Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY8C4147AZES555XQLA1

Part No.:
CY8C4147AZES555XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY8C4147AZES555XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,692

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY8C4147AZES555XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules requiring robust capacitive touch, motor PWM control, and LIN/CAN communication.

For engineers reviewing the CY8C4147AZES555XQLA1 datasheet, CY8C4147AZES555XQLA1 pinout, CY8C4147AZES555XQLA1 application, or CY8C4147AZES555XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), SAR ADC resolution (12-bit, 1 Msps), MSC SNR (>5:1), and GPIO reconfigurability across analog/digital/CAPSENSE™ functions.

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5 reconfigurable Serial Communication Blocks (SCBs), and 8 TCPWM blocks supporting center-aligned PWM and quadrature decoding. Its analog subsystem includes two opamps with Deep Sleep operation, a 12-bit SAR ADC with temperature sensor and channel sequencer, and dual low-power comparators.

The programmable architecture enables hardware-level logic synthesis via Smart I/O and CTBm blocks, while the CAN FD controller implements ISO 11898-1:2015 with bit-rate switching up to 5 Mbps and CRC-17 error detection. Clocking combines ECO+PLL (48 MHz), WCO (32 kHz), and IMO (±2%) for mixed-signal timing integrity.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz - Enables real-time deterministic execution of automotive body control firmware with <100 ns interrupt latency.
Flash / SRAM384 KB flash with Read Accelerator / 32 KB SRAM - Supports complex CAPSENSE™ tuning algorithms and dual CAN/LIN protocol stacks without external memory.
CAN FD SpeedUp to 5 Mbps data phase - Meets high-bandwidth diagnostic and actuator control requirements in modern vehicle networks per ISO 11898-1:2015.
SAR ADC12-bit, 1 Msps, differential mode - Captures fast transient signals from position sensors or battery monitoring with 0.5 LSB INL.
Deep Sleep Current2.5 µA digital system current - Sustains wake-on-CAN or GPIO event detection in always-on vehicle domains without compromising battery life.
CAPSENSE™ SNR>5:1 signal-to-noise ratio - Ensures reliable touch detection under wet conditions and EMI noise typical in door module environments.
GPIO CountUp to 84 pins, all reconfigurable - Allows single-hardware design reuse across variants (e.g., 48-pin QFN vs. 100-pin TQFP) without PCB redesign.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™ sensing, analog input (SAR ADC), or SCB-I2C/SPI/UART; configurable slew rate and drive strength.
P1[0]–P1[7]Port 1 GPIO bankIncludes dedicated CAN FD TX/RX pins (P1[4]/P1[5]) and TCPWM outputs; supports hardware kill signal triggering.
P2[0]–P2[7]Port 2 GPIO bankConnects to LCD segment drivers and MSC analog inputs; enables direct capacitive button matrix routing.
VDDIO0–VDDIO3I/O supply railsIndependent 1.71–5.5 V domains per port group - Allows mixed-voltage interface (e.g., 3.3 V MCU core + 5 V sensor bus).
VDDD / VDDADigital/analog core suppliesSeparate 1.71–5.5 V inputs decoupled for noise isolation between digital logic and precision SAR ADC/CTBm blocks.

Key Features

FeatureDesign Value
SmartSense Auto-TuningHardware-accelerated CAPSENSE™ calibration eliminates manual threshold adjustment across temperature/humidity variations in door handle modules.
Deep Sleep Analog OperationOpamps and comparators remain active at 2.5 µA system current - Enables continuous proximity detection during vehicle sleep mode.
Reconfigurable SCBsFive independent serial blocks dynamically switch between I2C master/slave, SPI master/slave, UART, or LIN Slave - Reduces BOM count in multi-protocol gateway designs.
Hardware Crypto AccelerationAES-128/256, SHA-256, TRNG, and CRC engines offload security tasks from CPU - Meets UNECE R155 software update integrity requirements.
Quadrature DecoderIntegrated TCPWM-based decoder processes encoder signals with 4x interpolation - Eliminates external decoder IC in window lift or seat position feedback systems.

Applications

Door Module ControlBody Control Unit (BCU)

Use Scenario: Capacitive touch sensing on interior door handles with water tolerance and proximity wake-up.

IC Role / Device Role / Timing Role: Primary MCU executing CAPSENSE™ firmware, managing LIN slave communication to central gateway, and driving window lift motor PWM.

Use Value: >5:1 SNR ensures false-trigger immunity during rain exposure; CAN FD enables fast firmware updates over vehicle network.

Use Scenario: Centralized control of lighting, wipers, mirrors, and HVAC actuators with secure OTA update capability.

IC Role / Device Role / Timing Role: Main controller running AUTOSAR-compliant BSW, coordinating LIN slaves and managing CAN FD diagnostics.

Use Value: Hardware crypto accelerators meet R155 secure boot and signature verification mandates; 384 KB flash accommodates dual-bank OTA images.

Seat Position SensingSteering Column Control

Use Scenario: High-precision analog measurement of potentiometer and Hall-effect sensor outputs for memory seat positioning.

IC Role / Device Role / Timing Role: Analog front-end processor with 12-bit SAR ADC, opamp buffering, and TCPWM-based motor control for seat actuation.

Use Value: Differential ADC mode rejects common-mode noise from adjacent 12 V power lines; 1 Msps sampling captures rapid position changes during calibration.

Use Scenario: Multi-function switch interface with tactile feedback, rotary encoder, and LED indicators on steering wheel.

IC Role / Device Role / Timing Role: Dedicated MCU handling CAPSENSE™ buttons, quadrature decoding for volume control, and I2S audio feedback generation.

Use Value: Smart I/O block implements debounce and edge detection in hardware - Reduces CPU load and ensures sub-10 ms response time for safety-critical controls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WHT0MLHTARM Cortex-M4F core, 112 MHz; no integrated CAPSENSE™; includes Ethernet MACTargets gateway/routing functions; requires external touch controller for capacitive interfacesSelect when higher compute throughput or Ethernet connectivity is required over integrated analog sensing
Renesas RL78/F1416-bit RL78 core, 32 MHz; 256 KB flash; CAN FD support; no hardware crypto accelerationFocused on cost-sensitive body electronics; lacks SmartSense and MSC SNR performanceSelect for legacy platform migration where lower clock speed and reduced security features are acceptable

Compared with S32K144WHT0MLHT and RL78/F14, CY8C4147AZES555XQLA1 uniquely integrates high-SNR CAPSENSE™, Deep Sleep analog operation, and hardware crypto in a single AEC-Q100 Grade-S package-enabling compact, secure, and touch-responsive automotive nodes without external components.

Availability

CY8C4147AZES555XQLA1 is available at Aetrix Electronics and suitable for door module control, body control units, seat position sensing, and steering column control requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4147AZES555XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and automotive qualification expertise.

CY8C4147AZES555XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive body electronics demanding integrated analog sensing, secure communication, and low-power operation.

FAQ

What is the maximum operating temperature range for CY8C4147AZES555XQLA1?

CY8C4147AZES555XQLA1 is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. This rating is validated across all internal peripherals including the SAR ADC, opamps, and CAN FD block under full voltage and frequency conditions.

Does CY8C4147AZES555XQLA1 support CAN FD bit-rate switching?

Yes, CY8C4147AZES555XQLA1 implements ISO 11898-1:2015 compliant CAN FD with bit-rate switching, enabling arbitration phase at 1 Mbps and data phase up to 5 Mbps. The hardware CRC-17 engine and flexible message RAM configuration support robust frame validation and filtering.

How many GPIO pins can be used simultaneously for CAPSENSE™ sensing?

All 84 GPIO pins are programmable for CAPSENSE™ sensing via the Multi-Sense Converter (MSC) block. The hardware supports up to 64 simultaneous sensing channels with automatic SmartSense tuning, and each pin retains full analog/digital reconfigurability without fixed function assignment.

Is ModusToolbox™ required for development with this device?

No, ModusToolbox™ is recommended but not required. CY8C4147AZES555XQLA1 supports industry-standard Arm® toolchains including Keil MDK, IAR Embedded Workbench, and GCC-based builds. Peripheral Driver Libraries (PDL) and HAL APIs are provided in source form for integration into custom IDE environments.

CY8C4147AZES555XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4147AZES555XQLA1 FAQ

1.How can I place an order for CY8C4147AZES555XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4147AZES555XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4147AZES555XQLA1 reliable?

The price and inventory of CY8C4147AZES555XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147AZES555XQLA1 is usually 5 days.

3.What payment methods are accepted for CY8C4147AZES555XQLA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147AZES555XQLA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4147AZES555XQLA1?

CY8C4147AZES555XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4147AZES555XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4147AZES555XQLA1?

For technical support, including CY8C4147AZES555XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147AZES555XQLA1 requirements.

6.How does Aetrix verify that CY8C4147AZES555XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147AZES555XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147AZES555XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147AZES555XQLA1?

All CY8C4147AZES555XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147AZES555XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147AZES555XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147AZES555XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4147AZES555XQLA1 Tags

  • CY8C4147AZES555XQLA1
  • CY8C4147AZES555XQLA1 PDF
  • CY8C4147AZES555XQLA1 Datasheet
  • CY8C4147AZES555XQLA1 Specifications
  • CY8C4147AZES555XQLA1 Images
  • Infineon Technologies
  • Infineon Technologies CY8C4147AZES555XQLA1
  • Buy CY8C4147AZES555XQLA1
  • CY8C4147AZES555XQLA1 Price
  • CY8C4147AZES555XQLA1 Distributor
  • CY8C4147AZES555XQLA1 Supplier
  • CY8C4147AZES555XQLA1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER