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Infineon Technologies CY8C4147LDES563XQLA1

Part No.:
CY8C4147LDES563XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4147LDES563XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,040

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Product details

Overview

CY8C4147LDES563XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR. It supports CAPSENSE™, LCD segment drive, and five reconfigurable Serial Communication Blocks (SCB) for I²C/SPI/UART/LIN in body control modules.

For engineers reviewing the CY8C4147LDES563XQLA1 datasheet, CY8C4147LDES563XQLA1 pinout, CY8C4147LDES563XQLA1 application, or CY8C4147LDES563XQLA1 equivalent, key selection criteria include CAN FD compliance, Deep Sleep current (2.5 µA), programmable analog (2 opamps + 12-bit SAR ADC), TCPWM timing precision, and GPIO flexibility across 84 pins in 100-pin TQFP.

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, memory subsystem (384 KB flash with Read Accelerator, 32 KB SRAM), and peripherals including CAN FD, I²S TX Master, and cryptography accelerators (AES, SHA, TRNG). Its clock system combines ECO (4–33 MHz) with PLL for 48-MHz operation, WCO (32 kHz), and low-power ILO (40 kHz).

Analog resources include two continuous-time opamps supporting comparator mode and ADC input buffering, plus a 12-bit 1-Msps SAR ADC with temperature sensor and channel sequencer. Digital programmability extends to Smart I/O blocks, eight 16-bit TCPWM units with quadrature decode and kill-signal triggering, and five SCBs configurable per runtime.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz - enables deterministic real-time control with Thumb-2 instruction set and NVIC interrupt handling.
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - supports complex automotive firmware with fast code execution and data buffering.
CAN FD SpeedUp to 5 Mbps - meets high-bandwidth vehicle network requirements for ADAS sensor fusion and gateway routing.
SAR ADC12-bit, 1-Msps, differential/single-ended, with temperature sensor and signal averaging - delivers precise sensor acquisition in engine management and battery monitoring.
Deep Sleep Current2.5 µA digital system current - enables always-on wake-on-event functionality in door modules and seat controllers.
GPIO CountUp to 84 pins, all CAPSENSE™/analog/digital configurable - simplifies PCB layout by eliminating dedicated sense or communication pins.
Operating TempGrade-S: –40°C to +105°C - certified for under-hood and powertrain-adjacent applications per AEC-Q100 Rev G.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™, analog input, SCB I²C/SPI, and TCPWM capture - enables multi-function pin reuse in compact ECUs.
P1[0]–P1[7]Port 1 GPIO bankConfigurable as CAN FD TX/RX, LCD segment drivers, or opamp inputs - allows shared routing for infotainment display and communication interfaces.
VDDIO0–VDDIO3I/O supply railsIndependent 1.71–5.5 V domains per port group - permits mixed-voltage interfacing with legacy sensors and 3.3 V logic.
VDDD / VDDADigital/analog core suppliesSeparate 1.71–5.5 V inputs decoupled for noise isolation - critical for stable ADC and CAPSENSE™ performance in noisy automotive environments.
XRESExternal reset inputActive-low, Schmitt-triggered, with internal pull-up - ensures robust reset assertion during battery transients per ISO 16750-2.
SWDCK / SWDIOARM Serial Wire DebugTwo-pin debug interface supporting programming and real-time trace - eliminates need for JTAG header space in production PCBs.

Key Features

FeatureDesign Value
Multi-Sense Converter (MSC)Capacitive sensing block with >5:1 SNR and water-tolerant operation - enables reliable touch buttons and sliders in wet cabin environments without shielding.
SmartSense Auto-TuningHardware-accelerated calibration of CAPSENSE™ parameters - reduces firmware development time and eliminates manual tuning across temperature and voltage variations.
CAN FD BlockDedicated hardware supporting ISO 11898-1:2015 with bit rates up to 5 Mbps and flexible data field lengths - offloads protocol stack processing from CPU for deterministic latency.
Programmable AnalogTwo opamps with reconfigurable drive modes (high-bandwidth internal / high-drive external) and Deep Sleep operation - supports active sensor conditioning while minimizing system power.
Five SCBsRuntime-reconfigurable serial blocks supporting I²C, SPI, UART, or LIN Slave on same pins - enables dynamic peripheral assignment in software-defined vehicle architectures.

Applications

Body Control Module (BCM)Electric Power Steering (EPS)

Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing CAN FD gateway logic, CAPSENSE™ for touch controls, and PWM for LED dimming.

Use Value: Single-chip integration reduces BOM count and enables synchronized actuator timing via eight TCPWM blocks with quadrature decode.

Use Scenario: Real-time torque assist calculation and motor phase control in steer-by-wire systems.

IC Role / Device Role / Timing Role: Safety-critical controller managing CAN FD communication with ADAS domain, ADC sampling of torque sensors, and PWM generation for 3-phase inverter gate drivers.

Use Value: AEC-Q100 Grade-S qualification and 2.5 µA Deep Sleep support fail-safe state retention during ignition-off periods.

Instrument Cluster DisplaySeat Occupancy & Position Sensing

Use Scenario: Driving information rendering with analog gauges, digital displays, and backlight control.

IC Role / Device Role / Timing Role: LCD segment driver with GPIO-based direct drive, SCB-configured I²C for display controller comms, and SAR ADC for ambient light sensing.

Use Value: Integrated LCD drive eliminates external driver ICs; programmable slew rate prevents EMI during high-speed segment switching.

Use Scenario: Capacitive detection of occupant presence, posture, and seat position for airbag deployment logic and comfort adjustments.

IC Role / Device Role / Timing Role: MSC-based multi-electrode sensing front-end with SmartSense auto-calibration and temperature compensation via on-die sensor.

Use Value: >5:1 SNR and water tolerance ensure reliable detection through fabric, foam, and condensation without false triggers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY8C4147AZI-S445Same PSoC™ 4100S Max family, but 64-pin TQFP, no CAN FD block, Grade-A (–40°C to +85°C)Limited to non-critical cabin modules without vehicle network connectivitySelect when CAN FD is unnecessary and cost-sensitive packaging suffices.
SPC560P50L5Power Architecture-based, 64-MHz e200z0h core, 512 KB flash, 48 KB RAM, dual CAN FD, but no integrated CAPSENSE™ or programmable analogRequires external capacitive sensing IC and opamp circuitry for HMI functionsChoose for high-CPU-load powertrain applications where analog programmability is secondary.

Compared with CY8C4147AZI-S445 and SPC560P50L5, CY8C4147LDES563XQLA1 uniquely combines CAN FD, MSC-based capacitive sensing, and reconfigurable analog/digital blocks in one AEC-Q100 Grade-S package-enabling consolidated HMI + networking + sensing in space-constrained automotive ECUs.

Availability

CY8C4147LDES563XQLA1 is available at Aetrix Electronics and suitable for body control modules, electric power steering systems, instrument cluster displays, and seat occupancy sensing requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4147LDES563XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar sensors, and security solutions, with global manufacturing and R&D centers.

This part belongs to the PSoC™ 4100S Max product line, designed specifically for scalable, reconfigurable automotive embedded control with integrated analog sensing, CAN FD networking, and functional safety-ready peripherals.

FAQ

What is the maximum operating frequency of the Arm® Cortex®-M0+ core in CY8C4147LDES563XQLA1?

The core operates at a maximum frequency of 48 MHz, achieved using the internal main oscillator (IMO) with PLL multiplication or an external crystal oscillator (ECO) with PLL. This frequency is fully supported across the full Grade-S temperature range (–40°C to +105°C) and meets AEC-Q100 timing specifications under worst-case voltage and process corners.

Does CY8C4147LDES563XQLA1 support hardware-based cryptographic acceleration?

Yes, it includes a dedicated Crypto block supporting AES-128/256 encryption/decryption, SHA-1/SHA-256 hashing, CRC-32 computation, true random number generation (TRNG), and PRNG. These accelerators operate independently of the CPU and are accessible via PDL APIs, enabling secure boot, firmware authentication, and encrypted CAN FD message payloads.

Can all 84 GPIO pins be used simultaneously for CAPSENSE™ sensing?

No - while any GPIO can be assigned to CAPSENSE™, the Multi-Sense Converter (MSC) block supports up to 32 sensing electrodes per scan group, and total electrode count is constrained by SAR ADC channel allocation and MSC resource partitioning. Practical designs typically use 16–24 electrodes with SmartSense auto-tuning enabled for optimal SNR and scan time.

What debug interface does CY8C4147LDES563XQLA1 use, and is JTAG supported?

The device uses ARM Serial Wire Debug (SWD) with SWDCK and SWDIO pins; JTAG is not implemented. SWD provides full programming, real-time debugging, and trace capability via ModusToolbox™ and third-party Arm-compatible tools. The two-pin interface reduces PCB footprint and simplifies test fixture design compared to traditional 10-pin JTAG headers.

CY8C4147LDES563XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4147LDES563XQLA1 FAQ

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Please submit a Request for Quotation (RFQ) for CY8C4147LDES563XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY8C4147LDES563XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDES563XQLA1 is usually 5 days.

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CY8C4147LDES563XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4147LDES563XQLA1?

For technical support, including CY8C4147LDES563XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDES563XQLA1 requirements.

6.How does Aetrix verify that CY8C4147LDES563XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147LDES563XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDES563XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147LDES563XQLA1?

All CY8C4147LDES563XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDES563XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147LDES563XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147LDES563XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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