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Infineon Technologies CY8C4147LDSS563XQLA1

Part No.:
CY8C4147LDSS563XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4147LDSS563XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,931

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Product details

Overview

CY8C4147LDSS563XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules, door module ECUs, and capacitive touch HMI in automotive interiors.

For engineers reviewing the CY8C4147LDSS563XQLA1 datasheet, CY8C4147LDSS563XQLA1 pinout, CY8C4147LDSS563XQLA1 application, or CY8C4147LDSS563XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), SAR ADC resolution (12-bit, 1 Msps), MSC SNR (>5:1), and GPIO reconfigurability across analog/digital/CAPSENSE™ functions.

Technical Context

The device implements a single-layer AHB-Lite interconnect between Cortex-M0+ core, memory subsystem (384 KB flash + 32 KB SRAM), and programmable peripherals including five SCBs (I²C/SPI/UART/LIN), eight TCPWM blocks, and dual opamps supporting comparator/ADC buffer modes in Deep Sleep. Clocking includes ECO (4–33 MHz) with PLL for 48 MHz system clock and WCO (32 kHz) for RTC.

Analog integration centers on the Multi-Sense Converter (MSC) block enabling high-SNR capacitive sensing with hardware-accelerated SmartSense tuning, alongside a 12-bit SAR ADC with differential input, channel sequencer, and integrated temperature sensor. The CAN FD controller supports ISO 11898-1:2015 with bit rates up to 5 Mbps and flexible data field lengths.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz max - enables real-time deterministic control for automotive body electronics with low interrupt latency.
Flash / SRAM384 KB flash with Read Accelerator / 32 KB SRAM - supports complex firmware with CAPSENSE™ tuning algorithms and CAN FD protocol stack.
CAN FD InterfaceUp to 5 Mbps data rate, ISO 11898-1:2015 compliant - meets high-bandwidth diagnostic and actuator command requirements in modern vehicle networks.
SAR ADC12-bit, 1 Msps, differential mode, integrated temperature sensor - provides accurate sensor monitoring (e.g., cabin temp, battery voltage) without external signal conditioning.
MSC BlockMulti-Sense Converter with >5:1 SNR and SmartSense auto-tuning - delivers robust water-tolerant touch detection on steering wheels or center consoles.
Power ModesDeep Sleep at 2.5 µA digital current with active analog - enables always-on capacitive wake-up while meeting automotive low-power budget constraints.
GPIO CountUp to 84 pins, all reconfigurable as CAPSENSE™/analog/digital - simplifies PCB layout by eliminating dedicated sense pins and enabling dynamic function assignment.

Pinout & Package

Package: 64-pin TQFP (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade molding compound.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™, analog input (SAR ADC), or digital I/O; configurable slew rate and drive strength per pin.
P1[0]–P1[7]Port 1 GPIO bankIncludes dedicated CAN FD TX/RX (P1[2]/P1[3]) and SCB0 I²C SDA/SCL (P1[4]/P1[5]).
P2[0]–P2[7]Port 2 GPIO bankContains TCPWM0 capture/compare outputs and MSC sense electrode connections (P2[0]–P2[3]).
VDDIO0–VDDIO3I/O power domainsFour independent 1.71–5.5 V supplies allow mixed-voltage interface (e.g., 3.3 V MCU core + 5 V sensor bus).
VDDD / VDDADigital/analog core suppliesSeparate 1.71–5.5 V rails decouple noise-sensitive analog blocks (ADC, opamps) from digital switching.
XRESExternal reset inputActive-low asynchronous reset with internal pull-up; compatible with automotive watchdog timer assertion.
SWDCLK / SWDIOARM Serial Wire DebugTwo-pin debug interface supporting non-intrusive firmware update and real-time trace in production ECUs.

Key Features

FeatureDesign Value
Hardware SmartSense tuningAutomatic MSC calibration eliminates manual threshold adjustment during manufacturing and compensates for humidity/temperature drift in-cabin.
Programmable analog CTBm blocksTwo opamps operate in Deep Sleep with <1 µA quiescent current, enabling always-on proximity wake-up without external circuitry.
CAN FD with flexible data lengthSupports payloads up to 64 bytes at 5 Mbps, reducing message count for firmware updates and high-resolution sensor streaming in ADAS-adjacent systems.
Five reconfigurable SCBsEach SCB dynamically switches between I²C (up to 1 Mbps), SPI (up to 24 MHz), UART (up to 2 Mbps), or LIN Slave - reduces BOM count in multi-sensor gateways.
True Random Number Generator (TRNG)FIPS 140-2 compliant entropy source used for secure key generation in TLS handshakes and OTA firmware authentication.

Applications

Door Module ECUSteering Wheel Touch Interface

Use Scenario: Centralized control of window lift, mirror fold, and interior lighting via LIN/CAN communication.

IC Role / Device Role / Timing Role: Main MCU executing motor control PWM (TCPWM), LIN slave protocol (SCB), and capacitive button detection (MSC).

Use Value: Single-chip integration replaces discrete MCU + touch controller + LIN transceiver, reducing board area by 35% and qualification effort.

Use Scenario: Water-resistant touch controls for cruise control and audio functions on leather-wrapped steering wheel.

IC Role / Device Role / Timing Role: CAPSENSE™ master with SmartSense auto-calibration and SAR ADC monitoring wheel temperature for thermal compensation.

Use Value: >5:1 SNR ensures reliable detection under sweat or condensation; Deep Sleep wake-up latency <100 µs meets automotive response time standards.

Body Control Module (BCM)Seat Position Memory System

Use Scenario: Aggregation of door lock status, ambient light, and rain sensor inputs for automatic headlight/wiper activation.

IC Role / Device Role / Timing Role: Sensor hub with 12-bit SAR ADC (light sensor), LP comparators (rain detection), and CAN FD for gateway communication.

Use Value: Integrated analog front-end eliminates external opamp/comparator ICs; 2.5 µA Deep Sleep extends battery life during vehicle park mode.

Use Scenario: Precise linear position feedback from seat track potentiometers and memory recall via CAN FD.

IC Role / Device Role / Timing Role: Analog acquisition node with differential SAR ADC (12-bit, 1 Msps) and CAN FD transmitter for position data streaming.

Use Value: Differential ADC mode rejects common-mode noise from 12 V motor drives; 5 Mbps CAN FD enables sub-10 ms position sync across multiple seats.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WARM Cortex-M4F core, 112 MHz; includes Ethernet MAC but no integrated CAPSENSE™ or MSC block.Targeted at higher-performance gateway/ADAS edge nodes; requires external touch controller for capacitive HMI.Select when floating-point math or Ethernet connectivity is required; avoid if CAPSENSE™ integration and low-power touch are primary goals.
Renesas RL78/F1416-bit RL78 core, 32 MHz; AEC-Q100 Grade 2 (–40°C to +105°C); no CAN FD support (CAN 2.0 only).Cost-optimized for basic body control; lacks hardware-accelerated touch tuning and high-speed CAN diagnostics.Select for legacy CAN 2.0 designs with tight cost targets; avoid for new CAN FD architectures or advanced HMI.

Compared with S32K144W and RL78/F14, CY8C4147LDSS563XQLA1 uniquely combines CAN FD, hardware SmartSense, and Deep Sleep analog operation in a single AEC-Q100 Grade-S package-making it optimal for next-gen automotive touch interfaces where integration, power, and signal integrity are co-constrained.

Availability

CY8C4147LDSS563XQLA1 is available at Aetrix Electronics and suitable for automotive body control modules, steering wheel HMI systems, and seat position memory controllers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for CY8C4147LDSS563XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and wafer fabrication facilities.

CY8C4147LDSS563XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive human-machine interfaces requiring integrated capacitive sensing, CAN FD communication, and ultra-low-power operation.

FAQ

What is the maximum operating temperature range for CY8C4147LDSS563XQLA1?

CY8C4147LDSS563XQLA1 is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C. This rating is verified per test condition HTOL (High-Temperature Operating Life) and TC (Temperature Cycling), making it suitable for under-hood and cabin-mounted automotive ECUs where ambient heat exceeds consumer-grade limits.

Does this part include hardware-based cryptographic acceleration?

Yes. CY8C4147LDSS563XQLA1 integrates a dedicated Crypto block supporting AES-128/256 encryption/decryption, SHA-1/224/256 hashing, CRC-32, TRNG, and PRNG. These accelerators offload CPU cycles during TLS handshake, secure boot verification, and OTA firmware signature validation-critical for ISO/SAE 21434-compliant automotive software updates.

Can the MSC block support mutual-capacitance touch sensing?

Yes. The Multi-Sense Converter (MSC) block supports both self-capacitance and mutual-capacitance topologies. Mutual-capacitance mode enables true multi-touch gesture recognition (e.g., pinch-to-zoom on center console displays) with hardware-accelerated baseline tracking and SmartSense auto-tuning-eliminating need for external touch controller ICs.

Is SWD debugging supported in Deep Sleep mode?

No. SWDCLK and SWDIO are disabled during Deep Sleep to achieve 2.5 µA system current. Debug access requires waking to Active or Sleep mode. However, the device supports non-intrusive trace via MTB (Micro Trace Buffer) in Sleep mode, allowing post-mortem analysis of wake-up sources and peripheral activity without halting execution.

CY8C4147LDSS563XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4147LDSS563XQLA1 FAQ

1.How can I place an order for CY8C4147LDSS563XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4147LDSS563XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4147LDSS563XQLA1 reliable?

The price and inventory of CY8C4147LDSS563XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDSS563XQLA1 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147LDSS563XQLA1 transactions.

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CY8C4147LDSS563XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4147LDSS563XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4147LDSS563XQLA1?

For technical support, including CY8C4147LDSS563XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDSS563XQLA1 requirements.

6.How does Aetrix verify that CY8C4147LDSS563XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147LDSS563XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDSS563XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147LDSS563XQLA1?

All CY8C4147LDSS563XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDSS563XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147LDSS563XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147LDSS563XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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