Infineon Technologies CY8C4147LDAS573XQLA1
- Part No.:
- CY8C4147LDAS573XQLA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CY8C4147LDAS573XQLA1.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 48VFQFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,706
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4147LDAS573XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU running at 48 MHz, featuring 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, 12-bit 1-Msps SAR ADC, and multi-sense capacitive sensing (MSC) with >5:1 SNR for touch interfaces in vehicle control panels.
For engineers reviewing the CY8C4147LDAS573XQLA1 datasheet, CY8C4147LDAS573XQLA1 pinout, CY8C4147LDAS573XQLA1 application, or CY8C4147LDAS573XQLA1 equivalent, this device supports reconfigurable analog/digital blocks, Deep Sleep mode with 2.5 µA system current, hardware crypto acceleration (AES/SHA/TRNG), and five runtime-reconfigurable SCBs for I²C/SPI/UART/LIN - critical for automotive body electronics and human-machine interface design.
Technical Context
The CY8C4147LDAS573XQLA1 integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 384 KB flash with Read Accelerator, and 32 KB SRAM. Its analog subsystem includes two CTBm opamps (operable in Deep Sleep), dual low-power comparators, and a SAR ADC with integrated temperature sensor and channel sequencer supporting signal averaging.
Digital resources comprise eight 16-bit TCPWM blocks with quadrature decode and comparator-triggered kill signals, five SCBs supporting concurrent protocols, a dedicated CAN FD controller (5 Mbps), I²S TX Master, and MSC block enabling water-tolerant capacitive sensing via SmartSense auto-tuning - all programmable via ModusToolbox™ PDL APIs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support |
| Flash / SRAM | 384 KB flash with Read Accelerator; 32 KB SRAM - enables complex firmware with fast ISR response |
| ADC | 12-bit SAR ADC, 1 Msps, differential/single-ended, channel sequencer with averaging - supports high-accuracy sensor acquisition |
| CAN FD | CAN FD controller, up to 5 Mbps data rate - meets modern automotive network bandwidth requirements |
| Power Modes | Deep Sleep mode draws 2.5 µA digital current while maintaining analog operation - extends battery life in always-on systems |
| Capacitive Sensing | Multi-Sense Converter (MSC) with >5:1 SNR and hardware SmartSense tuning - delivers robust touch performance under moisture |
| Crypto Engine | Hardware AES-128/256, SHA-1/256, TRNG, CRC - accelerates secure boot and OTA update verification |
Pinout & Package
Package: 64-pin TQFP (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant, wettable flank capable.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | GPIO Port 0 | Programmable as CAPSENSE™, analog input, or digital I/O with configurable drive strength/slew rate |
| P1[0]–P1[7] | GPIO Port 1 | Supports LCD segment drive, UART RX/TX, and SCB I²C/SPI functions via hardware routing matrix |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator | Connects to 4–33 MHz crystal for precise clock source; enables PLL lock to 48 MHz system clock |
| CAN_TX / CAN_RX | CAN FD Physical Interface | Dedicated differential pins compliant with ISO 11898-1; require external transceiver for bus connection |
| VDDA / VSSA | Analog Power Supply | Independent 1.71–5.5 V analog domain supply - isolates noise-sensitive ADC and opamp operation |
Key Features
| Feature | Design Value |
|---|---|
| Reconfigurable Analog Blocks | Two CTBm opamps + dual LP comparators - enable sensor signal conditioning and threshold detection without external components |
| Smart I/O Logic | Boolean logic on port inputs/outputs - implements glueless state machines and protocol translation in hardware |
| Multi-Sense Converter (MSC) | Hardware-accelerated CAPSENSE™ with automatic SmartSense tuning - eliminates manual calibration for production touch panels |
| Runtime-Reconfigurable SCBs | Five Serial Communication Blocks - dynamically assign I²C/SPI/UART/LIN per peripheral need without firmware reload |
| Deep Sleep with Active Analog | 2.5 µA system current with opamps/ADC/comparators operational - enables wake-on-touch or wake-on-sensor-event designs |
Applications
| Automotive Door Control Module | Touch-Based HVAC Panel |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting via LIN/CAN network. IC Role / Device Role / Timing Role: Main MCU executing motor control PWM, LIN slave communication, and fault monitoring. Use Value: Integrated TCPWM kill signals prevent overcurrent damage; CAN FD enables faster diagnostics and software updates. | Use Scenario: Capacitive touch interface for climate settings with water tolerance required for condensation resistance. IC Role / Device Role / Timing Role: CAPSENSE™ controller with MSC block performing real-time touch detection and gesture decoding. Use Value: >5:1 SNR and SmartSense auto-tuning ensure reliable operation across temperature/humidity without factory calibration. |
| Body Control Unit (BCU) | Instrument Cluster Subsystem |
Use Scenario: Low-power monitoring of door open/closed, seatbelt status, and ambient light for automatic lighting control. IC Role / Device Role / Timing Role: System manager handling GPIO interrupts, ADC-based light sensing, and Deep Sleep wake-up events. Use Value: 2.5 µA Deep Sleep current with active analog allows years of battery-backed operation in key-off states. | Use Scenario: Driving display with segmented LCD and audio feedback via I²S-connected amplifier. IC Role / Device Role / Timing Role: LCD segment driver + I²S TX Master coordinating visual/audio HMI output. Use Value: Direct GPIO-based LCD drive reduces BOM cost; hardware I²S master eliminates need for external audio interface IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC560P50L5 | Power Architecture e200z0h core, 64 MHz, 512 KB flash, no integrated CAPSENSE™ or MSC block | Lacks hardware capacitive sensing; requires external touch controller for HMI | Preferred when legacy Power Architecture toolchain or ASIL-B functional safety certification is required |
| RA4M2 (R7FA4M2AD3CFM) | Arm Cortex-M33 core, 100 MHz, 512 KB flash, 128 KB SRAM, no CAN FD or MSC | Higher performance but no integrated touch sensing or CAN FD - needs companion transceiver and touch IC | Chosen for higher compute throughput in gateway or ADAS preprocessing where CAN FD is not mandatory |
Compared with SPC560P50L5 and RA4M2, the CY8C4147LDAS573XQLA1 uniquely integrates CAN FD, MSC-based CAPSENSE™, and Deep Sleep analog retention - reducing component count and board space in compact automotive HMI and body control modules.
Availability
CY8C4147LDAS573XQLA1 is available at Aetrix Electronics and suitable for automotive door modules, HVAC touch panels, body control units, and instrument cluster subsystems requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for CY8C4147LDAS573XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar sensors, and security solutions, with global R&D and manufacturing infrastructure.
The PSoC™ 4100S Max product line targets automotive body electronics and human-machine interface applications, delivering reconfigurable analog/digital fabric with AEC-Q100 Grade-S compliance and hardware-accelerated capacitive sensing.
FAQ
What is the maximum operating temperature range for CY8C4147LDAS573XQLA1?
This device is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. It includes an integrated temperature sensor within the SAR ADC subsystem, calibrated for on-chip thermal monitoring without external components.
Does CY8C4147LDAS573XQLA1 support CAN FD without external transceivers?
No. The part contains a CAN FD controller only; physical layer signaling requires an external CAN FD transceiver (e.g., Infineon TLE9251VS). The CAN_TX and CAN_RX pins provide differential logic-level outputs compliant with ISO 11898-1, not bus-capable voltage levels.
Can the MSC block be used for proximity sensing beyond touch buttons?
Yes. The Multi-Sense Converter supports proximity detection via shielded electrode configurations and adaptive baseline tracking. Application notes AN95984 and AN92603 document implementation of hover and 3D gesture sensing using hardware-accelerated MSC scanning and SmartSense algorithms.
Is ModusToolbox™ required to configure the programmable analog and digital blocks?
ModusToolbox™ is the recommended and fully supported IDE, providing graphical configuration of CTBm opamps, TCPWM, SCBs, and MSC via the Device Configurator and PDL-based code generation. While register-level programming is possible, it is not validated or documented for production use by Infineon.
CY8C4147LDAS573XQLA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4100S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
CY8C4147LDAS573XQLA1 FAQ
1.How can I place an order for CY8C4147LDAS573XQLA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4147LDAS573XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4147LDAS573XQLA1 reliable?
The price and inventory of CY8C4147LDAS573XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDAS573XQLA1 is usually 5 days.
3.What payment methods are accepted for CY8C4147LDAS573XQLA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147LDAS573XQLA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4147LDAS573XQLA1?
CY8C4147LDAS573XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4147LDAS573XQLA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4147LDAS573XQLA1?
For technical support, including CY8C4147LDAS573XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDAS573XQLA1 requirements.
6.How does Aetrix verify that CY8C4147LDAS573XQLA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4147LDAS573XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDAS573XQLA1 meets industry standards.
7.What is the process for return or replacement of CY8C4147LDAS573XQLA1?
All CY8C4147LDAS573XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDAS573XQLA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4147LDAS573XQLA1 part is unused and in its original packaging.
Return procedure for CY8C4147LDAS573XQLA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4147LDAS573XQLA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

