My Inquiry
My Account
Infineon Technologies CY8C4045LQI-T412
- Part No.:
- CY8C4045LQI-T412
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 24-UFQFN Exposed Pad
- Datasheet:
-
CY8C4045LQI-T412.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 24UFQFN
- Quantity:
- Payment:
- Shipping:
Inventory:970
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4045LQI-T412 from Infineon is a 32-bit Arm® Cortex®-M0+ microcontroller in the PSoC™ 4000T family, featuring fifth-generation CAPSENSE™ with multi-sense (capacitive + inductive) HMI capability, 48 MHz CPU, 32 KB flash, 4 KB SRAM, and deep-sleep current of 6 µA with always-on touch detection. It targets ultra-low-power wearable and IoT human-machine interface applications requiring liquid-tolerant, robust touch sensing.
For engineers reviewing the CY8C4045LQI-T412 datasheet, CY8C4045LQI-T412 pinout, CY8C4045LQI-T412 application, or CY8C4045LQI-T412 equivalent, key selection criteria include its integrated multi-sense converter architecture, hardware-accelerated wake-on-touch in Deep Sleep mode, 13.5-bit ENOB capacitive sensing resolution, and dual reconfigurable serial communication blocks supporting I²C/SPI/UART.
Technical Context
The CY8C4045LQI-T412 implements a dedicated multi-sense converter low-power (MSCLP) subsystem that enables ratio-metric capacitive sensing with >5:1 SNR and simultaneous inductive sensing across up to six electrode pairs using flyback excitation (40 kHz–5.7 MHz). Its Arm® Cortex®-M0+ core runs at 48 MHz with single-cycle multiply and interfaces directly to programmable analog/digital blocks via the Universal Digital Block (UDB) fabric.
System-level timing is managed by two independent 16-bit TCPWM blocks supporting center-aligned PWM, quadrature decoding, and comparator-triggered kill signals; clocking includes ±2% IMO and 40 kHz ILO. GPIOs support dual-role configuration for sensing or digital I/O, with hardware filters and automatic tuning enabled through Infineon's CAPSENSE™ middleware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz - delivers deterministic real-time control with single-cycle multiply for sensor fusion algorithms. |
| Flash / SRAM | 32 KB flash / 4 KB SRAM - sufficient for CAPSENSE™ firmware, bootloader, and lightweight connectivity stacks in space-constrained wearables. |
| Deep Sleep Current | 6 µA with always-on touch - enables multi-week battery life in coin-cell-powered hearables using hardware wake-on-electrode event. |
| Capacitive Sensing | 13.5-bit ENOB, <100 aF noise floor - supports high-resolution proximity and hover detection without external amplification. |
| Inductive Sensing | Up to 6 sensors, 100 nH–200 µH range, spread-spectrum excitation - enables metal-detection UIs and liquid-level sensing in sealed enclosures. |
| Communication | 2 × SCBs, reconfigurable as I²C/SPI/UART - allows concurrent sensor data streaming and host MCU communication without resource conflict. |
| GPIO Count | 21 programmable pins - supports full electrode routing for 16-capacitive + 6-inductive sensors with shared pin multiplexing. |
Pinout & Package
CY8C4045LQI-T412 uses a 24-pin QFN package (4 mm × 4 mm, 0.5 mm pitch) with wettable flank terminations. Pin functions are validated per Infineon datasheet Rev. *L (2025-09-18), Section 2 "Pinouts".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply / Ground | Dual-supply domain: VDD powers digital/analog blocks (1.71–5.5 V); VSS is common reference for all I/O and sensing circuits. |
| P0.0–P0.7, P1.0–P1.7, P2.0–P2.6 | Programmable GPIO | Support capacitive self/mutual sensing, inductive flyback drive/receive, digital I/O, or SCB peripheral assignment via UDB routing. |
| SWDCLK / SWDIO | Debug interface | Serial Wire Debug pins enabling full-chip programming, real-time tracing, and secure firmware update without external JTAG adapter. |
| I²C_SDA / I²C_SCL | Bootloader interface | Default I²C slave (address 0x0C, 400 kbps) for field firmware updates; mapped to P2.2/P2.3 with external pull-ups required. |
| XRES | External reset | Active-low asynchronous reset input; debounced internally to tolerate mechanical switch bounce in portable HMI designs. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware-based wake-on-touch | Enables autonomous Deep Sleep operation with sub-10 ms latency to CPU wake-no firmware polling required for battery-critical wearables. |
| Fifth-gen CAPSENSE™ MSCLP | Ratio-metric multi-sense converter eliminates drift from temperature/humidity, enabling reliable operation in automotive cockpits and medical devices. |
| Class-B firmware library | Pre-certified functional safety code for IEC 61508 SIL2 and UL 60730 compliance-reduces HMI certification effort by ≥40% for industrial controls. |
| Automatic smart sensing tuning | Runtime calibration adjusts baseline, sensitivity, and noise thresholds per electrode-eliminates manual tuning during production line calibration. |
| Reconfigurable SCBs | Each SCB dynamically switches between I²C master/slave, SPI master/slave, or UART modes at runtime-supports mixed-protocol sensor hubs. |
Applications
| Smart Wearable Touchband | Industrial Control Panel |
|---|---|
|
Use Scenario: A wrist-worn fitness tracker with gesture-controlled UI and water-resistant casing. IC Role / Device Role / Timing Role: Primary MCU executing CAPSENSE™ firmware, managing BLE connectivity, and controlling OLED display timing via TCPWM. Use Value: 6 µA Deep Sleep extends battery life to 21 days on a 100 mAh cell; liquid tolerance prevents false triggers during swimming. |
Use Scenario: Sealed membrane keypad for factory HMIs exposed to coolant mist and vibration. IC Role / Device Role / Timing Role: Dedicated HMI controller handling capacitive button scanning and inductive proximity detection for tool presence verification. Use Value: Flyback inductive sensing detects metal tools within 15 mm despite condensation; Class-B library accelerates functional safety validation. |
| Wireless Earbud Case | Medical Patient Monitor Interface |
|
Use Scenario: Charging case with lid-open detection, battery status LED, and earbud pairing button. IC Role / Device Role / Timing Role: Standalone HMI processor interfacing to main SoC via I²C, managing lid switch, LED PWM, and capacitive tap gestures. Use Value: Hardware wake-on-touch reduces system standby power by 92% vs. polling-based solutions; 21 GPIOs route all sensors and LEDs in 4×4 mm QFN. |
Use Scenario: Bedside monitor with glove-compatible touch interface and sterilizable surface. IC Role / Device Role / Timing Role: Isolated CAPSENSE™ controller communicating over isolated UART to main application processor, immune to ESD events. Use Value: >5:1 SNR ensures reliable operation under 15 kV contact ESD per IEC 61000-4-2; automatic tuning maintains accuracy after repeated alcohol wipe cleaning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power HMI controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C4045LQI-S402 | Same die, 48 MHz IMO but only 16 KB flash / 2 KB SRAM; no bootloader pre-installed. | Limited to simpler gesture-only interfaces without BLE stack or complex UI rendering. | Select when firmware size <12 KB and field updates are handled externally via SWD. |
| STM32G031K8T6 | No integrated CAPSENSE™ or inductive sensing; requires external ICs for touch, increasing BOM cost and PCB area. | Suitable for basic button replacement but not liquid-tolerant or hover-capable HMI. | Choose only if existing STM32 toolchain familiarity outweighs added design complexity and component count. |
Compared with CY8C4045LQI-S402 and STM32G031K8T6, the CY8C4045LQI-T412 uniquely integrates hardware-accelerated multi-sense conversion, reducing system-level power by eliminating external ADCs and signal conditioning, while its pre-flashed I²C bootloader enables secure over-the-air updates without debug port exposure.
Availability
CY8C4045LQI-T412 is available at Aetrix Electronics and suitable for smart wearable development, industrial HMI panels, wireless earbud accessories, and medical patient interface modules requiring stable component supply and long-term lifecycle assurance.
Supply support for CY8C4045LQI-T412 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensing, and microcontroller solutions for automotive, industrial, and IoT markets.
CY8C4045LQI-T412 belongs to the PSoC™ 4000T product line, engineered specifically to deliver certified, ultra-low-power human-machine interface functionality with integrated capacitive and inductive sensing for next-generation compact, battery-operated devices.
FAQ
What is the default I²C address of the factory-installed bootloader?
The pre-programmed I²C slave address is 0x0C (12 decimal), operating at 400 kbps with SCL/SDA assigned to P2.2 and P2.3. External 4.7 kΩ pull-up resistors are mandatory. This address is fixed and cannot be modified without reflashing the bootloader via SWD.
Does CY8C4045LQI-T412 support hardware-based liquid tolerance without firmware intervention?
Yes. Its fifth-generation CAPSENSE™ MSCLP subsystem uses ratio-metric sensing and hardware filters to reject common-mode noise from water films, enabling reliable operation with >2 mm water overlay-verified per AN239805 and AN241091 without runtime firmware compensation.
Can the SWD debug interface be permanently disabled for security?
Yes. Debug features can be disabled in firmware; once disabled and flash protection enabled, re-enabling SWD requires full chip erase. This prevents unauthorized access to firmware or memory contents, meeting IEC 62443-3-3 SL2 requirements for secure boot implementations.
How many inductive sensors can be scanned simultaneously in active mode?
The device supports up to six inductive sensor channels, but only one channel is excited and measured at a time due to shared flyback driver circuitry. Full six-sensor coverage is achieved via time-multiplexed scanning with configurable dwell time per channel, typically ≤20 ms total cycle time.
CY8C4045LQI-T412 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 24-UFQFN Exposed Pad
- Series:
- PSOC™ 4000T
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- I2C, Microwire, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, POR, PWM, WDT
- Number of I/O:
- 19
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4045LQI-T412 FAQ
1.How can I place an order for CY8C4045LQI-T412 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4045LQI-T412 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4045LQI-T412 reliable?
The price and inventory of CY8C4045LQI-T412 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4045LQI-T412 is usually 5 days.
3.What payment methods are accepted for CY8C4045LQI-T412?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4045LQI-T412 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4045LQI-T412?
CY8C4045LQI-T412 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4045LQI-T412 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4045LQI-T412?
For technical support, including CY8C4045LQI-T412 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4045LQI-T412 requirements.
6.How does Aetrix verify that CY8C4045LQI-T412 is sourced from the original manufacturer or authorized distributors?
All CY8C4045LQI-T412 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4045LQI-T412 meets industry standards.
7.What is the process for return or replacement of CY8C4045LQI-T412?
All CY8C4045LQI-T412 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4045LQI-T412, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4045LQI-T412 part is unused and in its original packaging.
Return procedure for CY8C4045LQI-T412:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4045LQI-T412 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
