Infineon Technologies CY8C4147LDAS553XQLA1
- Part No.:
- CY8C4147LDAS553XQLA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CY8C4147LDAS553XQLA1.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 48VFQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C4147LDAS553XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR for touch interfaces in harsh environments.
For engineers reviewing the CY8C4147LDAS553XQLA1 datasheet, CY8C4147LDAS553XQLA1 pinout, CY8C4147LDAS553XQLA1 application, or CY8C4147LDAS553XQLA1 equivalent, this device supports reconfigurable analog/digital blocks, Deep Sleep mode at 2.5 µA, hardware crypto acceleration (AES/SHA/TRNG), and five SCBs for flexible I²C/SPI/UART/LIN communication - critical for automotive body control, infotainment HMI, and motor control edge nodes.
Technical Context
The CY8C4147LDAS553XQLA1 implements a single-layer AHB-Lite interconnect architecture linking its Cortex-M0+ core, 8x TCPWM blocks, 2x opamps with Deep Sleep operation, and a dedicated MSC block optimized for water-tolerant CAPSENSE™. Its clock system integrates ECO (4–33 MHz), PLL (48 MHz), WCO (32 kHz), and IMO (±2%) for deterministic timing across power modes.
Digital programmability extends to Smart I/O logic, Boolean operations on GPIOs, and runtime-reconfigurable Serial Communication Blocks (SCBs). The CAN FD block operates independently at up to 5 Mbps with dedicated message RAM and filtering - not shared with SCB resources - enabling concurrent high-speed vehicle network and local peripheral control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support for ASIL-B capable partitioning. |
| Memory | 384 KB flash (with Read Accelerator) + 32 KB SRAM - sufficient for AUTOSAR-compliant stacks and dual-bank firmware updates. |
| CAN FD | Up to 5 Mbps data rate with dedicated message RAM and hardware filtering - enables high-bandwidth ECU-to-ECU diagnostics and OTA update channels. |
| ADC | 12-bit SAR ADC @ 1 Msps, differential/single-ended, with built-in temperature sensor and channel sequencer - supports battery monitoring and thermal management without external sensors. |
| Power Modes | Deep Sleep @ 2.5 µA (digital) with operational analog - maintains CAPSENSE™ wake-on-touch and comparator-triggered interrupts during vehicle standby. |
| GPIO | Up to 84 pins; all support CAPSENSE™, analog input, or digital I/O with programmable drive strength/slew rate - simplifies PCB routing for multi-function HMI and sensor fusion. |
| Crypto Acceleration | Hardware AES-128/256, SHA-1/256, TRNG, CRC - offloads secure boot, key derivation, and firmware signature verification from CPU. |
Pinout & Package
This device is packaged in a 64-pin TQFP (10 mm × 10 mm, 0.5 mm pitch) with wettable flank capability for automated optical inspection (AOI) and solder joint reliability in automotive reflow processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | Port 0 GPIO bank | Supports CAPSENSE™, analog input, UART TX/RX, and TCPWM capture - configurable per-pin for mixed-signal signal routing. |
| P1[0]–P1[7] | Port 1 GPIO bank | Includes CAN FD TX/RX (P1[2]/P1[3]), SCB0 I²C SDA/SCL (P1[4]/P1[5]), and MSC sense lines - enables co-location of interface and sensing functions. |
| VDDIO0–VDDIO3 | I/O supply rails | Independent 1.71–5.5 V domains per port group - allows mixed-voltage interfacing (e.g., 3.3 V MCU core with 5 V sensor inputs). |
| VDDD/VDDA | Digital/analog core supplies | Separate 1.71–5.5 V inputs decoupled internally - minimizes noise coupling between digital switching and precision analog acquisition. |
| XRES | External reset input | Active-low, Schmitt-triggered, with internal pull-up - compatible with automotive watchdog ICs and power-supply supervisors. |
| SWDCK/SWDIO | ARM SWD debug interface | 2-pin debug port supporting full JTAG/SWD functionality - enables in-circuit programming and real-time trace without dedicated debug header footprint. |
Key Features
| Feature | Design Value |
|---|---|
| SmartSense™ auto-tuning | Hardware-accelerated CAPSENSE™ calibration eliminates manual tuning for electrode geometry, dielectric thickness, and environmental drift - reduces development time by >70% for touch HMI certification. |
| Programmable analog CTBm | Two continuous-time opamps configurable as buffers, comparators, or transimpedance amplifiers - enables direct connection to current-output sensors (e.g., photodiodes) without external components. |
| Multi-protocol SCBs | Five independent Serial Communication Blocks each reconfigurable at runtime as I²C master/slave, SPI master/slave, UART, or LIN slave - eliminates need for discrete protocol translators in gateway ECUs. |
| Deep Sleep analog retention | Opamps, comparators, and MSC remain active at 2.5 µA system current - supports always-on capacitive wake detection and low-power battery monitoring without host CPU intervention. |
| Hardware crypto engine | Dedicated AES/SHA/TRNG accelerators reduce encryption latency to <1 µs per 128-bit block - meets UNECE R155 CSMS requirements for secure firmware updates and ECU authentication. |
Applications
| Automotive Door Module | Infotainment Touch Panel |
|---|---|
Use Scenario: Centralized control of window lift, mirror fold, and lock actuation with capacitive touch buttons and LIN communication to body domain controller. IC Role / Device Role / Timing Role: Main MCU executing motor control PWM via TCPWM blocks, CAPSENSE™ for touch feedback, and LIN Slave over SCB4 - synchronized to vehicle bus timing. Use Value: Single-chip integration replaces discrete MCU + touch controller + LIN transceiver, reducing BOM cost by 32% and PCB area by 45%. |
Use Scenario: Water-tolerant touchscreen interface for center console with glove-friendly operation under condensation or rain exposure. IC Role / Device Role / Timing Role: MSC block performs real-time signal averaging and noise rejection; SmartSense™ dynamically adjusts baseline thresholds - operating at 100 Hz scan rate with >5:1 SNR. Use Value: Eliminates need for overlay shielding or secondary moisture sensors, achieving IPX5-rated HMI compliance without mechanical redesign. |
| Electric Power Steering (EPS) Sensor Hub | LED Headlamp Driver Interface |
Use Scenario: Aggregation and preprocessing of torque, position, and temperature sensor data before transmission to EPS main controller via CAN FD. IC Role / Device Role / Timing Role: SAR ADC acquires 12-bit analog signals at 100 ksps; CAN FD block transmits time-stamped frames with hardware timestamping - meeting ISO 26262 ASIL-B timing constraints. Use Value: Hardware timestamping ensures sub-µs synchronization between sensor sampling and CAN message transmission, critical for closed-loop steering torque compensation. |
Use Scenario: Digital dimming and fault reporting for adaptive LED headlamps using PWM-controlled current sources and overtemperature shutdown. IC Role / Device Role / Timing Role: TCPWM blocks generate precise 10-bit PWM outputs at 20 kHz; opamps condition thermistor voltage for thermal derating logic - coordinated via NVIC interrupt priorities. Use Value: Programmable slew rate on GPIOs prevents EMI during rapid LED current transitions, satisfying CISPR 25 Class 5 radiated emissions limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144HAT0MLHT | Arm Cortex-M4F @ 112 MHz, 1 MB flash, no integrated CAPSENSE™ or MSC block; requires external touch controller. | Better floating-point performance for motor FOC, but lacks hardware-accelerated capacitive sensing - unsuitable for touch HMI consolidation. | Select when vector control computation dominates; avoid when CAPSENSE™ integration is required to meet ASIL-B HMI safety goals. |
| Renesas RH850/F1L | 32-bit RXv2 core @ 120 MHz, 2 MB flash, CAN FD, but no reconfigurable analog/digital fabric or hardware crypto accelerators. | Stronger real-time determinism for powertrain control, yet lacks Smart I/O and MSC - increases component count for sensor fusion designs. | Prefer for legacy AUTOSAR-based powertrain modules; not recommended for new touch-centric body electronics due to missing CAPSENSE™ hardware. |
Compared with NXP S32K144 and Renesas RH850/F1L, CY8C4147LDAS553XQLA1 uniquely combines CAN FD, hardware CAPSENSE™, and crypto acceleration in a single AEC-Q100 Grade-S package - enabling consolidated HMI + connectivity + security functionality without external ICs.
Availability
CY8C4147LDAS553XQLA1 is available at Aetrix Electronics and suitable for automotive body control units, infotainment touch interfaces, electric power steering sensor hubs, and LED lighting control modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY8C4147LDAS553XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar, and security solutions - with over 30 years of automotive qualification expertise and ISO/TS 16949-certified manufacturing.
CY8C4147LDAS553XQLA1 belongs to the PSoC™ 4100S Max product line, engineered specifically for AEC-Q100-compliant automotive body electronics requiring integrated capacitive sensing, CAN FD, and hardware security - targeting next-generation smart HMI and distributed ECU architectures.
FAQ
Does CY8C4147LDAS553XQLA1 support CAN FD Classic frame format?
Yes, it supports both CAN FD Classic and CAN FD Extended frame formats, with bit rates up to 5 Mbps in FD mode and 1 Mbps in Classic mode. The CAN FD block includes dedicated message RAM, hardware acceptance filtering, and automatic bit-rate switching - fully compliant with ISO 11898-1:2015 and SAE J2284-4 standards.
What is the maximum operating temperature grade for this specific part number?
CY8C4147LDAS553XQLA1 is qualified to AEC-Q100 Grade-S, with guaranteed operation from –40°C to +105°C ambient temperature. This is confirmed by the 'S' suffix in the part number and validated through accelerated life testing per stress test conditions defined in the AEC-Q100 standard.
Can the MSC block perform proximity sensing through plastic or glass overlays?
Yes, the Multi-Sense Converter (MSC) block achieves >5:1 signal-to-noise ratio and supports proximity detection through overlays up to 8 mm thick (acrylic) or 4 mm thick (glass), using shielded electrode layouts and SmartSense™ auto-calibration - validated per IEC 61000-4-6 and ISO 10605 ESD immunity requirements.
Is ModusToolbox™ required to configure the programmable analog blocks?
No, ModusToolbox™ is optional but strongly recommended. Configuration can be done via PDL APIs in any Arm-compatible IDE, but ModusToolbox™ provides graphical CAPSENSE™ tuner, analog block configurator, and hardware-aware code generation - reducing analog design iteration from days to minutes while ensuring AEC-Q100-compliant initialization sequences.
CY8C4147LDAS553XQLA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4100S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
CY8C4147LDAS553XQLA1 FAQ
1.How can I place an order for CY8C4147LDAS553XQLA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4147LDAS553XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4147LDAS553XQLA1 reliable?
The price and inventory of CY8C4147LDAS553XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDAS553XQLA1 is usually 5 days.
3.What payment methods are accepted for CY8C4147LDAS553XQLA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147LDAS553XQLA1 transactions.
Note: Certain payment methods may incur a processing fee.
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CY8C4147LDAS553XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4147LDAS553XQLA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4147LDAS553XQLA1?
For technical support, including CY8C4147LDAS553XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDAS553XQLA1 requirements.
6.How does Aetrix verify that CY8C4147LDAS553XQLA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4147LDAS553XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDAS553XQLA1 meets industry standards.
7.What is the process for return or replacement of CY8C4147LDAS553XQLA1?
All CY8C4147LDAS553XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDAS553XQLA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4147LDAS553XQLA1 part is unused and in its original packaging.
Return procedure for CY8C4147LDAS553XQLA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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