Infineon Technologies CY8C4147AZSS595XQLA1
- Part No.:
- CY8C4147AZSS595XQLA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CY8C4147AZSS595XQLA1.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,406
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Product details
Overview
CY8C4147AZSS595XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU running at 48 MHz, featuring 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, 12-bit 1-Msps SAR ADC, and multi-sense capacitive sensing (MSC) with >5:1 SNR. It targets body control modules requiring integrated analog sensing, motor PWM control, and robust communication in under-hood environments.
For engineers reviewing the CY8C4147AZSS595XQLA1 datasheet, CY8C4147AZSS595XQLA1 pinout, CY8C4147AZSS595XQLA1 application, or CY8C4147AZSS595XQLA1 equivalent, key selection factors include CAN FD timing compliance, Deep Sleep current (2.5 µA), MSC water-tolerance capability, TCPWM quadrature decoding, and programmable analog opamp operation in low-power modes.
Technical Context
The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5 reconfigurable Serial Communication Blocks (SCBs), and a dedicated CAN FD controller with bit-rate switching support up to 5 Mbps. Its analog subsystem includes two continuous-time opamps with internal/external drive modes and ADC input buffering - both operable in Deep Sleep.
Digital flexibility stems from 8 TCPWM blocks supporting center-aligned PWM, comparator-triggered kill signals for motor safety, and Smart I/O logic enabling Boolean operations directly on GPIO paths without CPU intervention. The MSC block implements hardware-accelerated capacitive sensing with automatic SmartSense tuning and differential noise rejection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz max - enables real-time deterministic control with Thumb-2 instruction set and NVIC interrupt handling. |
| Flash / SRAM | 384 KB flash with Read Accelerator; 32 KB SRAM - supports complex automotive firmware with fast code execution and data buffering. |
| CAN FD Speed | Up to 5 Mbps data phase - meets high-bandwidth diagnostics and ECU coordination requirements in modern vehicle networks. |
| SAR ADC | 12-bit, 1-Msps, differential/single-ended, with channel sequencer and signal averaging - enables precise sensor acquisition (e.g., temperature, pressure) with noise suppression. |
| Deep Sleep Current | 2.5 µA digital system current - sustains battery-powered wake-on-event functionality in always-on automotive nodes. |
| MSC SNR | >5:1 signal-to-noise ratio - ensures reliable touch and proximity detection under condensation or splash conditions. |
| GPIO Count | Up to 84 programmable pins - supports mixed-signal routing for CAPSENSE™, analog inputs, CAN FD, and LCD segment drive on shared pins. |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | Port 0 GPIO bank | Supports CAPSENSE™, analog input, UART TX/RX, and TCPWM capture - configurable per-pin drive strength and slew rate. |
| P1[0]–P1[7] | Port 1 GPIO bank | Includes CAN FD TX/RX pins (P1[0]/P1[1]), SCB0 I2C SDA/SCL, and MSC sense lines - electrically isolated from Port 0 for noise separation. |
| VDDIO0/VDDIO1 | I/O power domains | Independent 1.71–5.5 V supplies per port group - enables mixed-voltage interface (e.g., 3.3 V MCU core with 5 V sensor I/O). |
| VDDD/VDDA | Digital/analog core supplies | Separate 1.71–5.5 V rails with internal LDO regulation - minimizes coupling between digital switching noise and precision analog conversion. |
| XRES | External reset input | Active-low asynchronous reset with internal pull-up - synchronizes recovery from brown-out or watchdog timeout events. |
Key Features
| Feature | Design Value |
|---|---|
| SmartSense auto-tuning | Hardware-accelerated MSC calibration eliminates manual sensor parameter adjustment across temperature and humidity variations. |
| Deep Sleep analog operation | Opamps and comparators remain active during 2.5 µA Deep Sleep - enables continuous low-power window monitoring without CPU wake-up. |
| TCPWM kill signal | Comparator output directly triggers PWM shutdown within one clock cycle - satisfies ASIL-B functional safety requirements for motor overcurrent protection. |
| Reconfigurable SCBs | Five independent serial blocks dynamically assigned as I2C, SPI, UART, or LIN Slave - reduces BOM count by eliminating discrete protocol translators. |
| Hardware crypto accelerators | AES-128/256, SHA-256, TRNG, and CRC engines offload security-critical tasks from CPU - accelerates secure boot and OTA update verification. |
Applications
| Body Control Module (BCM) | Door Module |
|---|---|
Use Scenario: Centralized control of lighting, window lift, mirror adjustment, and seat position memory in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN FD communication with gateway, managing PWM-driven motor drivers, and sampling capacitive door handle sensors. Use Value: Integrated MSC block enables water-tolerant touch activation; TCPWM quadrature decoding supports precise window position tracking without external encoders. | Use Scenario: Localized control of power windows, locks, and side mirror folding with anti-pinch detection. IC Role / Device Role / Timing Role: Real-time motor control unit using comparator-triggered kill signals and 12-bit ADC for current sensing feedback. Use Value: 2.5 µA Deep Sleep current extends battery life during vehicle standby; CAN FD 5 Mbps supports rapid diagnostic session handshaking. |
| Climate Control Panel | Steering Wheel Controls |
Use Scenario: Touch-sensitive HVAC interface with ambient light and temperature compensation. IC Role / Device Role / Timing Role: Capacitive sensing front-end with SmartSense auto-calibration and SAR ADC for thermistor-based cabin temperature measurement. Use Value: >5:1 MSC SNR ensures reliable touch detection despite condensation; software-configurable opamp gain supports multiple sensor types. | Use Scenario: Multi-function steering wheel buttons with haptic feedback and gesture recognition. IC Role / Device Role / Timing Role: Low-latency CAPSENSE™ processor interfacing via I2C to main domain controller while maintaining independent sleep/wake cycles. Use Value: Programmable GPIO drive modes enable direct LED driving for status indicators; reconfigurable SCBs simplify integration with existing LIN or CAN bus topologies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144W | ARM Cortex-M4F core, 112 MHz; includes Ethernet MAC but no integrated MSC or SmartSense. | Targets gateway-level functions with higher compute needs; lacks hardware-accelerated capacitive sensing. | Select when floating-point math or Ethernet connectivity is required; avoid if CAPSENSE™-based HMI is primary use case. |
| Renesas RL78/F14 | 16-bit RL78 core, 32 MHz; AEC-Q100 Grade 2 (–40°C to +105°C); no CAN FD or hardware crypto. | Cost-optimized for simple body electronics; limited analog integration and no multi-sense capacitive sensing. | Select for legacy replacement where CAN FD and advanced HMI are not needed; verify Deep Sleep current (3.5 µA) meets battery budget. |
Compared with S32K144W and RL78/F14, CY8C4147AZSS595XQLA1 uniquely combines CAN FD, MSC with SmartSense, and Deep Sleep analog operation - making it optimal for cost-sensitive, space-constrained automotive HMI and actuator nodes requiring integrated sensing and safety-aware PWM control.
Availability
CY8C4147AZSS595XQLA1 is available at Aetrix Electronics and suitable for body control modules, door modules, climate control panels, and steering wheel control units requiring stable component supply across automotive production lifecycles.
Supply support for CY8C4147AZSS595XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CY8C4147AZSS595XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive body electronics requiring integrated analog sensing, functional safety features, and AEC-Q100 Grade-S reliability in extended temperature environments.
FAQ
What is the maximum operating temperature range for CY8C4147AZSS595XQLA1?
This part is qualified to AEC-Q100 Grade-S, with guaranteed operation from –40°C to +105°C ambient temperature. It includes an on-die temperature sensor integrated into the SAR ADC subsystem, calibrated across this full range for accurate thermal monitoring in under-hood applications.
Does CY8C4147AZSS595XQLA1 support CAN FD physical layer compliance?
Yes - the integrated CAN FD controller supports bit-rate switching up to 5 Mbps in the data phase and complies with ISO 11898-1:2015. It includes built-in transceiver-independent timing parameters and error counters, and requires an external CAN transceiver (e.g., Infineon TLE6250) for physical layer implementation.
Can the MSC block operate through glass or plastic overlays?
Yes - the MSC block achieves >5:1 SNR and supports overlay thicknesses up to 10 mm for glass and 5 mm for plastic, validated per IEC 61000-4-6 conducted immunity testing. SmartSense auto-tuning dynamically adjusts scan parameters to maintain performance across material dielectric variations and environmental drift.
Is ModusToolbox™ required for development with this device?
No - while ModusToolbox™ provides optimized configuration tools, peripheral drivers, and CAPSENSE™ tuning GUI, the device is fully compatible with Arm® GCC toolchains, Keil MDK, and IAR Embedded Workbench. All PDL APIs are open-source and documented in the PSoC™ 4 Peripheral Driver Library reference manual.
CY8C4147AZSS595XQLA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- PSOC™ 4 CY8C4100S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4147AZSS595XQLA1 FAQ
1.How can I place an order for CY8C4147AZSS595XQLA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4147AZSS595XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4147AZSS595XQLA1 reliable?
The price and inventory of CY8C4147AZSS595XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147AZSS595XQLA1 is usually 5 days.
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Once your CY8C4147AZSS595XQLA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4147AZSS595XQLA1?
For technical support, including CY8C4147AZSS595XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147AZSS595XQLA1 requirements.
6.How does Aetrix verify that CY8C4147AZSS595XQLA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4147AZSS595XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147AZSS595XQLA1 meets industry standards.
7.What is the process for return or replacement of CY8C4147AZSS595XQLA1?
All CY8C4147AZSS595XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147AZSS595XQLA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4147AZSS595XQLA1 part is unused and in its original packaging.
Return procedure for CY8C4147AZSS595XQLA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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