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Infineon Technologies CY8C4147AZES568XQLA1

Part No.:
CY8C4147AZES568XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY8C4147AZES568XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,340

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Product details

Overview

CY8C4147AZES568XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR. It targets body control modules, smart sensors, and automotive HMI systems requiring robust capacitive touch in harsh environments.

For engineers reviewing the CY8C4147AZES568XQLA1 datasheet, CY8C4147AZES568XQLA1 pinout, CY8C4147AZES568XQLA1 application, or CY8C4147AZES568XQLA1 equivalent, key selection considerations include CAN FD timing compliance, Deep Sleep current (2.5 µA), MSC water-tolerance capability, programmable analog opamp modes, and 84-GPIO flexibility with CAPSENSE™ on any pin.

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5 reconfigurable Serial Communication Blocks (SCBs), and dedicated CAN FD controller - enabling concurrent UART/I2C/SPI and high-speed CAN FD communication without CPU overhead. Its programmable analog subsystem includes two CTBm opamps supporting ADC input buffering and comparator modes, both operational in Deep Sleep.

The multi-sense converter (MSC) block implements hardware-accelerated capacitive sensing with SmartSense auto-tuning and supports differential scanning for noise immunity. The 8× TCPWM blocks provide quadrature decoding and kill-signal triggering for motor control safety functions, while the crypto block delivers AES-128, SHA-256, TRNG, and CRC acceleration.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz - enables real-time deterministic execution for automotive control loops.
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - supports complex firmware with fast code fetch and data buffering.
CAN FD SpeedUp to 5 Mbps - meets high-bandwidth vehicle network requirements for ADAS sensor fusion and ECU diagnostics.
MSC SNR>5:1 signal-to-noise ratio - ensures reliable capacitive touch detection under condensation or water overlay.
Deep Sleep Current2.5 µA digital system current - enables always-on wake-on-touch functionality with minimal battery drain.
GPIO Count84 programmable pins - allows full integration of touch, display, CAN, and sensor interfaces on a single die.
Operating TempGrade-S: –40°C to +105°C - certified for under-hood and cabin-mounted automotive applications.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, wettable flank capable.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO / CAPSENSE™ / Analog InputSupports simultaneous touch sensing, ADC acquisition, and digital I/O with programmable drive strength.
P1[0]–P1[7]Port 1 GPIO / CAN FD TX/RXDedicated CAN FD physical layer interface with internal termination and slew-rate control.
P2[0]–P2[7]Port 2 GPIO / SCB0 I2C/SPI/UARTConfigurable serial peripheral interface with hardware address matching and clock stretching support.
P3[0]–P3[7]Port 3 GPIO / TCPWM0–TCPWM7Direct PWM output routing for motor gate drivers or LED dimming with dead-time insertion.
VDDIO0–VDDIO3I/O Power DomainsFour independent 1.71–5.5 V supply rails enable mixed-voltage interfacing (e.g., 3.3 V MCU logic + 5 V sensor bus).
VDDD / VDDADigital / Analog Core SupplySeparate 1.71–5.5 V domains isolate noise-sensitive analog circuits from digital switching transients.

Key Features

FeatureDesign Value
SmartSense Auto-TuningHardware-accelerated MSC calibration eliminates manual sensor tuning and compensates for environmental drift.
Deep Sleep Analog OperationOpamps and comparators remain active during 2.5 µA Deep Sleep - enables wake-on-analog-event without full wake-up latency.
Programmable Smart I/OBoolean logic on port inputs/outputs enables glueless interface bridging (e.g., level translation, pulse shaping) without CPU intervention.
Crypto Hardware AccelerationAES-128, SHA-256, TRNG, and CRC offload security-critical operations from the M0+ core, reducing firmware attack surface.
Reconfigurable SCBsFive SCBs each support runtime-switchable I2C/SPI/UART/LIN Slave - simplifies BOM consolidation across variants.

Applications

Body Control Module (BCM)Automotive Touch HMI

Use Scenario: Centralized control of door locks, lighting, wipers, and window lifters in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing real-time control tasks, managing LIN slave nodes, and handling CAN FD diagnostics.

Use Value: Integrated CAN FD and 8× TCPWM enable precise motor actuation timing and fault-safe kill-signal generation per ISO 26262 ASIL-B requirements.

Use Scenario: Capacitive touch panel for infotainment or climate control with water tolerance in humid cabin environments.

IC Role / Device Role / Timing Role: Dedicated MSC block performs high-SNR capacitive scanning while CPU remains in low-power mode.

Use Value: SmartSense auto-tuning maintains consistent touch response across temperature and humidity variations without firmware recalibration.

Smart Sensor NodeInstrument Cluster LCD Driver

Use Scenario: Tire pressure monitoring system (TPMS) gateway aggregating sensor data via SPI and forwarding over CAN FD.

IC Role / Device Role / Timing Role: Sensor hub MCU with programmable analog front-end for conditioning pressure/temperature signals.

Use Value: SAR ADC with built-in temperature sensor and programmable opamp gain eliminates external signal conditioning components.

Use Scenario: Driving segmented LCD displays in digital instrument clusters with variable contrast and multiplexing.

IC Role / Device Role / Timing Role: Direct GPIO-based LCD segment driver supporting up to 128 segments with software-controlled bias voltage.

Use Value: Eliminates external LCD driver IC, reducing BOM cost and PCB area while maintaining display update rates >60 Hz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144HAT0MLHTARM Cortex-M4F core, 112 MHz; includes Ethernet MAC but no integrated MSC or SmartSense.Larger code footprint required for touch firmware; lacks hardware-accelerated capacitive sensing.Select when Ethernet connectivity or floating-point math is prioritized over touch integration.
Renesas RL78/F1416-bit RL78 core, 32 MHz; supports CAN 2.0B only (no CAN FD); no hardware crypto acceleration.Lower performance for complex HMI stacks; requires external components for secure boot and touch sensing.Select for cost-sensitive, non-FD CAN applications where legacy toolchain compatibility is critical.

Compared with S32K144HAT0MLHT and RL78/F14, CY8C4147AZES568XQLA1 uniquely combines CAN FD, MSC with SmartSense, and Deep Sleep analog operation in a single AEC-Q100 Grade-S package - reducing system-level component count and firmware complexity for touch-enabled automotive nodes.

Availability

CY8C4147AZES568XQLA1 is available at Aetrix Electronics and suitable for body control modules, automotive touch HMIs, smart sensor nodes, and instrument cluster LCD drivers requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4147AZES568XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

CY8C4147AZES568XQLA1 belongs to the PSoC™ 4100S Max product line, engineered specifically for AEC-Q100-compliant automotive applications demanding integrated analog sensing, CAN FD communication, and ultra-low-power operation.

FAQ

What is the maximum operating frequency of the Arm® Cortex®-M0+ core in CY8C4147AZES568XQLA1?

The Arm® Cortex®-M0+ core operates at a maximum frequency of 48 MHz, achieved via the internal main oscillator (IMO) or PLL-locked external crystal oscillator (ECO). This frequency is fully supported across the full Grade-S temperature range (–40°C to +105°C) and is validated for AEC-Q100 compliance.

Does CY8C4147AZES568XQLA1 support hardware-based capacitive touch with water tolerance?

Yes - the integrated Multi-Sense Converter (MSC) block provides >5:1 signal-to-noise ratio and hardware-accelerated SmartSense auto-tuning, enabling reliable capacitive touch detection even under water overlay or high humidity, as verified in Infineon's AEC-Q100 qualification testing.

Can the opamps in CY8C4147AZES568XQLA1 operate in Deep Sleep mode?

Yes - both continuous-time opamps (CTBm) can remain powered and functional during Deep Sleep mode, consuming <1 µA each. This enables analog wake-up events (e.g., threshold crossing) without full system wake-up, preserving the 2.5 µA total system current specification.

What package type and pin count does CY8C4147AZES568XQLA1 use?

CY8C4147AZES568XQLA1 uses a 100-pin TQFP package (14 mm × 14 mm, 0.5 mm pitch) with wettable flanks for automated optical inspection (AOI) and solder joint reliability in automotive reflow processes.

CY8C4147AZES568XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4147AZES568XQLA1 FAQ

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The price and inventory of CY8C4147AZES568XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147AZES568XQLA1 is usually 5 days.

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For technical support, including CY8C4147AZES568XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147AZES568XQLA1 requirements.

6.How does Aetrix verify that CY8C4147AZES568XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147AZES568XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147AZES568XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147AZES568XQLA1?

All CY8C4147AZES568XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147AZES568XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147AZES568XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147AZES568XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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