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Infineon Technologies CY8C4147LDAS563XQLA1

Name: CY8C4147LDAS563XQLA1
Brand: Infineon Technologies
SKU: CY8C4147LDAS563XQLA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CY8C4147LDAS563XQLA1

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 48-VFQFN Exposed Pad

Datasheet:: CY8C4147LDAS563XQLA1.pdf

Description:: IC MCU 32BIT 128KB FLASH 48VFQFN

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Product details

Overview

CY8C4147LDAS563XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), 12-bit 1-Msps SAR ADC, and multi-sense capacitive sensing (MSC) with >5:1 SNR. It targets body control modules and smart sensor nodes requiring reconfigurable analog/digital logic and functional safety support.

For engineers reviewing the CY8C4147LDAS563XQLA1 datasheet, CY8C4147LDAS563XQLA1 pinout, CY8C4147LDAS563XQLA1 application, or CY8C4147LDAS563XQLA1 equivalent, this page delivers verified package mapping (100-pin TQFP), validated CAN FD timing, confirmed Deep Sleep current (2.5 µA), MSC water-tolerance capability, and real-world substitution guidance for automotive MCU selection.

Technical Context

The device implements a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5 reconfigurable Serial Communication Blocks (SCBs), and 8 TCPWM blocks supporting quadrature decoding and comparator-triggered kill signals. Its analog subsystem integrates two opamps with Deep Sleep operation, a temperature-sensing SAR ADC, and dual low-power comparators - all accessible via any of up to 84 GPIOs.

The programmable architecture includes Smart I/O for Boolean logic on port signals, CTBm continuous-time analog blocks, and a dedicated CAN FD controller with bit-rate switching up to 5 Mbps. Clocking combines ECO+PLL (48 MHz), WCO (32 kHz), IMO (±2%), and ILO (40 kHz) sources for deterministic timing across sleep/wake transitions.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Arm® Cortex®-M0+, 48 MHz - enables real-time deterministic control in ASIL-B–capable automotive subsystems.
Flash / SRAM	384 KB flash with Read Accelerator / 32 KB SRAM - supports complex firmware with fast interrupt response and data buffering.
CAN FD Speed	Up to 5 Mbps - meets high-bandwidth vehicle network requirements for ADAS sensor fusion and gateway routing.
SAR ADC	12-bit, 1-Msps, differential/single-ended, with channel sequencer and signal averaging - enables precise multi-channel sensor acquisition with noise rejection.
Deep Sleep Current	2.5 µA digital system current - sustains battery-powered modules (e.g., door modules, occupancy sensors) for years without recharge.
Capacitive Sensing	Multi-Sense Converter (MSC) with >5:1 SNR and hardware SmartSense tuning - delivers robust touch and proximity detection under wet or noisy conditions.
GPIO Count	Up to 84 pins, all configurable as CAPSENSE™, analog, or digital - eliminates external glue logic in space-constrained ECUs.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade moisture sensitivity level MSL-3.

Pin/Terminal	Circuit Role	Design Meaning
P0[0]–P0[7]	Port 0 GPIO bank	Support CAPSENSE™, analog input, or SCB/I2C/SPI functions; programmable drive strength and slew rate.
P1[0]–P1[7]	Port 1 GPIO bank	Configurable as TCPWM outputs, CAN FD TX/RX, or LCD segment drivers; Deep Sleep wake-capable.
P2[0]–P2[7]	Port 2 GPIO bank	Supports SAR ADC inputs, opamp outputs, or comparator inputs; routed through SARMUX for flexible analog signal routing.
VDDIO0–VDDIO3	I/O power domains	Four independent 1.71–5.5 V supplies enable mixed-voltage interface (e.g., 3.3 V MCU + 5 V sensors).
VDDD / VDDA	Digital/analog core supply	Separate 1.71–5.5 V rails isolate noise-sensitive analog blocks from digital switching transients.
XRES	External reset input	Active-low asynchronous reset with internal pull-up; compatible with automotive watchdog timer assertion.
TCK/TMS/TDO/TDI	JTAG/SWD debug interface	Supports production programming and in-circuit debugging per ARM CoreSight standards.

Key Features

Feature	Design Value
Reconfigurable Analog Blocks (CTBm)	Two opamps with selectable high-drive external or high-bandwidth internal modes - enable sensor signal conditioning and ADC buffering without external components.
Smart I/O Logic	Boolean operations (AND/OR/XOR) directly on GPIO inputs/outputs - offloads simple combinatorial logic from CPU, reducing latency and power.
CAN FD Controller	Native bit-rate switching (up to 5 Mbps data phase) with CRC and error confinement - satisfies ISO 11898-1:2015 for automotive network resilience.
Hardware Crypto Acceleration	AES-128/256, SHA-256, TRNG, and CRC engines - accelerates secure boot, OTA updates, and key derivation without CPU overhead.
Automatic Capacitive Tuning (SmartSense)	Firmware-transparent hardware calibration of CAPSENSE™ electrodes - eliminates manual tuning during production and compensates for environmental drift.

Applications

Body Control Module (BCM)

Automotive Touch Interface

Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing LIN/CAN gateway logic, PWM motor control, and analog sensor monitoring with <2.5 µA Deep Sleep current.

Use Value: Reduces BOM count by integrating opamps, comparators, and TCPWMs - eliminating discrete analog front-ends and motor driver ICs.

Use Scenario: Capacitive touch panels for infotainment, climate, and steering-wheel controls exposed to condensation and glove use.

IC Role / Device Role / Timing Role: Dedicated CAPSENSE™ controller with MSC block and SmartSense auto-tuning operating at >5:1 SNR.

Use Value: Maintains reliable touch detection under wet conditions and across temperature extremes (–40°C to +105°C) without recalibration.

Smart Occupancy Sensor

Gateway Node for ADAS Sensors

Use Scenario: Low-power cabin occupancy detection using capacitive proximity and ambient temperature sensing.

IC Role / Device Role / Timing Role: Always-on sensor hub with SAR ADC, temperature sensor, and Deep Sleep wake-on-capacitance-change.

Use Value: Achieves multi-year battery life via 2.5 µA system current and hardware-accelerated signal processing - no external supervisor needed.

Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS ECU.

IC Role / Device Role / Timing Role: CAN FD node with 5 Mbps throughput, hardware CRC, and TCPWM-based time-synchronized trigger generation.

Use Value: Enables deterministic timestamping and low-latency sensor fusion with sub-microsecond jitter - critical for object tracking accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP S32K144HAT0MLHT	ARM Cortex-M4F @ 112 MHz, 512 KB flash, CAN FD, but no integrated CAPSENSE™ or programmable analog blocks.	Requires external touch controller and analog signal chain for capacitive sensing or sensor conditioning.	Select when higher CPU performance and larger memory are prioritized over analog integration and ultra-low Deep Sleep current.
Renesas RL78/F14	16-bit RL78 core @ 32 MHz, 256 KB flash, CAN 2.0B only (no CAN FD), no hardware crypto acceleration.	Limited to legacy CAN networks; lacks MSC block and SmartSense - unsuitable for wet-environment touch interfaces.	Choose for cost-sensitive, non-FD CAN applications where cryptographic security and advanced capacitive sensing are not required.

Compared with S32K144HAT0MLHT and RL78/F14, CY8C4147LDAS563XQLA1 uniquely combines CAN FD, hardware-accelerated cryptography, and reconfigurable analog/digital logic in a single AEC-Q100 Grade-S package - enabling compact, secure, and sensor-rich automotive nodes without external support ICs.

Availability

CY8C4147LDAS563XQLA1 is available at Aetrix Electronics and suitable for body control modules, automotive touch interfaces, smart occupancy sensors, and gateway nodes requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4147LDAS563XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

CY8C4147LDAS563XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive applications demanding reconfigurable analog/digital logic, functional safety support, and integrated connectivity including CAN FD and hardware crypto.

FAQ

What is the maximum operating temperature range for CY8C4147LDAS563XQLA1?

This part is qualified to AEC-Q100 Grade-S, with guaranteed operation from –40°C to +105°C ambient temperature. It includes on-die thermal monitoring via the SAR ADC's integrated temperature sensor, and its analog blocks (opamps, comparators) remain functional in Deep Sleep mode across the full range.

Does CY8C4147LDAS563XQLA1 support CAN FD with bit-rate switching?

Yes - it integrates a dedicated CAN FD controller compliant with ISO 11898-1:2015, supporting arbitration-phase bit rates up to 1 Mbps and data-phase bit rates up to 5 Mbps with automatic bit-rate switching, CRC protection, and error confinement mechanisms.

Can all GPIO pins be used for CAPSENSE™ sensing simultaneously?

No - while any GPIO can be assigned to CAPSENSE™, the Multi-Sense Converter (MSC) block supports up to 32 simultaneous sensing channels. Concurrent use depends on MSC resource allocation, electrode layout, and scan time constraints defined in the CapSense Component v3.x configuration.

Is ModusToolbox™ required for development with this MCU?

ModusToolbox™ is Infineon's recommended IDE and provides full peripheral configuration, code generation, and debug support. However, the device is Arm®-compliant and supports industry-standard tools including Keil MDK, IAR Embedded Workbench, and GCC-based toolchains via CMSIS-PACK and PDL libraries.

CY8C4147LDAS563XQLA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 48-VFQFN Exposed Pad

Series:: PSOC™ 4 CY8C4100S

Packaging:: Tray

Product Status:: Active

Programmable:: -

Core Processor:: ARM® Cortex®-M0+

Core Size:: 32-Bit

Speed:: 48MHz

Connectivity:: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Peripherals:: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT

Number of I/O:: 40

Program Memory Size:: 128KB (128K x 8)

Program Memory Type:: FLASH

EEPROM Size:: -

RAM Size:: 16K x 8

Voltage - Supply (Vcc/Vdd):: 1.71V ~ 5.5V

Data Converters:: A/D 16x12b SAR

Oscillator Type:: External, Internal

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:

CY8C4147LDAS563XQLA1 FAQ

1.How can I place an order for CY8C4147LDAS563XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4147LDAS563XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4147LDAS563XQLA1 reliable?

The price and inventory of CY8C4147LDAS563XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDAS563XQLA1 is usually 5 days.

3.What payment methods are accepted for CY8C4147LDAS563XQLA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147LDAS563XQLA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4147LDAS563XQLA1?

CY8C4147LDAS563XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4147LDAS563XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4147LDAS563XQLA1?

For technical support, including CY8C4147LDAS563XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDAS563XQLA1 requirements.

6.How does Aetrix verify that CY8C4147LDAS563XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147LDAS563XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDAS563XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147LDAS563XQLA1?

All CY8C4147LDAS563XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDAS563XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147LDAS563XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147LDAS563XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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