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Infineon Technologies CY8C4147LDAS583XQLA1
- Part No.:
- CY8C4147LDAS583XQLA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CY8C4147LDAS583XQLA1.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 48VFQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,483
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Product details
Overview
CY8C4147LDAS583XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on the Arm® Cortex®-M0+ CPU running at 48 MHz, featuring 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules, door module ECUs, and touch-enabled automotive human-machine interfaces.
For engineers reviewing the CY8C4147LDAS583XQLA1 datasheet, CY8C4147LDAS583XQLA1 pinout, CY8C4147LDAS583XQLA1 application, or CY8C4147LDAS583XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current ≤2.5 µA with active analog, 12-bit SAR ADC with temperature sensor, programmable opamp modes, and 84 GPIOs supporting CAPSENSE™/analog/digital reconfiguration.
Technical Context
The device implements a tightly coupled system-on-chip architecture with a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, memory subsystem (384 KB flash + 32 KB SRAM), and heterogeneous peripherals including five reconfigurable Serial Communication Blocks (SCBs), eight TCPWM units, and dual CTBm opamps capable of comparator and ADC input buffering modes in Deep Sleep.
Its analog subsystem integrates a 12-bit 1-Msps SAR ADC with differential/single-ended inputs and channel sequencer, two low-power comparators, and a Multi-Sense Converter (MSC) block delivering >5:1 SNR for capacitive sensing under wet conditions - all supported by hardware-accelerated SmartSense tuning and TRNG-based cryptographic services.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support |
| Flash / SRAM | 384 KB flash with Read Accelerator; 32 KB SRAM - enables complex firmware with fast ISR response |
| Operating Voltage | 1.71 V to 5.5 V - supports direct connection to 3.3 V or 5 V automotive domains without level-shifting |
| Deep Sleep Current | 2.5 µA digital system current with active analog - enables always-on capacitive wake-up in door handle sensors |
| CAN FD Speed | Up to 5 Mbps - meets high-bandwidth requirements for gateway and domain controller communication |
| ADC Resolution/Speed | 12-bit SAR, 1 Msps with sequencer & averaging - supports multi-channel battery monitoring or motor phase sensing |
| GPIO Count | 84 programmable pins - allows full integration of touch, LIN, UART, PWM, and analog sensing in one ECU |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | Port 0 GPIO bank | Supports CAPSENSE™, analog input, or digital I/O; configurable slew rate and drive strength per pin |
| P1[0]–P1[7] | Port 1 GPIO bank | Includes dedicated CAN FD TX/RX pins (P1[2]/P1[3]) with internal termination and glitch filtering |
| P2[0]–P2[7] | Port 2 GPIO bank | Contains SCB0 I²C SDA/SCL (P2[0]/P2[1]) and TCPWM0 capture/compare outputs |
| VDDIO0–VDDIO3 | I/O power domains | Four independent 1.71–5.5 V supplies enabling mixed-voltage interface (e.g., 3.3 V MCU + 5 V sensor bus) |
| VDDD / VDDA | Digital/analog core supply | Separate 1.71–5.5 V rails decoupled for noise-sensitive analog operation and stable digital logic |
Key Features
| Feature | Design Value |
|---|---|
| SmartSense auto-tuning | Hardware-accelerated CAPSENSE™ calibration eliminates manual threshold adjustment across temperature/humidity |
| Deep Sleep analog retention | Opamps and comparators remain operational at 2.5 µA system current - enables wake-on-touch without host CPU wake-up |
| Reconfigurable SCBs | Five serial blocks dynamically switch between I²C/SPI/UART/LIN Slave - reduces BOM count in multi-protocol ECUs |
| TCPWM kill signal triggering | Comparator output directly triggers PWM shutdown within one clock cycle - critical for motor overcurrent protection |
| Crypto acceleration | Dedicated AES-128/256, SHA-256, TRNG, and CRC engines offload security tasks from Cortex-M0+ core |
Applications
| Door Handle Touch Sensor | Body Control Module (BCM) |
|---|---|
Use Scenario: Capacitive touch detection on exterior door handles under rain, ice, or glove use. IC Role / Device Role / Timing Role: CAPSENSE™ MSC block performs real-time water rejection and proximity sensing; Cortex-M0+ executes authentication and LIN wakeup. Use Value: >5:1 SNR and SmartSense enable reliable wake-up at <2.5 µA Deep Sleep current without external conditioning circuitry. | Use Scenario: Centralized control of lighting, window lift, mirror fold, and seat position in mid-tier vehicles. IC Role / Device Role / Timing Role: MCU orchestrates LIN slave nodes, drives LED backlighting via PWM, and monitors analog battery voltage/temperature. Use Value: Integrated 12-bit SAR ADC, 8x TCPWM, and 5x SCBs eliminate discrete signal conditioning and protocol bridge ICs. |
| Climate Control Panel | Seat Occupancy Detection |
Use Scenario: Touch-responsive HVAC interface with haptic feedback and ambient light adaptive display. IC Role / Device Role / Timing Role: Dual opamps condition thermistor signals; LCD segment drivers control segmented display; SCBs manage I²C display and SPI fan controller. Use Value: Single-chip solution replaces separate analog front-end, display driver, and communication ICs - reducing PCB area by ≥35%. | Use Scenario: Capacitive seat mat sensing for airbag deployment logic and occupancy classification. IC Role / Device Role / Timing Role: MSC block acquires multi-electrode capacitance data; TRNG seeds secure CAN FD message authentication. Use Value: Hardware SmartSense and >5:1 SNR ensure robust detection across fabric types, moisture levels, and seating positions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144HAT0MLHT | ARM Cortex-M4F @ 112 MHz; includes Ethernet MAC; no integrated CAPSENSE™; larger 100-pin LQFP package | Targets gateway/routing functions requiring higher compute throughput and network stack support | Select when Ethernet or floating-point math is required; avoid if capacitive HMI is primary function |
| Renesas RL78/F14 | 16-bit RL78 core @ 32 MHz; 512 KB flash; CAN 2.0B only; no crypto accelerator or SmartSense | Suitable for cost-sensitive body electronics with basic CAN and LIN, but lacks advanced HMI features | Select for legacy LIN/CAN-only designs where touch interface is absent and BOM cost is critical |
Compared with S32K144HAT0MLHT and RL78/F14, CY8C4147LDAS583XQLA1 uniquely combines automotive-grade CAPSENSE™, CAN FD, and Deep Sleep analog retention in a single die - making it optimal for touch-integrated ECUs where size, power, and HMI performance are co-constrained.
Availability
CY8C4147LDAS583XQLA1 is available at Aetrix Electronics and suitable for automotive body electronics, touch-based human-machine interfaces, and CAN FD domain controllers requiring stable component supply across extended temperature ranges (–40°C to +105°C).
Supply support for CY8C4147LDAS583XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and wafer fabrication facilities.
CY8C4147LDAS583XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive body electronics requiring integrated analog sensing, capacitive HMI, CAN FD connectivity, and AEC-Q100 reliability.
FAQ
What is the maximum operating temperature grade for CY8C4147LDAS583XQLA1?
This part is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. It is not rated for Grade-E (–40°C to +125°C) operation, and thermal derating applies above 105°C. The silicon's junction temperature limit remains 125°C under specified power dissipation conditions.
Does CY8C4147LDAS583XQLA1 support CAN FD with ISO 11898-1:2015 compliance?
Yes - the integrated CAN FD controller complies with ISO 11898-1:2015, supporting bit rates up to 5 Mbps in FD mode and automatic protocol arbitration between Classical CAN and CAN FD frames. It includes built-in error counters, loopback self-test, and programmable bit timing registers for precise network synchronization.
Can all 84 GPIOs be used simultaneously for CAPSENSE™ electrode scanning?
No - while any GPIO can be configured as a CAPSENSE™ electrode, the MSC block supports up to 64 electrodes per scan group, and simultaneous scanning is limited by SAR ADC channel count and MSC hardware resources. Practical implementations typically allocate 32–48 electrodes per scan cycle to maintain <15 ms total scan time at >5:1 SNR.
Is ModusToolbox™ required for development, or does it support third-party IDEs?
ModusToolbox™ is Infineon's recommended IDE and provides full peripheral configuration, PDL API access, and SmartSense tuning tools. However, the device is Arm®-compliant and supports GCC-based toolchains (e.g., Arm GNU Toolchain) and debuggers (J-Link, ST-Link v2-1) via SWD interface - enabling integration into custom CI/CD pipelines and legacy build systems.
CY8C4147LDAS583XQLA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4100S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
CY8C4147LDAS583XQLA1 FAQ
1.How can I place an order for CY8C4147LDAS583XQLA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4147LDAS583XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4147LDAS583XQLA1 reliable?
The price and inventory of CY8C4147LDAS583XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDAS583XQLA1 is usually 5 days.
3.What payment methods are accepted for CY8C4147LDAS583XQLA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147LDAS583XQLA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4147LDAS583XQLA1?
CY8C4147LDAS583XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4147LDAS583XQLA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4147LDAS583XQLA1?
For technical support, including CY8C4147LDAS583XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDAS583XQLA1 requirements.
6.How does Aetrix verify that CY8C4147LDAS583XQLA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4147LDAS583XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDAS583XQLA1 meets industry standards.
7.What is the process for return or replacement of CY8C4147LDAS583XQLA1?
All CY8C4147LDAS583XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDAS583XQLA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4147LDAS583XQLA1 part is unused and in its original packaging.
Return procedure for CY8C4147LDAS583XQLA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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