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Infineon Technologies CY8C4147AZAS575XQLA1

Part No.:
CY8C4147AZAS575XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY8C4147AZAS575XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,188

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Product details

Overview

CY8C4147AZAS575XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-grade PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR. It supports CAPSENSE™, LCD segment drive, five reconfigurable SCBs (I²C/SPI/UART/LIN), and hardware crypto accelerators (AES, SHA, TRNG) for body control modules and smart sensors.

For engineers reviewing the CY8C4147AZAS575XQLA1 datasheet, CY8C4147AZAS575XQLA1 pinout, CY8C4147AZAS575XQLA1 application, or CY8C4147AZAS575XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), MSC water-tolerance capability, programmable analog opamp modes, and GPIO flexibility across 84 pins in 100-pin TQFP.

Technical Context

The device implements a single-layer AHB-Lite interconnect connecting the Cortex-M0+ core, memory subsystem (384 KB flash + 32 KB SRAM), and peripherals including eight TCPWM blocks with quadrature decode and kill-signal triggering, two CTBm opamps supporting Deep Sleep operation, and a dedicated CAN FD controller compliant with ISO 11898-1:2015.

Its analog subsystem integrates a 12-bit 1-Msps SAR ADC with temperature sensor, dual low-power comparators, and MSC block enabling hardware-accelerated capacitive sensing with SmartSense auto-tuning - all accessible via any of 84 GPIOs with configurable drive strength and slew rate.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - sufficient for AUTOSAR-compliant firmware and sensor fusion stacks
CAN FD SpeedUp to 5 Mbps data phase - meets high-bandwidth vehicle network requirements for ADAS domain controllers
ADC Resolution12-bit SAR @ 1 Msps with differential mode and channel sequencer - enables simultaneous multi-channel sensor acquisition
Deep Sleep Current2.5 µA digital system current - supports always-on wake-on-touch or wake-on-CAN without external PMIC
GPIO Count84 programmable pins in 100-pin TQFP - supports mixed-signal routing for CAPSENSE™, analog sensing, and LIN/CAN I/O on shared pins
Operating TempGrade-S: –40°C to +105°C - qualified for under-hood automotive applications per AEC-Q100 Rev G

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, wettable flank capable.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™, analog input, SCB I²C/SPI, TCPWM capture - configurable per-pin drive mode and slew rate
P1[0]–P1[7]Port 1 GPIO bankIncludes CAN FD TX/RX (P1[2]/P1[3]), WCO input (P1[4]), ECO input (P1[6]/P1[7]) - critical for clock redundancy and fault-tolerant timing
VDDIO0–VDDIO7I/O power domainsEight independent 1.71–5.5 V supplies - enable mixed-voltage interfacing (e.g., 3.3 V MCU logic with 5 V sensor inputs)
VDDD / VDDADigital/analog core supplySeparate 1.71–5.5 V rails - reduce coupling noise between digital switching and precision analog measurement paths
XRESExternal reset inputActive-low, Schmitt-triggered, 1.2 V threshold - compatible with automotive watchdog ICs and power-supply supervisors

Key Features

FeatureDesign Value
Hardware SmartSense tuningAutomatic MSC calibration without host CPU intervention - reduces firmware overhead and improves touch reliability in humid environments
Programmable analog CTBmTwo opamps with internal/external drive modes and ADC input buffering - enables rail-to-rail signal conditioning before digitization
Crypto acceleration engineDedicated AES-128/256, SHA-1/256, TRNG, CRC - offloads security processing from Cortex-M0+, preserving real-time latency for control loops
Reconfigurable SCBsFive independent Serial Communication Blocks - each dynamically assignable as I²C master/slave, SPI master/slave, UART, or LIN slave at runtime
Deep Sleep with analog active2.5 µA system current while SAR ADC and comparators remain operational - enables ultra-low-power wake-on-event sensing

Applications

Body Control ModuleSmart Door Handle Sensor

Use Scenario: Centralized control of lighting, window lift, mirror fold, and door lock actuation in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing AUTOSAR BSW, managing CAN FD communication with gateway, and running CAPSENSE™ for proximity detection.

Use Value: Integrated CAN FD + 84 GPIO + MSC eliminates need for external transceivers and discrete touch controllers, reducing BOM count by ≥3 components.

Use Scenario: Capacitive handle activation with water tolerance and false-trigger immunity in rain or snow.

IC Role / Device Role / Timing Role: Dedicated CAPSENSE™ subsystem with SmartSense auto-tuning and >5:1 SNR operating in Deep Sleep (2.5 µA).

Use Value: Hardware-accelerated MSC enables sub-100-ms wake-from-sleep response with no firmware calibration required across temperature and humidity ranges.

Instrument Cluster LCD DriverMotor Control Feedback Node

Use Scenario: Driving 128-segment monochrome LCD for speedometer, fuel gauge, and warning indicators.

IC Role / Device Role / Timing Role: GPIO-based LCD segment driver with software-configurable bias and frame rate - no external LCD controller needed.

Use Value: Direct GPIO LCD drive reduces external component count and PCB area while maintaining 60 Hz update rate with minimal CPU load.

Use Scenario: Real-time motor position feedback and overcurrent protection in EPS or HVAC blower systems.

IC Role / Device Role / Timing Role: TCPWM quadrature decoder + comparator-triggered kill signal generation for safe shutdown within <1 µs.

Use Value: On-die comparator kill path bypasses software latency, meeting ISO 26262 ASIL-B functional safety timing constraints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SPC560B50L5Power Architecture e200z0h core, 64 MHz, 512 KB flash, no integrated CAPSENSE™ or MSCLacks hardware capacitive sensing; requires external touch controller for handle interfacePreferred where legacy Power Architecture toolchain and CAN-only (no FD) are mandated
RA4M2 (R7FA4M2AD3CFM)Arm Cortex-M33 @ 100 MHz, 512 KB flash, 128 KB SRAM, no CAN FD or MSC blockHigher performance but no automotive-qualified capacitive sensing or CAN FD PHY integrationSelected when cryptographic acceleration and AI/ML inference co-processing outweigh CAN FD and touch integration needs

Compared with SPC560B50L5 and RA4M2, CY8C4147AZAS575XQLA1 uniquely combines AEC-Q100 Grade-S qualification, CAN FD PHY, MSC-based CAPSENSE™, and Deep Sleep analog operation - making it optimal for cost-sensitive, space-constrained automotive human-machine interface nodes requiring both connectivity and robust sensing.

Availability

CY8C4147AZAS575XQLA1 is available at Aetrix Electronics and suitable for body control modules, smart door handles, instrument cluster displays, and motor feedback nodes requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4147AZAS575XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar, and security solutions, with global manufacturing and R&D centers.

CY8C4147AZAS575XQLA1 belongs to the PSoC™ 4100S Max product line - designed specifically for AEC-Q100-compliant automotive human-machine interface and domain-control applications requiring integrated analog sensing, CAN FD, and ultra-low-power operation.

FAQ

Is CY8C4147AZAS575XQLA1 pin-compatible with other PSoC™ 4100S Max variants?

Yes - it shares identical 100-pin TQFP footprint and pin function mapping with CY8C4147AZI-S575 and CY8C4147AZI-S576. All share the same GPIO assignment, power domain layout, and peripheral pin multiplexing, enabling hardware reuse across flash/SRAM variants without PCB redesign.

Does this part support AUTOSAR-compliant MCAL drivers?

Infineon provides AUTOSAR 4.3-compliant MCAL drivers for CAN FD, ADC, PWM, and DIO through its PSoC™ 4100S Max MCAL package. These drivers integrate with Vector DaVinci Configurator and support ASIL-B development workflows per ISO 26262.

What is the maximum sustained CAN FD data rate supported in practical automotive harness environments?

The CY8C4147AZAS575XQLA1 CAN FD block supports up to 5 Mbps in the data phase under controlled lab conditions. In production vehicle harnesses, sustained rates of 2–3 Mbps are typical due to signal integrity constraints; the integrated CAN FD PHY includes programmable bit timing and loopback self-test to validate physical layer compliance.

Can the MSC block operate during Deep Sleep mode without waking the CPU?

Yes - the MSC block can autonomously scan capacitive sensors and generate interrupts upon threshold crossing while the Cortex-M0+ core remains in Deep Sleep. This enables wake-on-touch functionality with total system current held at 2.5 µA, verified per AEC-Q100 Grade-S thermal cycling tests.

CY8C4147AZAS575XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4147AZAS575XQLA1 FAQ

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6.How does Aetrix verify that CY8C4147AZAS575XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147AZAS575XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147AZAS575XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147AZAS575XQLA1?

All CY8C4147AZAS575XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147AZAS575XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147AZAS575XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147AZAS575XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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