Infineon Technologies CY8C4127LQAS455XQSA1
- Part No.:
- CY8C4127LQAS455XQSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 56-UFQFN Exposed Pad
- Datasheet:
-
CY8C4127LQAS455XQSA1.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 56UFQFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,339
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4127LQAS455XQSA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Plus microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 128 KB flash, 16 KB SRAM, and integrated CAPSENSE™ capacitive sensing with SmartSense™ auto-tuning. It includes five reconfigurable serial communication blocks (SCB), eight 16-bit TCPWM units, a CAN 2.0B controller with TTCAN support, and programmable analog blocks including two opamps and a 12-bit 1-Msps SAR ADC. It targets automotive body electronics requiring robust touch interfaces and real-time control.
For engineers reviewing the CY8C4127LQAS455XQSA1 datasheet, CY8C4127LQAS455XQSA1 pinout, CY8C4127LQAS455XQSA1 application, or CY8C4127LQAS455XQSA1 equivalent, key selection criteria include AEC-Q100 Grade-S qualification, on-chip CAPSENSE™ SNR >5:1 with water tolerance, CAN 2.0B + TTCAN timing compliance, Deep Sleep current of 2.5 µA, and full ModusToolbox™/PSoC™ Creator toolchain support for rapid capacitive-sensing and motor-control firmware development.
Technical Context
The device implements a tightly integrated mixed-signal SoC architecture where the Arm® Cortex®-M0+ core executes firmware while programmable digital logic (Smart I/O, TCPWM) and analog resources (CTB opamps, SAR ADC, CSD block) operate concurrently under hardware-triggered or DMA-driven coordination. Its clock system combines a 4–33 MHz ECO, PLL, 32-kHz WCO, and ±2% IMO to support deterministic real-time operation across temperature.
Capacitive sensing is handled by a dedicated capacitance-sigma-delta (CSD) block delivering >5:1 SNR and hardware-accelerated SmartSense™ tuning-enabling reliable touch detection in wet or noisy automotive environments without host CPU intervention. The CAN 2.0B block supports time-triggered operation (TTCAN) with configurable bit timing and error counters compliant with ISO 11898-1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz max - enables deterministic real-time execution of safety-critical automotive tasks with Thumb-2 instruction set and NVIC interrupt handling. |
| Memory | 128 KB flash (with Read Accelerator), 16 KB SRAM - supports complex firmware with bootloader, CAPSENSE™ library, and CAN protocol stack in single-chip solution. |
| Analog Performance | 12-bit 1-Msps SAR ADC, two rail-to-rail opamps, dual IDACs - allows simultaneous high-resolution sensor acquisition and analog signal conditioning on any GPIO. |
| Capacitive Sensing | CAPSENSE™ CSD block with >5:1 SNR and SmartSense™ auto-tuning - delivers production-ready wet-finger immunity and eliminates manual calibration effort in door handle or center console designs. |
| Communication | Five SCBs (I²C/SPI/UART/LIN), one CAN 2.0B + TTCAN block - provides concurrent LIN body-network interface and time-synchronized CAN messaging for distributed vehicle subsystems. |
| Power & Temp | 1.71–5.5 V supply, Deep Sleep current = 2.5 µA, Grade-S temp range (–40°C to +105°C) - ensures reliable operation in under-hood and cabin-mounted ECUs with minimal power budget impact. |
| GPIO | Up to 54 programmable pins in 64-pin QFN package - all support CAPSENSE™, analog, or digital functions with configurable drive strength, slew rate, and pull-up/down. |
Pinout & Package
Package: 64-pin QFN (9 mm × 9 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O power domains | Four independent 1.71–5.5 V supplies enabling mixed-voltage interfacing (e.g., 3.3 V MCU core with 5 V sensor inputs). |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Programmable GPIO | 54 total pins; each supports CAPSENSE™, analog input/output, digital logic, or SCB/CAN peripheral mapping via hardware routing matrix. |
| CAN_TX / CAN_RX | CAN physical layer interface | Dedicated differential pair supporting ISO 11898-2 signaling at up to 1 Mbps; internally terminated and ESD-protected per AEC-Q100. |
| XTAL_IN / XTAL_OUT | External crystal oscillator input/output | Supports 4–33 MHz ECO for precise clock generation; required for CAN bit timing accuracy and USB-free synchronous communication. |
| WCO_IN / WCO_OUT | 32.768 kHz watch crystal interface | Enables low-power RTC and Deep Sleep wake-up events with ±20 ppm stability over Grade-S temperature range. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade-S qualification | Validated for –40°C to +105°C operation with HTOL, TC, ESD, and EMC testing - meets automotive body control module reliability requirements. |
| Hardware-accelerated CAPSENSE™ | CSD block with >5:1 SNR and SmartSense™ auto-calibration - reduces firmware overhead and eliminates manual tuning for production touch systems. |
| Time-triggered CAN (TTCAN) | Hardware-supported scheduling, synchronization, and fault confinement per ISO/DIS 11898-4 - enables deterministic message transmission in safety-critical networks. |
| Deep Sleep mode with active analog | 2.5 µA system current while maintaining opamp/ADC/CAN wakeup capability - extends battery life in always-on vehicle entry systems. |
| Five reconfigurable SCBs | Each SCB dynamically switches between I²C, SPI, UART, or LIN slave modes at runtime - simplifies multi-protocol gateway design without external transceivers. |
Applications
| Automotive Door Handle Interface | Body Control Module (BCM) Subsystem |
|---|---|
Use Scenario: Capacitive touch detection on metal door handles exposed to rain, ice, and salt spray. IC Role / Device Role / Timing Role: Primary MCU executing CAPSENSE™ firmware, managing CAN/LIN communication with central BCM, and controlling local LED feedback. Use Value: SmartSense™ auto-tuning maintains >5:1 SNR in wet conditions; Deep Sleep mode draws only 2.5 µA during standby, extending vehicle battery life. |
Use Scenario: Local node managing interior lighting, window lift, mirror fold, and seat position memory. IC Role / Device Role / Timing Role: Real-time controller with TTCAN synchronization for coordinated actuator sequencing and LIN slave interface to dashboard cluster. Use Value: Eight TCPWM blocks enable simultaneous PWM dimming of 8 LED channels; five SCBs support concurrent LIN, CAN, and UART diagnostics without resource conflict. |
| Steering Wheel Touch Controls | Electronic Parking Brake (EPB) Actuator Monitor |
Use Scenario: Multi-button capacitive overlay on curved steering wheel surface with EMI from motors and ignition systems. IC Role / Device Role / Timing Role: Dedicated touch controller with hardware CSD filtering and CAN transmitter for status reporting to ADAS domain controller. Use Value: >5:1 SNR and programmable analog filters suppress engine noise; 48-MHz M0+ core processes touch gestures within 10 ms latency. |
Use Scenario: Monitoring brake caliper motor current, position feedback, and thermal sensors in EPB actuator housing. IC Role / Device Role / Timing Role: Safety-monitoring node performing analog acquisition (IDAC + SAR ADC), motor phase control (TCPWM), and fault reporting via CAN. Use Value: Dual opamps condition motor current sense signals; CAN TTCAN ensures synchronized fault logging across multiple EPB modules in redundant architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C4127LQAS455XQSA2 | Same silicon, Grade-E (–40°C to +125°C); identical peripherals and pinout. | Targeted at under-hood applications exceeding +105°C ambient (e.g., engine bay sensors). | Select when extended temperature range is required; otherwise, XQSA1 offers optimal cost/performance for cabin and body applications. |
| SPC560P40L1CEFAY | 32-bit Power Architecture e200z0 core, 64 MHz, 512 KB flash, no integrated CAPSENSE™, requires external touch controller. | Used in legacy automotive platforms with established Power Architecture toolchains and higher flash needs. | Choose only if migrating from SPC560P family; lacks native capacitive sensing and has larger footprint than 64-pin QFN. |
Compared with CY8C4127LQAS455XQSA1, the XQSA2 variant adds +125°C operation but no functional change, while the SPC560P40 requires external touch circuitry and lacks SmartSense™ auto-tuning-increasing BOM count and firmware complexity for touch-centric designs.
Availability
CY8C4127LQAS455XQSA1 is available at Aetrix Electronics and suitable for automotive body electronics, capacitive-sensing human-machine interfaces, and CAN-based distributed control systems requiring stable component supply across long production lifecycles.
Supply support for CY8C4127LQAS455XQSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the PSoC™ 4100S Plus product line, designed specifically for automotive-grade, low-power, mixed-signal applications requiring integrated capacitive sensing, real-time control, and CAN/LIN connectivity in compact form factors.
FAQ
Is CY8C4127LQAS455XQSA1 qualified for automotive use?
Yes. It is AEC-Q100 qualified to Grade-S (–40°C to +105°C), with full test reports covering HTOL, temperature cycling, ESD (HBM ±2 kV, CDM ±1 kV), and EMC compliance per ISO 11452 and ISO 7637. This qualification covers all die, package, and assembly processes used for this specific orderable part number.
Does it support CAN FD or only classical CAN?
CY8C4127LQAS455XQSA1 implements CAN 2.0B only, with full support for standard and extended identifiers and TTCAN timing features per ISO/DIS 11898-4. It does not support CAN FD data rates or flexible data-length frames; CAN FD requires PSoC™ 6 or external transceiver augmentation.
Can CAPSENSE™ operate during Deep Sleep mode?
No. CAPSENSE™ CSD block requires active CPU and clock domains; however, the device supports low-power wake-up from Deep Sleep using comparator-triggered interrupts or GPIO events. Analog opamps and comparators remain operational in Deep Sleep, enabling pre-sense wake-up circuits.
What development tools are officially supported?
Infineon officially supports ModusToolbox™ (v3.1+) and PSoC™ Creator (v4.4) for firmware development, with validated BSPs, CAPSENSE™ Tuner, and CAN configuration tools. Debugging uses KitProg3 or MiniProg4; no third-party IDEs are officially certified for AEC-Q100 production code generation.
CY8C4127LQAS455XQSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 56-UFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4000S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 24MHz
- Connectivity:
- FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, TRNG, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x10b, 20x12b SAR; D/A 2x7/8b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4127LQAS455XQSA1 FAQ
1.How can I place an order for CY8C4127LQAS455XQSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4127LQAS455XQSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4127LQAS455XQSA1 reliable?
The price and inventory of CY8C4127LQAS455XQSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4127LQAS455XQSA1 is usually 5 days.
3.What payment methods are accepted for CY8C4127LQAS455XQSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4127LQAS455XQSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4127LQAS455XQSA1?
CY8C4127LQAS455XQSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4127LQAS455XQSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4127LQAS455XQSA1?
For technical support, including CY8C4127LQAS455XQSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4127LQAS455XQSA1 requirements.
6.How does Aetrix verify that CY8C4127LQAS455XQSA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4127LQAS455XQSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4127LQAS455XQSA1 meets industry standards.
7.What is the process for return or replacement of CY8C4127LQAS455XQSA1?
All CY8C4127LQAS455XQSA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4127LQAS455XQSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4127LQAS455XQSA1 part is unused and in its original packaging.
Return procedure for CY8C4127LQAS455XQSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4127LQAS455XQSA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

