and coordinating low-power sensor fusion. Use Value: 6 µA deep-sleep current extends battery life to 14 months; liquid-tolerant multi-sense sensing works reliably under perspiration. |
Use Scenario: Dishwasher control panel requiring touch response through thick glass and resistance to detergent splash and steam. IC Role / Device Role / Timing Role: Dedicated HMI controller handling all capacitive button inputs, status LED PWM, and I²C communication with main MCU. Use Value: Ratio-metric CAPSENSE™ architecture rejects common-mode noise from heating elements; inductive sensing detects metal utensil presence. |
| Hearable Device Proximity Sensor | Industrial IoT Buttonless Interface |
|
Use Scenario: True wireless earbuds detecting ear insertion/removal and tap gestures via embedded electrodes. IC Role / Device Role / Timing Role: Ultra-low-power co-processor managing always-on proximity and tap detection, waking main SoC only on valid event. Use Value: Hardware wake-on-touch reduces system-wide average current to <200 µA; 100 aF noise floor enables sub-millimeter proximity resolution. |
Use Scenario: Factory-floor HMI panel replacing mechanical buttons with sealed, vandal-proof touch surfaces exposed to oil and dust. IC Role / Device Role / Timing Role: Standalone HMI controller interfacing with PLC via UART, driving local status indicators and reading multi-electrode touch zones. Use Value: Inductive sensing detects gloved finger actuation; Class-B firmware library simplifies compliance with IEC 62061 functional safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power HMI microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C4025FNI-T412T | 24 KB flash / 4 KB SRAM, identical CAPSENSE™ and package - lacks one SCB and one TCPWM block. | Suitable for simpler touch-only interfaces without concurrent UART+I²C or dual PWM outputs. | Select when firmware footprint <20 KB and no need for dual communication channels or quadrature decoding. |
| CY8C4046FNI-T412T | 64 KB flash / 8 KB SRAM, same peripherals - adds one additional SCB and TCPWM block; higher BOM cost. | Required for complex HMI with BLE co-processing, dual-sensor fusion, or motor control PWM alongside touch. | Choose when future firmware expansion, concurrent protocols, or advanced timing control are design-critical. |
Compared with CY8C4025FNI-T412T and CY8C4046FNI-T412T, the CY8C4026FNI-T412T delivers optimal balance: sufficient memory for CAPSENSE™ + lightweight RTOS, full dual-SCB flexibility, and WLCSP-25 footprint - making it the most widely adopted variant for production wearables and sealed industrial panels.
Availability
CY8C4026FNI-T412T is available at Aetrix Electronics and suitable for smart wearables, water-resistant appliance interfaces, and industrial IoT HMI systems requiring stable component supply, long-term lifecycle assurance, and qualified traceable sourcing.
Supply support for CY8C4026FNI-T412T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded controllers, with global R&D centers and ISO/TS 16949-certified manufacturing.
The CY8C4026FNI-T412T belongs to the PSoC™ 4000T product line - engineered specifically to deliver fifth-generation CAPSENSE™ with multi-sense capability in ultra-compact WLCSP packages for next-generation low-power human-machine interfaces.
FAQ
Does CY8C4026FNI-T412T support hardware-based wake-on-touch in Deep Sleep mode?
Yes. The device implements a dedicated CAPSENSE™ hardware block that scans electrodes autonomously while the CPU remains powered down. Wake events trigger an interrupt without CPU involvement, achieving 6 µA total current draw during standby. This function is enabled by default and requires no firmware polling.
What is the maximum number of capacitive and inductive sensors supported simultaneously?
The CY8C4026FNI-T412T supports up to 16 capacitive sensors (self- or mutual-capacitance) and up to 6 inductive sensor pairs concurrently. Both modalities share the same analog front-end resources but operate under separate configuration registers - enabling hybrid sensing on overlapping electrode layouts.
Is the factory-installed I²C bootloader configurable or replaceable?
The pre-programmed I²C bootloader occupies the bottom 12.5 KB of flash (0x00000000–0x00003200) and is configurable only via ModusToolbox™ DFU middleware. It can be overwritten using SWD/JTAG programming, but doing so removes the default 0x0C I²C address and two-second timeout behavior unless manually reimplemented.
Can the WLCSP-25 package be hand-soldered or reworked on standard FR-4 PCBs?
No. The 0.35 mm pitch and 0.25 mm ball diameter require controlled-environment reflow with nitrogen atmosphere, stencil-applied solder paste, and optical alignment. Hand soldering is not feasible; rework demands precision hot-air stations with vacuum pickup and thermal profiling to avoid die cracking or solder bridging.
CY8C4026FNI-T412T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 25-XFBGA, WLCSP
- Series:
- PSOC™ 4 CY8C4000S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 24MHz
- Connectivity:
- I2C, Microwire, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, POR, PWM, WDT
- Number of I/O:
- 21
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4026FNI-T412T FAQ
1.How can I place an order for CY8C4026FNI-T412T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4026FNI-T412T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4026FNI-T412T reliable?
The price and inventory of CY8C4026FNI-T412T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4026FNI-T412T is usually 5 days.
3.What payment methods are accepted for CY8C4026FNI-T412T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4026FNI-T412T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4026FNI-T412T?
CY8C4026FNI-T412T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4026FNI-T412T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4026FNI-T412T?
For technical support, including CY8C4026FNI-T412T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4026FNI-T412T requirements.
6.How does Aetrix verify that CY8C4026FNI-T412T is sourced from the original manufacturer or authorized distributors?
All CY8C4026FNI-T412T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4026FNI-T412T meets industry standards.
7.What is the process for return or replacement of CY8C4026FNI-T412T?
All CY8C4026FNI-T412T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4026FNI-T412T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4026FNI-T412T part is unused and in its original packaging.
Return procedure for CY8C4026FNI-T412T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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