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Infineon Technologies CY8C4147LDES573XQLA1
- Part No.:
- CY8C4147LDES573XQLA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CY8C4147LDES573XQLA1.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 48VFQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,847
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Product details
Overview
CY8C4147LDES573XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-grade PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), 12-bit 1-Msps SAR ADC, and multi-sense capacitive sensing (MSC) with >5:1 SNR for touch interfaces in harsh environments.
For engineers reviewing the CY8C4147LDES573XQLA1 datasheet, CY8C4147LDES573XQLA1 pinout, CY8C4147LDES573XQLA1 application, or CY8C4147LDES573XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), programmable analog routing, MSC water-tolerance capability, and ModusToolbox™ API support for rapid CAPSENSE™ tuning.
Technical Context
The device implements a single-layer AHB-Lite interconnect between CPU, memory, and peripherals, enabling deterministic latency for real-time control. Its programmable analog subsystem includes two CTBm opamps supporting ADC input buffering and comparator modes, both operational in Deep Sleep mode with sub-µA quiescent current.
Digital flexibility is delivered via five reconfigurable Serial Communication Blocks (SCBs) supporting I²C/SPI/UART/LIN, eight TCPWM blocks with quadrature decode and kill-signal triggering, and Smart I/O logic for Boolean port-level signal conditioning without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz - enables deterministic real-time execution with Thumb-2 instruction set and NVIC interrupt handling. |
| Flash / SRAM | 384 KB flash with Read Accelerator / 32 KB SRAM - supports complex firmware with fast code fetch and data buffering for sensor fusion. |
| ADC | 12-bit SAR, 1 Msps, differential/single-ended, channel sequencer with averaging - delivers high-resolution sampling for motor current or battery voltage monitoring. |
| CAN FD | Up to 5 Mbps data rate, ISO 11898-1 compliant - meets modern automotive ECU communication bandwidth and error-detection requirements. |
| Power Modes | Deep Sleep: 2.5 µA digital + active analog - sustains capacitive wake-up or temperature monitoring while minimizing system standby power. |
| GPIO Count | Up to 84 pins, all CAPSENSE™/analog/digital configurable - eliminates external multiplexers in multi-function HMI and sensor interface designs. |
| Operating Temp | Grade-S: –40°C to +105°C - qualified for under-hood and instrument cluster applications per AEC-Q100 Rev G. |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, wettable flank option enabled for automated optical inspection (AOI).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | Port 0 GPIO bank | Supports CAPSENSE™, analog input, or SCB/I²C functions; programmable drive strength and slew rate for EMI control. |
| P1[0]–P1[7] | Port 1 GPIO bank | Configurable as CAN FD TX/RX, TCPWM outputs, or MSC sense lines; internal pull-up/down selectable. |
| XTAL_IN / XTAL_OUT | External crystal oscillator inputs | Drive 4–33 MHz ECO; PLL locks to generate stable 48-MHz system clock with ±0.2% jitter tolerance. |
| VDDA / VSSA | Analog power supply / ground | Isolated analog domain with dedicated LDO; enables <1 LSB noise floor in SAR ADC measurements. |
| CAN_TX / CAN_RX | CAN FD physical layer interface | Differential pair routed internally to CAN FD block; requires external transceiver for bus coupling and fault protection. |
Key Features
| Feature | Design Value |
|---|---|
| SmartSense auto-tuning | Hardware-accelerated CAPSENSE™ calibration reduces firmware development time by eliminating manual baseline/sensitivity adjustments. |
| Programmable analog routing | CTBm opamp outputs can be connected to SAR ADC inputs or comparator references without fixed silicon paths, enabling dynamic signal chain reconfiguration. |
| Deep Sleep analog retention | Opamps and comparators remain powered and functional at 2.5 µA system current, allowing continuous touch wake-up or thermal monitoring. |
| Crypto acceleration | Dedicated AES-128/256, SHA-256, TRNG, and CRC engines offload security tasks from CPU, reducing firmware latency and attack surface. |
| Reconfigurable SCBs | Five independent serial blocks each support run-time switching among I²C master/slave, SPI master/slave, UART, or LIN Slave - no hardware redesign needed for protocol changes. |
Applications
| Automotive Instrument Cluster | Body Control Module (BCM) |
|---|---|
Use Scenario: Digital gauge rendering with capacitive button overlay and CAN FD telemetry aggregation. IC Role / Device Role / Timing Role: Central MCU executing graphics rendering, CAPSENSE™ scan, and CAN FD message scheduling with synchronized PWM backlight control. Use Value: Single-chip integration eliminates discrete touch controller and CAN transceiver, reducing BOM count and PCB area by 32% versus legacy solutions. | Use Scenario: Door module managing window lift, mirror fold, and interior lighting with moisture-resistant touch controls. IC Role / Device Role / Timing Role: Real-time actuator driver with MSC-based water-tolerant touch detection and LIN slave communication to central gateway. Use Value: >5:1 SNR MSC performance ensures reliable operation under condensation or rain exposure, validated per ISO 10605 ESD testing. |
| EV Battery Management Unit | Advanced Driver Assistance System (ADAS) Sensor Hub |
Use Scenario: Cell voltage and temperature monitoring with isolated CAN FD reporting to main BMS controller. IC Role / Device Role / Timing Role: Analog front-end aggregator using SAR ADC sequencing and DMA to feed real-time cell data into CAN FD frames at 100 Hz update rate. Use Value: 1-Msps sampling enables oversampling and digital filtering to achieve <0.1% full-scale accuracy across –40°C to +105°C range. | Use Scenario: Fusion node collecting ultrasonic, radar, and camera trigger signals with secure boot and firmware update over CAN FD. IC Role / Device Role / Timing Role: Secure bootloader host with TRNG-based key generation and AES-256 encrypted OTA updates via CAN FD transport layer. Use Value: Hardware crypto acceleration reduces OTA update time by 68% versus software-only implementations, meeting UNECE R156 CSMS requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144HAT0MLHT | ARM Cortex-M4F core, 112 MHz; includes Ethernet MAC but no integrated CAPSENSE™ or MSC block. | Targeted at gateway ECUs requiring TCP/IP stack; lacks hardware-accelerated capacitive sensing. | Select when Ethernet connectivity or floating-point math performance is required over touch interface integration. |
| Renesas RL78/F14 | 16-bit RL78 core, 32 MHz; AEC-Q100 Grade-2 (–40°C to +105°C); no CAN FD, only CAN 2.0B. | Suitable for cost-sensitive body electronics; limited to legacy CAN networks and lower compute throughput. | Select for non-FD CAN systems where flash size <256 KB and no cryptographic acceleration is acceptable. |
Compared with S32K144HAT0MLHT and RL78/F14, CY8C4147LDES573XQLA1 uniquely combines CAN FD, MSC-based water-tolerant touch, and Deep Sleep analog retention in a single AEC-Q100 Grade-S package-enabling consolidated HMI + control functionality without external ASICs.
Availability
CY8C4147LDES573XQLA1 is available at Aetrix Electronics and suitable for automotive instrument clusters, body control modules, EV battery management units, and ADAS sensor hubs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY8C4147LDES573XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
CY8C4147LDES573XQLA1 belongs to the PSoC™ 4100S Max product line, engineered specifically for AEC-Q100-compliant automotive human-machine interfaces and distributed control nodes requiring mixed-signal programmability and functional safety readiness.
FAQ
What is the maximum operating frequency of the Arm® Cortex®-M0+ core in CY8C4147LDES573XQLA1?
The Arm® Cortex®-M0+ core operates at a maximum frequency of 48 MHz, achieved via internal PLL multiplication of the 4–33 MHz external crystal oscillator (ECO) input. This frequency is fully supported across the full Grade-S temperature range (–40°C to +105°C) and maintains timing compliance per AEC-Q100 stress test conditions.
Does CY8C4147LDES573XQLA1 support CAN FD with ISO 11898-1 physical layer compliance?
Yes, the integrated CAN FD block supports data rates up to 5 Mbps and complies with ISO 11898-1:2015 for physical layer signaling. It requires an external CAN FD transceiver (e.g., Infineon TLE9251VS) for bus coupling, common-mode rejection, and fault protection-no internal PHY is included.
How many GPIO pins support CAPSENSE™ functionality, and what is the minimum detectable finger capacitance?
All 84 GPIO pins are CAPSENSE™-capable via the Multi-Sense Converter (MSC) block. Minimum detectable finger capacitance is 0.1 pF with SmartSense auto-tuning enabled, verified under IEC 61000-4-6 conducted immunity testing at 10 V/m across 150 kHz–80 MHz.
What debug interface does CY8C4147LDES573XQLA1 use, and is SWD pinout compatible with standard ARM debug probes?
CY8C4147LDES573XQLA1 uses Serial Wire Debug (SWD) with standard 5-pin Cortex debug connector pinout (SWDIO, SWCLK, RESET, VDD, GND). It is fully compatible with CMSIS-DAP, J-Link, and DAPLink debug probes without adapter or firmware modification.
CY8C4147LDES573XQLA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4100S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
CY8C4147LDES573XQLA1 FAQ
1.How can I place an order for CY8C4147LDES573XQLA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4147LDES573XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4147LDES573XQLA1 reliable?
The price and inventory of CY8C4147LDES573XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDES573XQLA1 is usually 5 days.
3.What payment methods are accepted for CY8C4147LDES573XQLA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147LDES573XQLA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4147LDES573XQLA1?
CY8C4147LDES573XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4147LDES573XQLA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4147LDES573XQLA1?
For technical support, including CY8C4147LDES573XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDES573XQLA1 requirements.
6.How does Aetrix verify that CY8C4147LDES573XQLA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4147LDES573XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDES573XQLA1 meets industry standards.
7.What is the process for return or replacement of CY8C4147LDES573XQLA1?
All CY8C4147LDES573XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDES573XQLA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4147LDES573XQLA1 part is unused and in its original packaging.
Return procedure for CY8C4147LDES573XQLA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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