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Infineon Technologies CY8C4147AZSS565XQLA1

Part No.:
CY8C4147AZSS565XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY8C4147AZSS565XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,626

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Product details

Overview

CY8C4147AZSS565XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR. It targets body control modules, smart sensors, and infotainment interface controllers requiring reconfigurable analog/digital logic and low-power operation down to 2.5 µA in Deep Sleep.

For engineers reviewing the CY8C4147AZSS565XQLA1 datasheet, CY8C4147AZSS565XQLA1 pinout, CY8C4147AZSS565XQLA1 application, or CY8C4147AZSS565XQLA1 equivalent, key selection criteria include CAN FD timing compliance, MSC water-tolerance capability, Deep Sleep current budgeting, and GPIO flexibility for CAPSENSE™/analog/digital reuse across 84 pins.

Technical Context

This MCU integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core to programmable analog (2 opamps, 12-bit SAR ADC with temperature sensor), digital (8 TCPWM blocks, 5 SCBs supporting I²C/SPI/UART/LIN), and dedicated hardware accelerators (AES/SHA/TRNG/CRC). Its Smart I/O matrix enables Boolean logic on port signals without CPU intervention.

The CAN FD block operates at up to 5 Mbps with configurable bit timing and error handling, while the MSC block supports automatic hardware tuning (SmartSense) and delivers >5:1 signal-to-noise ratio for wet-finger robustness in touch interfaces - both validated per AEC-Q100 Grade-S requirements.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - sufficient for AUTOSAR-compliant bootloaders and sensor fusion stacks
CAN FD SpeedUp to 5 Mbps - enables high-bandwidth ECU diagnostics and OTA update channels in modern vehicle networks
ADC Resolution12-bit SAR with 1 Msps sampling - supports precision battery voltage monitoring and thermistor-based cabin temperature sensing
Deep Sleep Current2.5 µA digital system current - enables always-on wake-on-touch or wake-on-CAN functionality in low-power gateways
GPIO Count84 programmable pins - all support CAPSENSE™, analog input, or digital I/O with configurable drive strength and slew rate
Operating Temp–40°C to +105°C (Grade-S) - qualified for under-hood and instrument cluster mounting locations
Cryptographic HWAES-128/256, SHA-1/256, TRNG, CRC - accelerates secure boot, firmware authentication, and encrypted CAN message signing

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™ scanning, analog input (SAR ADC), or digital I²C/SPI slave select with programmable drive mode
P12[0]–P12[7]Port 12 GPIO bankIncludes CAN FD TX/RX pins (P12[0]/P12[1]) with internal termination and slew control for EMC compliance
XRESExternal reset inputActive-low asynchronous reset with internal pull-up; accepts 1.71–5.5 V logic levels
VCOREDedicated core power supply1.2 V ±5% regulated input for CPU and digital logic; requires external LDO or DC-DC converter
VDDAAnalog power supplySeparate 1.71–5.5 V rail for SAR ADC, opamps, and comparators - improves noise immunity for precision sensing

Key Features

FeatureDesign Value
SmartSense auto-tuningHardware-accelerated CAPSENSE™ calibration eliminates manual threshold adjustment across temperature/humidity variations
Deep Sleep with analog activeOpamps and comparators remain functional during 2.5 µA system sleep - enables wake-on-analog-event for intrusion detection
Reconfigurable SCBsFive Serial Communication Blocks dynamically switch between I²C master/slave, SPI master/slave, UART, or LIN Slave modes at runtime
TCPWM kill-input triggeringHardware comparator outputs directly disable PWM outputs within one clock cycle - critical for motor fault safety in EPS or HVAC actuators
Programmable Smart I/OBoolean logic (AND/OR/XOR) applied to GPIO inputs/outputs without CPU involvement - reduces interrupt latency in real-time control loops

Applications

Body Control Module (BCM)Touch-Based Climate Control Panel

Use Scenario: Centralized control of door locks, lighting, wipers, and window lifts in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing CAN FD communication with gateway, managing GPIO-driven relays and reading analog sensor inputs (e.g., ambient light, humidity).

Use Value: 84 GPIOs allow direct connection to 12+ switches/sensors; CAN FD 5 Mbps ensures fast diagnostic response (<50 ms) during OBD-II sessions.

Use Scenario: Capacitive touch interface for HVAC settings with water splash tolerance in automotive cabins.

IC Role / Device Role / Timing Role: Dedicated CAPSENSE™ controller with MSC block performing real-time signal processing and SmartSense auto-calibration.

Use Value: >5:1 SNR and hardware-based water rejection enable reliable operation after condensation or accidental spills without firmware recalibration.

Electric Power Steering (EPS) Sensor InterfaceInfotainment System Sub-Controller

Use Scenario: Acquisition and preprocessing of torque, position, and motor current signals before CAN FD transmission to main EPS ECU.

IC Role / Device Role / Timing Role: Analog front-end with 12-bit SAR ADC (1 Msps), dual opamps for signal conditioning, and TCPWM for motor phase timing capture.

Use Value: Simultaneous sampling across 8 ADC channels with hardware averaging reduces noise in torque sensor readings by ≥12 dB.

Use Scenario: Secondary controller managing USB audio streaming, LED backlight dimming, and button feedback in head unit displays.

IC Role / Device Role / Timing Role: I²S Master TX driving audio DACs; programmable LCD segment drivers controlling status indicators; SCB configured as USB CDC ACM device.

Use Value: Integrated I²S + LCD + USB stack offloads main SoC, reducing BOM count and enabling cost-optimized dual-processor architecture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WARM Cortex-M4F core, 112 MHz; includes Ethernet MAC but no integrated CAPSENSE™ or MSC blockBetter suited for gateway functions requiring CAN FD + Ethernet bridging; lacks hardware touch accelerationSelect when network routing or floating-point math dominates over capacitive UI requirements
Renesas RL78/F1416-bit RL78 core, 32 MHz; AEC-Q100 Grade-2 (–40°C to +105°C); no CAN FD, only classical CAN 2.0BLower-cost option for legacy body electronics where 5 Mbps bandwidth and ISO 11898-1:2015 compliance are not requiredSelect for cost-sensitive non-safety-critical modules with existing CAN 2.0 infrastructure

Compared with S32K144W and RL78/F14, CY8C4147AZSS565XQLA1 uniquely combines CAN FD, hardware-accelerated capacitive sensing, and Deep Sleep analog retention - making it optimal for next-gen human-machine interface nodes where touch reliability, low-power responsiveness, and high-speed diagnostics converge.

Availability

CY8C4147AZSS565XQLA1 is available at Aetrix Electronics and suitable for body control modules, touch-based climate panels, electric power steering sensor interfaces, and infotainment sub-controllers requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4147AZSS565XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.

CY8C4147AZSS565XQLA1 belongs to the PSoC™ 4100S Max product line, engineered specifically for AEC-Q100-compliant automotive subsystems demanding mixed-signal reconfigurability, functional safety readiness, and hardware-accelerated human interface capabilities.

FAQ

Does CY8C4147AZSS565XQLA1 support AUTOSAR-compliant MCAL drivers?

Yes - Infineon provides AUTOSAR 4.3-compliant MCAL drivers for CAN FD, ADC, DIO, GPT, and ICU via the PSoC™ 4100S Max MCAL package. These drivers integrate with Vector DaVinci Configurator and support ASIL-B decomposition when used with appropriate safety mechanisms and compiler qualification data.

What is the maximum operating frequency of the CAN FD peripheral?

The CAN FD block supports data rates up to 5 Mbps in the data phase, compliant with ISO 11898-1:2015. Bit timing is fully configurable via dedicated registers, and the module includes built-in loopback mode, error counters, and FIFO-based message buffering for deterministic interrupt latency under heavy bus load.

Can all 84 GPIOs be used simultaneously for CAPSENSE™ scanning?

No - while any GPIO can be assigned to CAPSENSE™, the MSC block supports up to 32 simultaneous sense channels per scan. Full 84-pin scanning requires time-multiplexed sequencing across multiple frames, managed automatically by the SmartSense middleware layer without CPU overhead.

Is external crystal required for CAN FD operation?

No - CAN FD bit timing derives from the internal IMO (±2%) or PLL-synthesized clock; however, for strict ISO 11898-1:2015 conformance in production systems, Infineon recommends using the 4–33 MHz ECO with PLL to achieve <±0.5% clock accuracy, especially at 5 Mbps data rates.

CY8C4147AZSS565XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4147AZSS565XQLA1 FAQ

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Please submit a Request for Quotation (RFQ) for CY8C4147AZSS565XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY8C4147AZSS565XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147AZSS565XQLA1 is usually 5 days.

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5.How can I obtain technical support or documentation for CY8C4147AZSS565XQLA1?

For technical support, including CY8C4147AZSS565XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147AZSS565XQLA1 requirements.

6.How does Aetrix verify that CY8C4147AZSS565XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147AZSS565XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147AZSS565XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147AZSS565XQLA1?

All CY8C4147AZSS565XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147AZSS565XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147AZSS565XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147AZSS565XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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