Infineon Technologies CY8C4045LQI-T411

Overview

CY8C4045LQI-T411 from Infineon is a 32-bit Arm® Cortex®-M0+ microcontroller with fifth-generation CAPSENSE™ and Multi-Sense HMI technology, integrated 48-MHz CPU, 32 KB flash, 4 KB SRAM, and hardware-accelerated capacitive + inductive sensing. It operates from 1.71 V to 5.5 V, achieves 6 µA Deep Sleep with always-on touch detection, and supports up to 16 capacitive and 6 inductive sensors - deployed in ultra-low-power wearable and IoT human-machine interface designs.

For engineers reviewing the CY8C4045LQI-T411 datasheet, CY8C4045LQI-T411 pinout, CY8C4045LQI-T411 application, or CY8C4045LQI-T411 equivalent, key selection criteria include its 6 µA Deep Sleep current with autonomous wake-on-touch, 13.5-bit ENOB multi-sense converter, dual reconfigurable SCBs (I²C/SPI/UART), TCPWM timing blocks, and WLCSP-25 package compatibility for space-constrained HMI endpoints.

Technical Context

The CY8C4045LQI-T411 implements a dedicated multi-sense converter (MSCLP) with ratio-metric architecture enabling simultaneous capacitive and inductive sensing without CPU intervention. Its Deep Sleep mode retains full sensor scanning capability via hardware-based wake triggers and supports Class-B firmware certification through built-in self-test logic and hardware filters.

It integrates two independent serial communication blocks (SCBs) that support runtime reconfiguration between I²C, SPI, and UART modes - one SCB provides master/slave I²C with clock stretching, while the other supports full-duplex SPI or asynchronous UART with configurable baud rates up to 1 Mbps. The device uses a 48-MHz IMO with ±2% accuracy and includes a 40-kHz ILO for low-power timing.

Key Specifications

Pinout & Package

The CY8C4045LQI-T411 is housed in a 25-pin Wafer-Level Chip Scale Package (WLCSP) with 0.35 mm pitch, optimized for ultra-compact wearable and hearable form factors. Pin assignments are validated per Infineon's official package drawing 002-33949 Rev. *L, Figure 2.1 and Table 2-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-power HMI microcontroller applications.

Compared with CY8C4045LQI-S412, this part trades flash/SRAM capacity for smaller footprint and lower unit cost; versus STM32G031K8T6, it delivers turnkey multi-sense HMI with hardware acceleration, eliminating external components and firmware tuning overhead.

Availability

CY8C4045LQI-T411 is available at Aetrix Electronics and suitable for smart wearables, hearable devices, and industrial HMI panels requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.

Supply support for CY8C4045LQI-T411 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and microcontroller solutions for industrial, automotive, and IoT markets.

This device belongs to the PSoC™ 4000T product line - engineered specifically to deliver fifth-generation CAPSENSE™ and Multi-Sense HMI capabilities in ultra-low-power, space-constrained endpoints such as wearables and smart sensors.

FAQ

What is the factory-installed bootloader configuration for CY8C4045LQI-T411?

The device ships with an I²C bootloader pre-flashed into the bottom 12.5 KB of flash (0x00000000–0x00003200), configured for slave address 0x0C, 400 kbps data rate, and SCL/SDA on P2.2/P2.3. It supports single-application layout starting at 0x00003200 and includes a four-byte product ID for target verification during DFU.

Does CY8C4045LQI-T411 support hardware-based Class-B compliance testing?

Yes - it includes dedicated hardware logic for CRC-based memory checking, clock failure detection, and watchdog timer validation, all aligned with IEC 61508 Annex F and UL 60730 requirements. These features are enabled via the Infineon-provided Class-B firmware library and require no external components.

Can the WLCSP-25 package be hand-soldered or reworked reliably?

No - the 0.35 mm pitch and 0.25 mm ball diameter require precision reflow profiling and X-ray inspection. Infineon recommends stencil printing with Type 4 solder paste, nitrogen atmosphere reflow, and automated optical inspection. Hand soldering is not supported due to thermal and alignment constraints.

How does the multi-sense converter handle simultaneous capacitive and inductive sensing?

The MSCLP block uses time-multiplexed excitation and ratio-metric sampling to acquire both sensor types within a single scan cycle. Capacitive channels use CSD architecture with shield-driven electrodes, while inductive channels apply flyback excitation at 40 kHz–5.7 MHz with spread-spectrum clocking - all managed autonomously without CPU involvement.