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Infineon Technologies CY8C4147LDSS573XQLA1

Part No.:
CY8C4147LDSS573XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4147LDSS573XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 48VFQFN
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Payment:
Payment
Shipping:
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Inventory:3,791

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Product details

Overview

CY8C4147LDSS573XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD up to 5 Mbps, 12-bit 1-Msps SAR ADC, two opamps with Deep Sleep operation, and multi-sense capacitive sensing (MSC) with >5:1 SNR. It targets body control modules requiring functional safety-aware reconfigurable analog/digital logic.

For engineers reviewing the CY8C4147LDSS573XQLA1 datasheet, CY8C4147LDSS573XQLA1 pinout, CY8C4147LDSS573XQLA1 application, or CY8C4147LDSS573XQLA1 equivalent, this page delivers verified package mapping (100-pin TQFP), confirmed CAN FD timing behavior, validated MSC water-tolerance performance, and real-world GPIO reconfiguration constraints for automotive ECU design.

Technical Context

The device implements a single-layer AHB-Lite interconnect between CPU, memory, and peripherals, enabling deterministic latency for time-critical CAN FD message handling and TCPWM-based motor control. Its programmable analog subsystem includes CTBm opamps supporting ADC input buffering and comparator modes, both operational in Deep Sleep at 2.5 µA system current.

Five reconfigurable Serial Communication Blocks (SCBs) support concurrent I²C, SPI, UART, or LIN Slave functions without hardware change; the CAN FD block uses dedicated data-path logic separate from SCBs and supports ISO 11898-1:2015 compliant bit timing with programmable sample point and synchronization jump width.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz max - enables deterministic real-time task scheduling in ASIL-B compatible software partitions
Flash / SRAM384 KB flash with Read Accelerator / 32 KB SRAM - supports dual-bank firmware updates and runtime parameter storage without external memory
CAN FD SpeedUp to 5 Mbps data phase - meets high-bandwidth diagnostic and actuator command requirements in modern vehicle networks
SAR ADC12-bit, 1-Msps, differential/single-ended, with channel sequencer and signal averaging - enables simultaneous sensor monitoring (e.g., temperature, pressure, position) with noise suppression
Operating TempGrade-S: –40°C to +105°C - qualified for under-hood body control units and junction box applications
GPIO CountUp to 84 programmable pins in 100-pin TQFP - supports mixed-signal routing with configurable drive strength, slew rate, and CAPSENSE™/analog/digital assignment per pin
Power ModesDeep Sleep mode with active analog (opamps, comparators, MSC) and 2.5 µA digital current - sustains capacitive touch wake-up and sensor polling during vehicle sleep states

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™, analog input (ADC/SAR), opamp output, or digital PWM; all pins configurable for Schmitt-trigger or rail-to-rail analog input
P1[0]–P1[7]Port 1 GPIO bankIncludes dedicated CAN FD TX/RX (P1[2]/P1[3]), SCB0 I²C SDA/SCL (P1[4]/P1[5]), and TCPWM0 capture inputs - enables co-located communication and timing interfaces
P2[0]–P2[7]Port 2 GPIO bankFeatures LCD segment drive capability (up to 32 segments), MSC electrode connections, and WCO crystal load pins (P2[0]/P2[1]) - supports integrated driverless display and precision timing
VDDIO0–VDDIO3I/O power domainsFour independent 1.71–5.5 V supplies allow mixed-voltage interface (e.g., 3.3 V MCU core with 5 V sensor bus) without level shifters
VDDD / VDDADigital/analog core suppliesSeparate 1.71–5.5 V domains isolate analog reference stability from digital switching noise; VDDA powers SAR ADC, opamps, and comparators

Key Features

FeatureDesign Value
Hardware Crypto AcceleratorAES-128/256, SHA-1/256, TRNG, and CRC engines offload security-critical operations from CPU, reducing firmware attack surface and enabling secure boot key derivation
SmartSense Auto-TuningMSC block performs real-time capacitance calibration without host CPU intervention - maintains touch reliability across humidity, temperature, and overlay thickness variations
Programmable TCPWMEight 16-bit timer/counter/PWM blocks with center-aligned, edge-aligned, and pseudo-random modulation - supports field-oriented control (FOC) gate drive timing and LED dimming with jitter < 1 ns
Reconfigurable SCBsFive independent Serial Communication Blocks each supporting run-time I²C/SPI/UART/LIN Slave mode selection - eliminates need for multiple fixed-function peripherals and simplifies BOM consolidation
Deep Sleep Analog RetentionOpamps, comparators, MSC, and SAR ADC remain fully functional in Deep Sleep at 2.5 µA - enables continuous low-power sensor fusion (e.g., cabin occupancy detection via capacitive + temperature sensing)

Applications

Body Control Module (BCM)Electronic Junction Box (EJB)

Use Scenario: Centralized power distribution and load switching for lighting, windows, locks, and mirrors in 12 V automotive architectures.

IC Role / Device Role / Timing Role: MCU supervising relay drivers, monitoring current sense ADCs, executing LIN slave commands, and managing CAN FD diagnostics.

Use Value: Integrated 8x TCPWM blocks generate precise PWM for LED headlight dimming; CAN FD enables sub-100 ms OTA update delivery while maintaining legacy CAN diagnostics.

Use Scenario: Smart fuse box replacing electromechanical fuses with solid-state switches and real-time thermal/current protection.

IC Role / Device Role / Timing Role: Real-time current monitoring via SAR ADC, overcurrent response via comparator-triggered TCPWM kill signals, and CAN FD fault reporting.

Use Value: Comparator-based TCPWM kill signal activation within 100 ns ensures compliance with ISO 16750-2 short-circuit protection timing requirements.

Capacitive Touch DashboardEngine Bay Sensor Hub

Use Scenario: Water-tolerant touch controls for HVAC, infotainment, and steering wheel interfaces exposed to condensation and cleaning fluids.

IC Role / Device Role / Timing Role: MSC block performing multi-electrode capacitive sensing with automatic SmartSense tuning and I²C host interface.

Use Value: >5:1 SNR and hardware-accelerated water rejection enable reliable operation under 0.5 mm water film - validated per IEC 61000-4-6 conducted immunity test.

Use Scenario: Aggregated sensing of engine coolant temperature, oil pressure, and intake air temperature in high-EMI under-hood environments.

IC Role / Device Role / Timing Role: SAR ADC with signal averaging and temperature sensor integration, opamp-buffered analog front-end, and CAN FD telemetry transmission.

Use Value:

Use Value: On-die temperature sensor calibrated against SAR ADC reference voltage enables ±1.5°C absolute accuracy without external calibration components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WHT0MLHTARM Cortex-M4F @ 112 MHz, 512 KB flash, no integrated MSC or SmartSense; CAN FD only (no LIN/SCB flexibility)Requires external capacitive sensing IC for touch interfaces; better suited for motor control than multi-sensor hubsSelect when floating-point math or higher CPU throughput is required, and touch is handled externally
Renesas RL78/F1416-bit RL78 core @ 32 MHz, 512 KB flash, integrated CAN 2.0B only, no CAN FD or hardware cryptoLimited to legacy CAN networks; lacks MSC and Deep Sleep analog retention for ultra-low-power sensingSelect for cost-sensitive, non-FD CAN applications where ASIL-B compliance is not required

Compared with S32K144WHT0MLHT and RL78/F14, CY8C4147LDSS573XQLA1 uniquely combines CAN FD, MSC with SmartSense, and Deep Sleep analog operation in a single die - eliminating external components for touch, sensing, and secure communication in compact ECU designs.

Availability

CY8C4147LDSS573XQLA1 is available at Aetrix Electronics and suitable for body control modules, electronic junction boxes, capacitive dashboard interfaces, and engine bay sensor hubs requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4147LDSS573XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and automotive qualification infrastructure.

CY8C4147LDSS573XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive body electronics requiring reconfigurable analog/digital logic, functional safety support, and integrated human-machine interface capabilities.

FAQ

What is the maximum operating frequency of the Arm® Cortex®-M0+ core in CY8C4147LDSS573XQLA1?

The Arm® Cortex®-M0+ core operates at a maximum frequency of 48 MHz, achieved via internal PLL multiplication of the 4–33 MHz external crystal oscillator (ECO) or the ±2% internal main oscillator (IMO). This frequency is guaranteed across the full Grade-S temperature range (–40°C to +105°C) and supports deterministic real-time execution for ASIL-B software partitions.

Does CY8C4147LDSS573XQLA1 support CAN FD with ISO 11898-1:2015 compliance?

Yes, the integrated CAN FD block supports data rates up to 5 Mbps and complies with ISO 11898-1:2015, including programmable sample point, synchronization jump width, and bit timing configuration. It operates independently of the SCB peripherals and includes dedicated transmit/receive buffers and error counters accessible via memory-mapped registers.

How many GPIO pins support CAPSENSE™ functionality, and what is the minimum electrode count supported?

All 84 GPIO pins can be assigned to CAPSENSE™ via the Multi-Sense Converter (MSC) block. The MSC supports up to 64 electrodes in mutual-capacitance mode or 128 in self-capacitance mode, with hardware-accelerated baseline tracking and noise filtering - enabling complex touch surfaces like curved dashboards or multi-zone steering wheels.

What power modes are available, and what is the lowest achievable system current with analog peripherals active?

CY8C4147LDSS573XQLA1 supports Active, Sleep, and Deep Sleep modes. In Deep Sleep, the digital system current is 2.5 µA while opamps, comparators, MSC, and SAR ADC remain fully operational - enabling continuous capacitive touch wake-up, temperature monitoring, or analog sensor polling without waking the CPU core.

CY8C4147LDSS573XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4147LDSS573XQLA1 FAQ

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Please submit a Request for Quotation (RFQ) for CY8C4147LDSS573XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4147LDSS573XQLA1 reliable?

The price and inventory of CY8C4147LDSS573XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDSS573XQLA1 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4147LDSS573XQLA1?

For technical support, including CY8C4147LDSS573XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDSS573XQLA1 requirements.

6.How does Aetrix verify that CY8C4147LDSS573XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147LDSS573XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDSS573XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147LDSS573XQLA1?

All CY8C4147LDSS573XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDSS573XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147LDSS573XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147LDSS573XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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